Characterization of Thin Pixel Sensor Modules Interconnected with SLID Technology Irradiated to a Fluence of 2⋅1015\cdot 10^{15}\,neq_{\mathrm{eq}}/cm2^2

A new module concept for future ATLAS pixel detector upgrades is presented, where thin n-in-p silicon sensors are connected to the front-end chip exploiting the novel Solid Liquid Interdiffusion technique (SLID) and the signals are read out via Inter Chip Vias (ICV) etched through the front-end. This should serve as a proof of principle for future four-side buttable pixel assemblies for the ATLAS upgrades, without the cantilever presently needed in the chip for the wire bonding. The SLID interconnection, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It is characterized by a very thin eutectic Cu-Sn alloy and allows for stacking of different layers of chips on top of the first one, without destroying the pre-existing bonds. This paves the way for vertical integration technologies. Results of the characterization of the first pixel modules interconnected through SLID as well as of one sample irradiated to $2\cdot10^{15}$\,\neqcm{} are discussed. Additionally, the etching of ICV into the front-end wafers was started. ICVs will be used to route the signals vertically through the front-end chip, to newly created pads on the backside. In the EMFT approach the chip wafer is thinned to (50--60)\,$\mu$m.Comment: Proceedings to PSD

Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors

The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules discussed in this paper. Mechanical and electrical parameters of pixel modules employing both SLID interconnections and sensors of 75 micrometer thickness are covered. The mechanical features discussed include the interconnection efficiency, alignment precision and mechanical strength. The electrical properties comprise the leakage currents, tuning characteristics, charge collection, cluster sizes and hit efficiencies. Targeting at a usage at the high luminosity upgrade of the LHC accelerator called HL-LHC, the results were obtained before and after irradiation up to fluences of $10^{16}$ $\mathrm{n}_{\mathrm{eq}}/\mathrm{cm}^2$ (1 MeV neutrons).Comment: 16 pages, 22 figure

Parasitaxus parasitized: Novel infestation of Parasitaxus usta (Podocarpaceae).

The world’s sole ‘parasitic’ gymnosperm Parasitaxus usta (Podocarpaceae) is endemic to the island of Grande Terre, New Caledonia. It is a threatened species because of its limited geographic range and progressing habitat fragmentation. Here, we report a novel scale insect outbreak on a Parasitaxus sub-population from Monts Dzumac in the southern part of Grande Terre. The identity of the scale insect was determined through combining morphological and molecular methods. The field collection of scale insects and their secretions from infested Parasitaxus specimens allowed morphological identification of the superfamily Coccoidea. Subsequent genetic sequencing using CO1 markers allowed phylogenetic placement of the wax scale insects to the genus Ceroplastes (Coccoidea, Coccidae), a widespread pest genus. The identified species, C. pseudoceriferus, has not been previously recorded from New Caledonia. As Parasitaxus is already vulnerable to extinction, this new threat to its long-term survival needs to be monitored. Other New Caledonian endemic plant species are potentially at risk of this new species, although it was not observed on Falcatifolium taxoides, the host of Parasitaxus.Peer reviewe

Sareomycetes cl. nov. : A new proposal for placement of the resinicolous genus Sarea (Ascomycota, Pezizomycotina)

Resinicolous fungi constitute a heterogeneous assemblage of fungi that live on fresh and solidified plant resins. The genus Sarea includes, according to current knowledge, two species, S. resinae and S. difformis. In contrast to other resinicolous discomycetes, which are placed in genera also including non-resinicolous species, Sarea species only ever fruit on resin. The taxonomic classification of Sarea has proven to be difficult and currently the genus, provisionally and based only on morphological features, has been assigned to the Trapeliales (Lecanoromycetes). In contrast, molecular studies have noted a possible affinity to the Leotiomycetes. Here we review the taxonomic placement of Sarea using sequence data from seven phylogenetically informative DNA regions including ribosomal (ITS, nucSSU, mtSSU, nucLSU) and protein-coding (rpb1, rpb2, mcm7) regions. We combined available and new sequence data with sequences from major Pezizomycotina classes, especially Lecanoromycetes and Leotiomycetes, and assembled three different taxon samplings in order to place the genus Sarea within the Pezizomycotina. Based on our data, none of the applied phylogenetic approaches (Bayesian Inference, Maximum Likelihood and Maximum Parsimony) supported the placement of Sarea in the Trapeliales or any other order in the Lecanoromycetes. A placement of Sarea within the Leotiomycetes is similarly unsupported. Based on our data, Sarea forms an isolated and highly supported phylogenetic lineage within the "Leotiomyceta". From the results of our multilocus phylogenetic analyses we propose here a new class, order, and family, Sareomycetes, Sareales and Sareaceae in the Ascomycota to accommodate the genus Sarea. The genetic variability within the newly proposed class suggests that it is a larger group that requires further infrageneric classification.Peer reviewe

