Reliable Low-Power High Performance Spintronic Memories

Moores Gesetz folgend, ist es der Chipindustrie in den letzten fünf Jahrzehnten gelungen, ein explosionsartiges Wachstum zu erreichen. Dies hatte ebenso einen exponentiellen Anstieg der Nachfrage von Speicherkomponenten zur Folge, was wiederum zu speicherlastigen Chips in den heutigen Computersystemen führt. Allerdings stellen traditionelle on-Chip Speichertech- nologien wie Static Random Access Memories (SRAMs), Dynamic Random Access Memories (DRAMs) und Flip-Flops eine Herausforderung in Bezug auf Skalierbarkeit, Verlustleistung und Zuverlässigkeit dar. Eben jene Herausforderungen und die überwältigende Nachfrage nach höherer Performanz und Integrationsdichte des on-Chip Speichers motivieren Forscher, nach neuen nichtflüchtigen Speichertechnologien zu suchen. Aufkommende spintronische Spe- ichertechnologien wie Spin Orbit Torque (SOT) und Spin Transfer Torque (STT) erhielten in den letzten Jahren eine hohe Aufmerksamkeit, da sie eine Reihe an Vorteilen bieten. Dazu gehören Nichtflüchtigkeit, Skalierbarkeit, hohe Beständigkeit, CMOS Kompatibilität und Unan- fälligkeit gegenüber Soft-Errors. In der Spintronik repräsentiert der Spin eines Elektrons dessen Information. Das Datum wird durch die Höhe des Widerstandes gespeichert, welche sich durch das Anlegen eines polarisierten Stroms an das Speichermedium verändern lässt. Das Prob- lem der statischen Leistung gehen die Speichergeräte sowohl durch deren verlustleistungsfreie Eigenschaft, als auch durch ihr Standard- Aus/Sofort-Ein Verhalten an. Nichtsdestotrotz sind noch andere Probleme, wie die hohe Zugriffslatenz und die Energieaufnahme zu lösen, bevor sie eine verbreitete Anwendung finden können. Um diesen Problemen gerecht zu werden, sind neue Computerparadigmen, -architekturen und -entwurfsphilosophien notwendig. Die hohe Zugriffslatenz der Spintroniktechnologie ist auf eine vergleichsweise lange Schalt- dauer zurückzuführen, welche die von konventionellem SRAM übersteigt. Des Weiteren ist auf Grund des stochastischen Schaltvorgangs der Speicherzelle und des Einflusses der Prozessvari- ation ein nicht zu vernachlässigender Zeitraum dafür erforderlich. In diesem Zeitraum wird ein konstanter Schreibstrom durch die Bitzelle geleitet, um den Schaltvorgang zu gewährleisten. Dieser Vorgang verursacht eine hohe Energieaufnahme. Für die Leseoperation wird gleicher- maßen ein beachtliches Zeitfenster benötigt, ebenfalls bedingt durch den Einfluss der Prozess- variation. Dem gegenüber stehen diverse Zuverlässigkeitsprobleme. Dazu gehören unter An- derem die Leseintereferenz und andere Degenerationspobleme, wie das des Time Dependent Di- electric Breakdowns (TDDB). Diese Zuverlässigkeitsprobleme sind wiederum auf die benötigten längeren Schaltzeiten zurückzuführen, welche in der Folge auch einen über längere Zeit an- liegenden Lese- bzw. Schreibstrom implizieren. Es ist daher notwendig, sowohl