Reducing jitter utilising adaptive pre-emphasis FIR filter for high speed serial links

Jitter requirements have become more stringent with higher speed serial communication links. Reducing jitter, with the main focus on reducing data dependant jitter (DDJ), is presented by employing adaptive finite impulse response (FIR) filter pre-emphasis. The adaptive FIR pre-emphasis is implemented in the IBM 7WL 0.18 µm SiGe BiCMOS process. SiGe heterojunction bipolar transistors (HBTs) provide high bandwidth, low noise devices which could reduce the total system jitter. The trade-offs between utilising metal oxide semiconductor (MOS) current mode logic (CML) and SiGe bipolar CML are also discussed in comparison with a very high fT (IBM 8HP process with fT = 200 GHz) process. A reduction in total system jitter can be achieved by keeping the sub-components of the system jitter constant while optimising the DDJ. High speed CML circuits have been employed to allow data rates in excess of 5 Gb/s to be transmitted whilst still maintaining an internal voltage swing of at least 300 mV. This allows the final FIR filter adaptation scheme to minimise the DDJ within 12.5 % of a unit interval, at a data rate of 5 Gb/s implementing 6 FIR pre-emphasis filter taps, for a worst case copper backplane channel (30" FR-4 channel). The implemented integrated circuit (IC) designed as part of the verification process takes up less than 1 mm2 of silicon real estate. In this dissertation, SPICE simulation results are presented, as well as the novel IC implementation of the proposed FIR filter adaptation technique as part of the hypothesis verification procedure. The implemented transmitter and receiver were tested for functionality, and showed the successful functional behaviour of all the implemented CML gates associated with the first filter tap. However, due to the slow charge and discharge rate of the pulse generation circuit in both the transmitter and receiver, only the main operational state of the transmitter could be experimentally validated. As a result of the adaptation scheme implemented, the contribution in this research lies in that a designer utilising such an IC can optimise the DDJ, reducing the total system jitter, and hence increasing the data fidelity with minimal effort.Dissertation (MEng)--University of Pretoria, 2011.Electrical, Electronic and Computer Engineeringunrestricte

An Energy-Efficient Reconfigurable Mobile Memory Interface for Computing Systems

The critical need for higher power efficiency and bandwidth transceiver design has significantly increased as mobile devices, such as smart phones, laptops, tablets, and ultra-portable personal digital assistants continue to be constructed using heterogeneous intellectual properties such as central processing units (CPUs), graphics processing units (GPUs), digital signal processors, dynamic random-access memories (DRAMs), sensors, and graphics/image processing units and to have enhanced graphic computing and video processing capabilities. However, the current mobile interface technologies which support CPU to memory communication (e.g. baseband-only signaling) have critical limitations, particularly super-linear energy consumption, limited bandwidth, and non-reconfigurable data access. As a consequence, there is a critical need to improve both energy efficiency and bandwidth for future mobile devices.;The primary goal of this study is to design an energy-efficient reconfigurable mobile memory interface for mobile computing systems in order to dramatically enhance the circuit and system bandwidth and power efficiency. The proposed energy efficient mobile memory interface which utilizes an advanced base-band (BB) signaling and a RF-band signaling is capable of simultaneous bi-directional communication and reconfigurable data access. It also increases power efficiency and bandwidth between mobile CPUs and memory subsystems on a single-ended shared transmission line. Moreover, due to multiple data communication on a single-ended shared transmission line, the number of transmission lines between mobile CPU and memories is considerably reduced, resulting in significant technological innovations, (e.g. more compact devices and low cost packaging to mobile communication interface) and establishing the principles and feasibility of technologies for future mobile system applications. The operation and performance of the proposed transceiver are analyzed and its circuit implementation is discussed in details. A chip prototype of the transceiver was implemented in a 65nm CMOS process technology. In the measurement, the transceiver exhibits higher aggregate data throughput and better energy efficiency compared to prior works