Resin exudation and resinicolous communities on Araucaria humboldtensis in New Caledonia

Conifers of the endemic species Araucaria humboldtensis on Mont Humboldt in New Caledonia exhibit extensive resin exudation. The resin flows of these threatened trees are here shown to be induced by two beetle species, which bore into branches and branchlets, leading to abundant outpouring of resin, which gradually solidifies into often drop-shaped resin bodies. The exudate is colonized by a resinicolous and likely insect-vectored ascomycete, Resinogalea humboldtensis, which is only known from Mont Humboldt. The fungus grows into fresh resin and eventually develops ascomata on the surface of solidifying resin. The solidified resin is also colonized by another fungus, a dematiaceous hyphomycete. Based on protein coding (CO1, CAD, ArgK) and ribosomal (LSU) genes, the larger branch-boring beetle is a weevil of the tribe Araucariini, which represents the sister group of all other cossonine weevils. The smaller beetle species belongs to the longhorn beetles (Cerambycidae). The strong host specificity of the Araucariini, along with the occurrence of two unique fungi, suggests that the resin associated community is native and has evolved on the endemic conifer host. The formation of large amber deposits indicates massive resin production in the past, but the environmental triggers of exudation in Mesozoic and Cenozoic ecosystems remain unclear. Our observations from Mont Humboldt support the notion that the occurrences of small drop-shaped amber pieces in Triassic to Miocene amber deposits were linked to ancient insect infestations.Peer reviewe

Stuck in time – a new Chaenothecopsis species with proliferating ascomata from Cunninghamia resin and its fossil ancestors in European amber

Resin protects wounded trees from microbial infection, but also provides a suitable substrate for the growth of highly specialized fungi. Chaenothecopsis proliferatus is described growing on resin of Cunninghamia lanceolata from Hunan Province, China. The new fungus is compared with extant species and two new fossil specimens from Eocene Baltic and Oligocene Bitterfeld ambers. The Oligocene fossil had produced proliferating ascomata identical to those of the newly described species and to other extant species of the same lineage. This morphology may represent an adaptation to growing near active resin flows: the proliferating ascomata can effectively rejuvenate if partially overrun by fresh, sticky exudate. Inward growth of fungal hyphae into resin has only been documented from Cenozoic amber fossils suggesting comparatively late occupation of resin as substrate by fungi. Still, resinicolous Chaenothecopsis species were already well adapted to their special ecological niche by the Eocene, and the morphology of these fungi has since remained remarkably constant

Resinogalea humboldtensis gen. et sp. nov., a new resinicolous fungus from New Caledonia, placed in Bruceomycetaceae fam. nova (Ascomycota)

A novel species of ascomycetes is described from resin of Araucaria humboldtensis on Mont Humboldt in New Caledonia. The fungus is placed in the new genus Resinogalea Rikkinen & A.R. Schmidt, with the species name R. humboldtensis Rikkinen & A.R. Schmidt. It has only been found growing on semi-hardened resin flows on branches of its endemic and endangered conifer host. The morphology and anatomy of the new fungus are compared with those of ecologically similar taxa, including Bruceomyces castoris. The new family Bruceomycetaceae Rikkinen & A.R. Schmidt is described to accommodate Resinogalea and Bruceomyces.Peer reviewe