die Energie, als auch die Latenz zur Steigerung der Zuverlässigkeit zu reduzieren, um daraus einen potenziellen Kandidaten für ein on-Chip Speichersystem zu machen. In dieser Dissertation werden wir Entwurfsstrategien vorstellen, welche das Ziel verfolgen, die Herausforderungen des Cache-, Register- und Flip-Flop-Entwurfs anzugehen. Dies erre- ichen wir unter Zuhilfenahme eines Cross-Layer Ansatzes. Für Caches entwickelten wir ver- schiedene Ansätze auf Schaltkreisebene, welche sowohl auf der Speicherarchitekturebene, als auch auf der Systemebene in Bezug auf Energieaufnahme, Performanzsteigerung und Zuver- lässigkeitverbesserung evaluiert werden. Wir entwickeln eine Selbstabschalttechnik, sowohl für die Lese-, als auch die Schreiboperation von Caches. Diese ist in der Lage, den Abschluss der entsprechenden Operation dynamisch zu ermitteln. Nachdem der Abschluss erkannt wurde, wird die Lese- bzw. Schreiboperation sofort gestoppt, um Energie zu sparen. Zusätzlich limitiert die Selbstabschalttechnik die Dauer des Stromflusses durch die Speicherzelle, was wiederum das Auftreten von TDDB und Leseinterferenz bei Schreib- bzw. Leseoperationen re- duziert. Zur Verbesserung der Schreiblatenz heben wir den Schreibstrom an der Bitzelle an, um den magnetischen Schaltprozess zu beschleunigen. Um registerbankspezifische Anforderungen zu berücksichtigen, haben wir zusätzlich eine Multiport-Speicherarchitektur entworfen, welche eine einzigartige Eigenschaft der SOT-Zelle ausnutzt, um simultan Lese- und Schreiboperatio- nen auszuführen. Es ist daher möglich Lese/Schreib- Konfilkte auf Bitzellen-Ebene zu lösen, was sich wiederum in einer sehr viel einfacheren Multiport- Registerbankarchitektur nieder- schlägt. Zusätzlich zu den Speicheransätzen haben wir ebenfalls zwei Flip-Flop-Architekturen vorgestellt. Die erste ist eine nichtflüchtige non-Shadow Flip-Flop-Architektur, welche die Speicherzelle als aktive Komponente nutzt. Dies ermöglicht das sofortige An- und Ausschalten der Versorgungss- pannung und ist daher besonders gut für aggressives Powergating geeignet. Alles in Allem zeigt der vorgestellte Flip-Flop-Entwurf eine ähnliche Timing-Charakteristik wie die konventioneller CMOS Flip-Flops auf. Jedoch erlaubt er zur selben Zeit eine signifikante Reduktion der statis- chen Leistungsaufnahme im Vergleich zu nichtflüchtigen Shadow- Flip-Flops. Die zweite ist eine fehlertolerante Flip-Flop-Architektur, welche sich unanfällig gegenüber diversen Defekten und Fehlern verhält. Die Leistungsfähigkeit aller vorgestellten Techniken wird durch ausführliche Simulationen auf Schaltkreisebene verdeutlicht, welche weiter durch detaillierte Evaluationen auf Systemebene untermauert werden. Im Allgemeinen konnten wir verschiedene Techniken en- twickeln, die erhebliche Verbesserungen in Bezug auf Performanz, Energie und Zuverlässigkeit von spintronischen on-Chip Speichern, wie Caches, Register und Flip-Flops erreichen