Silicon Photonic Subsystems for Inter-Chip Optical Networks

The continuous growth of electronic compute and memory nodes in terms of the number of I/O pins, bandwidth, and areal throughput poses major integration and packaging challenges associated with offloading multi-Tbit/s data rates within the few pJ/bit targets. While integrated photonics are already deployed in long and short distances such as inter and intra data centers communications, the promising characteristics of the silicon photonic platform set it as the future technology for optical interconnects in ultra short inter-chip distances. The high index contrast between the waveguide and the cladding together with strong thermo-optic and carrier effects in silicon allows developing a wide range of micro-scale and low power optical devices compatible with the CMOS fabrication processes. Furthermore, the availability of photonic foundries and new electrical and optical co-packaging techniques further pushes this platform for the next steps of commercial deployment. The work in this dissertation presents the current trends in high-performance memory and processor nodes and gives motivation for disaggregated and reconfigurable inter-chip network enabled with the silicon photonic layer. A dense WDM transceiver and broadband switch architectures are discussed to support a bi-directional network of ten hybrid-memory cubes (HMC) interconnected to ten processor nodes with an overall aggregated bandwidth of 9.6Tbit/s. Latency and energy consumption are key performance parameters in a processor to primary memory nodes connectivity. The transceiver design is based on energy-efficient micro-ring resonators, and the broadband switch is constructed with 2x2 Mach-Zehnder elements for nano-second reconfiguration. Each transceiver is based on hundreds of micro-rings to convert the native HMC electrical protocol to the optical domain and the switch is based on tens of hundreds of 2x2 elements to achieve non-blocking all-to-all connectivity. The next chapters focus on developing methods for controlling and monitoring such complex and highly integrated silicon photonic subsystems. The thermo-optic effect is characterized and we show experimentally that the phase of the optical carrier can be reliably controlled with pulse-width modulation (PWM) signal, ultimately relaxing the need for hundreds of digital to analog converters (DACs). We further show that doped waveguide heaters can be utilized as \textit{in-line} optical power monitors by measuring photo-conductance current, which is an alternative for the conventional tapping and integration of photo-diodes. The next part concerned with a common cascaded micro-ring resonator in a WDM transceiver design. We develop on an FPGA control algorithm that abstracts the physical layer and takes user-defined inputs to set the resonances to the desired wavelength in a unicast and multicast transmission modes. The associated sensitivities of these silicon ring resonators are presented and addressed with three closed-loop solutions. We first show a closed-loop operation based on tapping the error signal from the drop port of the micro-ring. The second solution presents a resonance wavelength locking with a single digital I/O for control and feedback signals. Lastly, we leverage the photo-conductance effect and demonstrate the locking procedure using only the doped heater for both control and feedback purposes. To achieve the inter-chip reconfigurability we discuss recent advances of high-port-count SiP broadband switches for reconfigurable inter-chip networks. To ensure optimal operation in terms of low insertion loss, low cross-talk and high signal integrity per routing path, hundreds of 2x2 Mach-Zehnder elements need to be biased precisely for the cross and bar states. We address this challenge with a tapless and a design agnostic calibration approach based on the photo-conductance effect. The automated algorithm returns a look-up table for all for each 2x2 element and the associated calibrated biases. Each routing scenario is then tested for insertion loss, crosstalk and bit-error rate of 25Gbit/s 4-level pulse amplitude modulation signals. The last part utilizes the Mach-Zehnder interferometers in WDM transceiver applications. We demonstrate a polarization insensitive four-channel WDM receiver with 40Gbit/s per channel and a transmitter design generating 8-level pulse amplitude modulation signals at 30Gbit/s

Research and design of high-speed advanced analogue front-ends for fibre-optic transmission systems

In the last decade, we have witnessed the emergence of large, warehouse-scale data centres which have enabled new internet-based software applications such as cloud computing, search engines, social media, e-government etc. Such data centres consist of large collections of servers interconnected using short-reach (reach up to a few hundred meters) optical interconnect. Today, transceivers for these applications achieve up to 100Gb/s by multiplexing 10x 10Gb/s or 4x 25Gb/s channels. In the near future however, data centre operators have expressed a need for optical links which can support 400Gb/s up to 1Tb/s. The crucial challenge is to achieve this in the same footprint (same transceiver module) and with similar power consumption as today’s technology. Straightforward scaling of the currently used space or wavelength division multiplexing may be difficult to achieve: indeed a 1Tb/s transceiver would require integration of 40 VCSELs (vertical cavity surface emitting laser diode, widely used for short‐reach optical interconnect), 40 photodiodes and the electronics operating at 25Gb/s in the same module as today’s 100Gb/s transceiver. Pushing the bit rate on such links beyond today’s commercially available 100Gb/s/fibre will require new generations of VCSELs and their driver and receiver electronics. This work looks into a number of state‐of-the-art technologies and investigates their performance restraints and recommends different set of designs, specifically targeting multilevel modulation formats. Several methods to extend the bandwidth using deep submicron (65nm and 28nm) CMOS technology are explored in this work, while also maintaining a focus upon reducing power consumption and chip area. The techniques used were pre-emphasis in rising and falling edges of the signal and bandwidth extensions by inductive peaking and different local feedback techniques. These techniques have been applied to a transmitter and receiver developed for advanced modulation formats such as PAM-4 (4 level pulse amplitude modulation). Such modulation format can increase the throughput per individual channel, which helps to overcome the challenges mentioned above to realize 400Gb/s to 1Tb/s transceivers

Bidirectional Neural Interface Circuits with On-Chip Stimulation Artifact Reduction Schemes