Modélisation compacte et conception de circuit à base de jonction tunnel ferroélectrique et de jonction tunnel magnétique exploitant le transfert de spin assisté par effet Hall de spin

Non-volatile memory (NVM) devices have been attracting intensive research interest since they promise to solve the increasing static power issue caused by CMOS technology scaling. This thesis focuses on two fields related to NVM: the one is the ferroelectric tunnel junction (FTJ), which is a recent emerging NVM device. The other is the spin-Hall-assisted spin-transfer torque (STT), which is a recent proposed write approach for the magnetic tunnel junction (MTJ). Our objective is to develop the compact models for these two technologies and to explore their application in the non-volatile circuits through simulation.First, we investigated physical models describing the electrical behaviors of the FTJ such as tunneling resistance, dynamic ferroelectric switching and memristive response. The accuracy of these physical models is validated by a good agreement with experimental results. In order to develop an electrical model available for the circuit simulation, we programmed the aforementioned physical models with Verilog-A language and integrated them together. The developed electrical model can run on Cadence platform (a standard circuit simulation tool) and faithfully reproduce the behaviors of the FTJ.Then, using the developed FTJ model and STMicroelectronics CMOS design kit, we designed and simulated three types of circuits: i) FTJ-based random access memory (FTRAM), ii) two FTJ-based neuromorphic systems, one of which emulates spike-timing dependent plasticity (STDP) learning rule, the other implements supervised learning of logic functions, iii) FTJ-based Boolean logic block, by which NAND and NOR logic are demonstrated. The influences of the FTJ parameters on the performance of these circuits were analyzed based on simulation results.Finally, we focused on the reversal of the perpendicular magnetization driven by spin-Hall-assisted STT in a three-terminal MTJ. In this scheme, two write currents are applied to generate spin-Hall effect (SHE) and STT. Numerical simulation based on Landau-Lifshitz-Gilbert (LLG) equation demonstrates that the incubation delay of the STT can be eliminated by the strong SHE, resulting in ultrafast magnetization switching without the need to strengthen the STT. We applied this novel write approach to the design of the magnetic flip-flop and full-adder. Performance comparison between the spin-Hall-assisted and the conventional STT magnetic circuits were discussed based on simulation results and theoretical models.Les mémoires non-volatiles (MNV) sont l'objet d'un effort de recherche croissant du fait de leur capacité à limiter la consommation statique, qui obère habituellement la réduction des dimensions dans la technologie CMOS. Dans ce contexte, cette thèse aborde plus spécifiquement deux technologies de mémoires non volatiles : d'une part les jonctions tunnel ferroélectriques (JTF), dispositif non volatil émergent, et d'autre part les dispositifs à transfert de spin (TS) assisté par effet Hall de spin (EHS), approche alternative proposée récemment pour écrire les jonctions tunnel magnétiques (JTM). Mon objectif est de développer des modèles compacts pour ces deux technologies et d'explorer, par simulation, leur intégration dans les circuits non-volatiles.J'ai d'abord étudié les modèles physiques qui décrivent les comportements électriques des JTF : la résistance tunnel, la dynamique de la commutation ferroélectrique et leur comportement memristif. La précision de ces modèles physiques est validée par leur bonne adéquation avec les résultats expérimentaux. Afin de proposer un modèle compatible avec les simulateurs électriques standards, nous j'ai développé les modèles physiques mentionnés ci-dessus en langue Verilog-A, puis je les ai intégrés ensemble. Le modèle électrique que j'ai conçu peut être exploité sur la plate-forme Cadence (un outil standard pour la simulation de circuit). Il reproduit fidèlement les comportements de JTF. Ensuite, en utilisant ce modèle de JTF et le design-kit CMOS de STMicroelectronics, j'ai conçu et simulé trois types de circuits: i) une mémoire vive (RAM) basée sur les JTF, ii) deux systèmes neuromorphiques basés sur les JTF, l'un qui émule la règle d'apprentissage de la plasticité synaptique basée sur le décalage temporel des impulsions neuronale (STDP), l'autre mettant en œuvre l'apprentissage supervisé de fonctions logiques, iii) un bloc logique booléen basé sur les JTF, y compris la démonstration des fonctions logiques NAND et NOR. L'influence des paramètres de la JTF sur les performances de ces circuits a été analysée par simulation. Finalement, nous avons modélisé la dynamique de renversement de l'aimantation dans les dispositifs à anisotropie perpendiculaire à transfert de spin assisté par effet Hall de spin dans un JTM à trois terminaux. Dans ce schéma, deux courants d'écriture sont appliqués pour générer l'EHS et le TS. La simulation numérique basée sur l'équation de Landau-Lifshitz-Gilbert (LLG) démontre que le délai d'incubation de TS peut être éliminé par un fort EHS, conduisant à la commutation ultra-rapide de l'aimantation, sans pour autant requérir une augmentation excessive du TS. Nous avons appliqué cette nouvelle méthode d'écriture à la conception d'une bascule magnétique et d'un additionneur 1 bit magnétique. Les performances des circuits magnétiques assistés par l'EHS ont été comparés à ceux écrits par transfert de spin, par simulation et par une analyse fondée sur le modèle théorique

Normally-Off Computing Design Methodology Using Spintronics: From Devices to Architectures

Energy-harvesting-powered computing offers intriguing and vast opportunities to dramatically transform the landscape of Internet of Things (IoT) devices and wireless sensor networks by utilizing ambient sources of light, thermal, kinetic, and electromagnetic energy to achieve battery-free computing. In order to operate within the restricted energy capacity and intermittency profile of battery-free operation, it is proposed to innovate Elastic Intermittent Computation (EIC) as a new duty-cycle-variable computing approach leveraging the non-volatility inherent in post-CMOS switching devices. The foundations of EIC will be advanced from the ground up by extending Spin Hall Effect Magnetic Tunnel Junction (SHE-MTJ) device models to realize SHE-MTJ-based Majority Gate (MG) and Polymorphic Gate (PG) logic approaches and libraries, that leverage intrinsic-non-volatility to realize middleware-coherent, intermittent computation without checkpointing, micro-tasking, or software bloat and energy overheads vital to IoT. Device-level EIC research concentrates on encapsulating SHE-MTJ behavior with a compact model to leverage the non-volatility of the device for intrinsic provision of intermittent computation and lifetime energy reduction. Based on this model, the circuit-level EIC contributions will entail the design, simulation, and analysis of PG-based spintronic logic which is adaptable at the gate-level to support variable duty cycle execution that is robust to brief and extended supply outages or unscheduled dropouts, and development of spin-based research synthesis and optimization routines compatible with existing commercial toolchains. These tools will be employed to design a hybrid post-CMOS processing unit utilizing pipelining and power-gating through state-holding properties within the datapath itself, thus eliminating checkpointing and data transfer operations

Non-volatile FPGA architecture using resistive switching devices

This dissertation reports the research work that was conducted to propose a non-volatile architecture for FPGA using resistive switching devices. This is achieved by designing a Configurable Memristive Logic Block (CMLB). The CMLB comprises of memristive logic cells (MLC) interconnected to each other using memristive switch matrices. In the MLC, novel memristive D flip-flop (MDFF), 6-bit non-volatile look-up table (NVLUT), and CMOS-based multiplexers are used. Other than the MDFF, a non-volatile D-latch (NVDL) was also designed. The MDFF and the NVDL are proposed to replace CMOS-based D flip-flops and D-latches to improve energy consumption. The CMLB shows a reduction of 8.6% of device area and 1.094 times lesser critical path delay against the SRAM-based FPGA architecture. Against similar CMOS-based circuits, the MDFF provides switching speed of 1.08 times faster; the NVLUT reduces power consumption by 6.25nW and improves device area by 128 transistors; while the memristive logic cells reduce overall device area by 60.416μm2. The NVLUT is constructed using novel 2TG1M memory cells, which has the fastest switching times of 12.14ns, compared to other similar memristive memory cells. This is due to the usage of transmission gates which improves voltage transfer from input to the memristor. The novel 2TG1M memory cell also has lower energy consumption than the CMOS-based 6T SRAM cell. The memristive-based switch matrices that interconnects the MLCs together comprises of novel 7T1M SRAM cells, which has the lowest energy-delay-area-product value of 1.61 among other memristive SRAM cells. Two memristive logic gates (MLG) were also designed (OR and AND), that introduces non-volatility into conventional logic gates. All the above circuits and design simulations were performed on an enhanced SPICE memristor model, which was improved from a previously published memristor model. The previously published memristor model was fault to not be in good agreement with memristor theory and the physical model of memristors. Therefore, the enhanced SPICE memristor model provides a memristor model which is in good agreement with the memristor theory and the physical model of memristors, which is used throughout this research work

Non-volatile FPGA architecture using resistive switching devices

This dissertation reports the research work that was conducted to propose a non-volatile architecture for FPGA using resistive switching devices. This is achieved by designing a Configurable Memristive Logic Block (CMLB). The CMLB comprises of memristive logic cells (MLC) interconnected to each other using memristive switch matrices. In the MLC, novel memristive D flip-flop (MDFF), 6-bit non-volatile look-up table (NVLUT), and CMOS-based multiplexers are used. Other than the MDFF, a non-volatile D-latch (NVDL) was also designed. The MDFF and the NVDL are proposed to replace CMOS-based D flip-flops and D-latches to improve energy consumption. The CMLB shows a reduction of 8.6% of device area and 1.094 times lesser critical path delay against the SRAM-based FPGA architecture. Against similar CMOS-based circuits, the MDFF provides switching speed of 1.08 times faster; the NVLUT reduces power consumption by 6.25nW and improves device area by 128 transistors; while the memristive logic cells reduce overall device area by 60.416μm2. The NVLUT is constructed using novel 2TG1M memory cells, which has the fastest switching times of 12.14ns, compared to other similar memristive memory cells. This is due to the usage of transmission gates which improves voltage transfer from input to the memristor. The novel 2TG1M memory cell also has lower energy consumption than the CMOS-based 6T SRAM cell. The memristive-based switch matrices that interconnects the MLCs together comprises of novel 7T1M SRAM cells, which has the lowest energy-delay-area-product value of 1.61 among other memristive SRAM cells. Two memristive logic gates (MLG) were also designed (OR and AND), that introduces non-volatility into conventional logic gates. All the above circuits and design simulations were performed on an enhanced SPICE memristor model, which was improved from a previously published memristor model. The previously published memristor model was fault to not be in good agreement with memristor theory and the physical model of memristors. Therefore, the enhanced SPICE memristor model provides a memristor model which is in good agreement with the memristor theory and the physical model of memristors, which is used throughout this research work