Bidirectional neural interfaces are tools designed to “communicate” with the brain via recording and modulation of neuronal activity. The bidirectional interface systems have been adopted for many applications. Neuroscientists employ them to map neuronal circuits through precise stimulation and recording. Medical doctors deploy them as adaptable medical devices which control therapeutic stimulation parameters based on monitoring real-time neural activity. Brain-machine-interface (BMI) researchers use neural interfaces to bypass the nervous system and directly control neuroprosthetics or brain-computer-interface (BCI) spellers. In bidirectional interfaces, the implantable transducers as well as the corresponding electronic circuits and systems face several challenges. A high channel count, low power consumption, and reduced system size are desirable for potential chronic deployment and wider applicability. Moreover, a neural interface designed for robust closed-loop operation requires the mitigation of stimulation artifacts which corrupt the recorded signals. This dissertation introduces several techniques targeting low power consumption, small size, and reduction of stimulation artifacts. These techniques are implemented for extracellular electrophysiological recording and two stimulation modalities: direct current stimulation for closed-loop control of seizure detection/quench and optical stimulation for optogenetic studies. While the two modalities differ in their mechanisms, hardware implementation, and applications, they share many crucial system-level challenges. The first method aims at solving the critical issue of stimulation artifacts saturating the preamplifier in the recording front-end. To prevent saturation, a novel mixed-signal stimulation artifact cancellation circuit is devised to subtract the artifact before amplification and maintain the standard input range of a power-hungry preamplifier. Additional novel techniques have been also implemented to lower the noise and power consumption. A common average referencing (CAR) front-end circuit eliminates the cross-channel common mode noise by averaging and subtracting it in analog domain. A range-adapting SAR ADC saves additional power by eliminating unnecessary conversion cycles when the input signal is small. Measurements of an integrated circuit (IC) prototype demonstrate the attenuation of stimulation artifacts by up to 42 dB and cross-channel noise suppression by up to 39.8 dB. The power consumption per channel is maintained at 330 nW, while the area per channel is only 0.17 mm2. The second system implements a compact headstage for closed-loop optogenetic stimulation and electrophysiological recording. This design targets a miniaturized form factor, high channel count, and high-precision stimulation control suitable for rodent in-vivo optogenetic studies. Monolithically integrated optoelectrodes (which include 12 µLEDs for optical stimulation and 12 electrical recording sites) are combined with an off-the-shelf recording IC and a custom-designed high-precision LED driver. 32 recording and 12 stimulation channels can be individually accessed and controlled on a small headstage with dimensions of 2.16 x 2.38 x 0.35 cm and mass of 1.9 g. A third system prototype improves the optogenetic headstage prototype by furthering system integration and improving power efficiency facilitating wireless operation. The custom application-specific integrated circuit (ASIC) combines recording and stimulation channels with a power management unit, allowing the system to be powered by an ultra-light Li-ion battery. Additionally, the µLED drivers include a high-resolution arbitrary waveform generation mode for shaping of µLED current pulses to preemptively reduce artifacts. A prototype IC occupies 7.66 mm2, consumes 3.04 mW under typical operating conditions, and the optical pulse shaping scheme can attenuate stimulation artifacts by up to 3x with a Gaussian-rise pulse rise time under 1 ms.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/147674/1/mendrela_1.pd

Energy-efficient wireline transceivers

Power-efficient wireline transceivers are highly demanded by many applications in high performance computation and communication systems. Apart from transferring a wide range of data rates to satisfy the interconnect bandwidth requirement, the transceivers have very tight power budget and are expected to be fully integrated. This thesis explores enabling techniques to implement such transceivers in both circuit and system levels. Specifically, three prototypes will be presented: (1) a 5Gb/s reference-less clock and data recovery circuit (CDR) using phase-rotating phase-locked loop (PRPLL) to conduct phase control so as to break several fundamental trade-offs in conventional receivers; (2) a 4-10.5Gb/s continuous-rate CDR with novel frequency acquisition scheme based on bang-bang phase detector (BBPD) and a ring oscillator-based fractional-N PLL as the low noise wide range DCO in the CDR loop; (3) a source-synchronous energy-proportional link with dynamic voltage and frequency scaling (DVFS) and rapid on/off (ROO) techniques to cut the link power wastage at system level. The receiver/transceiver architectures are highly digital and address the requirements of new receiver architecture development, wide operating range, and low power/area consumption while being fully integrated. Experimental results obtained from the prototypes attest the effectiveness of the proposed techniques