A PUF based Lightweight Hardware Security Architecture for IoT

With an increasing number of hand-held electronics, gadgets, and other smart devices, data is present in a large number of platforms, thereby increasing the risk of security, privacy, and safety breach than ever before. Due to the extreme lightweight nature of these devices, commonly referred to as IoT or `Internet of Things\u27, providing any kind of security is prohibitive due to high overhead associated with any traditional and mathematically robust cryptographic techniques. Therefore, researchers have searched for alternative intuitive solutions for such devices. Hardware security, unlike traditional cryptography, can provide unique device-specific security solutions with little overhead, address vulnerability in hardware and, therefore, are attractive in this domain. As Moore\u27s law is almost at its end, different emerging devices are being explored more by researchers as they present opportunities to build better application-specific devices along with their challenges compared to CMOS technology. In this work, we have proposed emerging nanotechnology-based hardware security as a security solution for resource constrained IoT domain. Specifically, we have built two hardware security primitives i.e. physical unclonable function (PUF) and true random number generator (TRNG) and used these components as part of a security protocol proposed in this work as well. Both PUF and TRNG are built from metal-oxide memristors, an emerging nanoscale device and are generally lightweight compared to their CMOS counterparts in terms of area, power, and delay. Design challenges associated with designing these hardware security primitives and with memristive devices are properly addressed. Finally, a complete security protocol is proposed where all of these different pieces come together to provide a practical, robust, and device-specific security for resource-limited IoT systems

LOW POWER CIRCUITS DESIGN USING RESISTIVE NON-VOLATILE MEMORIES

Ph.DDOCTOR OF PHILOSOPH

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Nouvelles Architectures Hybrides (Logique / Mémoires Non-Volatiles et technologies associées.)

Les nouvelles approches de technologies mémoires permettront une intégration dite back-end, où les cellules élémentaires de stockage seront fabriquées lors des dernières étapes de réalisation à grande échelle du circuit. Ces approches innovantes sont souvent basées sur l'utilisation de matériaux actifs présentant deux états de résistance distincts. Le passage d'un état à l'autre est contrôlé en courant ou en tension donnant lieu à une caractéristique I-V hystérétique. Nos mémoires résistives sont composées d'argent en métal électrochimiquement actif et de sulfure amorphe agissant comme électrolyte. Leur fonctionnement repose sur la formation réversible et la dissolution d'un filament conducteur. Le potentiel d'application de ces nouveaux dispositifs n'est pas limité aux mémoires ultra-haute densité mais aussi aux circuits embarqués. En empilant ces mémoires dans la troisième dimension au niveau des interconnections des circuits logiques CMOS, de nouvelles architectures hybrides et innovantes deviennent possibles. Il serait alors envisageable d'exploiter un fonctionnement à basse énergie, à haute vitesse d'écriture/lecture et de haute performance telles que l'endurance et la rétention. Dans cette thèse, en se concentrant sur les aspects de la technologie de mémoire en vue de développer de nouvelles architectures, l'introduction d'une fonctionnalité non-volatile au niveau logique est démontrée par trois circuits hybrides: commutateurs de routage non volatiles dans un Field Programmable Gate Arrays, un 6T-SRAM non volatile, et les neurones stochastiques pour un réseau neuronal. Pour améliorer les solutions existantes, les limitations de la performances des dispositifs mémoires sont identifiés et résolus avec des nouveaux empilements ou en fournissant des défauts de circuits tolérants.Novel approaches in the field of memory technology should enable backend integration, where individual storage nodes will be fabricated during the last fabrication steps of the VLSI circuit. In this case, memory operation is often based upon the use of active materials with resistive switching properties. A topology of resistive memory consists of silver as electrochemically active metal and amorphous sulfide acting as electrolyte and relies on the reversible formation and dissolution of a conductive filament. The application potential of these new memories is not limited to stand-alone (ultra-high density), but is also suitable for embedded applications. By stacking these memories in the third dimension at the interconnection level of CMOS logic, new ultra-scalable hybrid architectures becomes possible which exploit low energy operation, fast write/read access and high performance with respect to endurance and retention. In this thesis, focusing on memory technology aspects in view of developing new architectures, the introduction of non-volatile functionality at the logic level is demonstrated through three hybrid (CMOS logic ReRAM devices) circuits: nonvolatile routing switches in a Field Programmable Gate Array, nonvolatile 6T-SRAMs, and stochastic neurons of an hardware neural network. To be competitive or even improve existing solutions, limitations on the memory devices performances are identified and solved by stack engineering of CBRAM devices or providing faults tolerant circuits.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Low Power Memory/Memristor Devices and Systems

This reprint focusses on achieving low-power computation using memristive devices. The topic was designed as a convenient reference point: it contains a mix of techniques starting from the fundamental manufacturing of memristive devices all the way to applications such as physically unclonable functions, and also covers perspectives on, e.g., in-memory computing, which is inextricably linked with emerging memory devices such as memristors. Finally, the reprint contains a few articles representing how other communities (from typical CMOS design to photonics) are fighting on their own fronts in the quest towards low-power computation, as a comparison with the memristor literature. We hope that readers will enjoy discovering the articles within