Development of Silicon Photonic Multi Chip Module Transceivers

The exponential growth of data generation–driven in part by the proliferation of applications such as high definition streaming, artificial intelligence, and the internet of things–presents an impending bottleneck for electrical interconnects to fulfill data center bandwidth demands. Links now require bandwidths in excess of multiple Tbps while operating on the order of picojoules per bit, in addition to constraints on areal bandwidth densities and pin I/O bandwidth densities. Optical communications built on a silicon photonic platform offers a potential solution to develop power efficient, high bandwidth, low attenuation, small footprint links, all while building off the mature CMOS ecosystem. The development of silicon photonic foundries supporting multi project wafer runs with associated process design kit components supports a path towards widespread commercial production by increasing production volume while reducing fabrication and development costs. While silicon photonics can always be improved in terms of performance and yield, one of the central challenges is the integration of the silicon photonic integrated circuits with the driving electronic integrated circuits and data generating compute nodes such as CPUs, FPGAs, and ASICs. The co-packaging of the photonics with the electronics is crucial for adoption of silicon photonics in datacenters, as improper integration negates all the potential benefits of silicon photonics. The work in this dissertation is centered around the development of silicon photonic multi chip module transceivers to aid in the deployment of silicon photonics within data centers. Section one focuses on silicon photonic integration and highlights multiple integrated transceiver prototypes. The central prototype features a photonic integrated circuit with bus waveguides with WDM microdisk modulators for the transmitter and WDM demuxes with drop ports to photodiodes for the receiver. The 2.5D integrated prototype utilizes a thinned silicon interposer and TIA electronic integrated circuits. The architecture, integration, characterization, performance, and scalability of the prototype are discussed. The development of this first prototype identified key design considerations necessary for designing multi chip module silicon photonic prototypes, which will be addressed in this section. Finally, other multi chip module silicon photonic prototypes will be overviewed. These include a 2.5D integrated transceiver with a different electronic integrated circuit TIA, a 3D integrated receiver, an active interposer network on chip, and a 2.5D integrated transceiver with custom electronic integrated circuits. Section two focuses on research that supports the development of silicon photonic transceivers. The thermal crosstalk from neighboring microdisk modulators as a function of modulator pitch is investigated. As modulators are placed at denser pitches to accommodate areal bandwidth density requirements in transceivers, this thermal crosstalk will become significant. In this section, designs and results from several iterations of custom microring modulators are reported. Custom microring modulators allow for scaling up the number of channels in microring transceivers by offering the ability to fabricate variable resonances and provide a platform for further innovation in bandwidth, free spectral range, and energy efficiency. The designs and results of higher order modulation format modulators, both microring based and Mach Zehnder based, are discussed. High order modulators offer a path towards scaling transceiver total throughput without having to increase the channel counts or component bandwidth. Together, the work in these two sections supports the development of silicon photonic transceivers to aid in the adoption of silicon photonics into data generating systems

Power and spectrally efficient integrated high-speed LED drivers for visible light communication

Recent trends in mobile broadband indicates that the available radio frequency (RF) spectrum will not be enough to support the data requirements of the immediate future. Visible light communication, which uses visible spectrum to transmit wirelessly could be a potential solution to the RF ’Spectrum Crunch’. Thus there is growing interest all over the world in this domain with support from both academia and industry. Visible light communication( VLC) systems make use of light emitting diodes (LEDs), which are semiconductor light sources to transmit information. A number of demonstrators at different data capacity and link distances has been reported in this area. One of the key problems holding this technology from taking off is the unavailability of power efficient, miniature LED drive schemes. Reported demonstrators, mostly using either off the shelf components or arbitrary waveform generators (AWGs) to drive the LEDs have only started to address this problem by adopting integrated drivers designed for driving lighting installations for communications. The voltage regulator based drive schemes provide high power efficiency (> 90 %) but it is difficult to realise the fast switching required to achieve the Mbps or Gbps data rates needed for modern wireless communication devices. In this work, we are exploiting CMOS technology to realise an integrated LED driver for VLC. Instead of using conventional drive schemes (digital to analogue converter (DAC) + power amplifier or voltage regulators), we realised a current steering DAC based LED driver operating at high currents and sampling rates whilst maintaining power efficiency. Compared to a commercial AWG or discrete LED driver, circuit realised utilisng complementary metal oxide semiconductor (CMOS) technology has resulted in area reduction (29mm2). We realised for the first time a multi-channel CMOS LED driver capable of operating up to a 500 MHz sample rate at an output current of 255 mA per channel and >70% power efficiency. We were able to demonstrate the flexibility of the driver by employing it to realise VLC links using micro LEDs and commercial LEDs. Data rates up to 1 Gbps were achieved using this system employing a multiple input, multiple output (MIMO) scheme. We also demonstrated the wavelength division multiplexing ability of the driver using a red/green/blue commercial LED. The first integrated digital to light converter (DLC), where depending on the input code, a proportional number of LEDs are turned ON, realising a data converter in the optical domain, is also an output from this research. In addition, we propose a differential optical drive scheme where two output branches of a current DAC are used to drive two LEDs achieving higher link performance and power efficiency compared to single LED drive