13 research outputs found

    High-rate low-temperature dc pulsed magnetron sputtering of photocatalytic TiO2films: the effect of repetition frequency

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    The article reports on low-temperature high-rate sputtering of hydrophilic transparent TiO2thin films using dc dual magnetron (DM) sputtering in Ar + O2mixture on unheated glass substrates. The DM was operated in a bipolar asymmetric mode and was equipped with Ti(99.5) targets of 50 mm in diameter. The substrate surface temperature Tsurfmeasured by a thermostrip was less than 180 °C for all experiments. The effect of the repetition frequency frwas investigated in detail. It was found that the increase of frfrom 100 to 350 kHz leads to (a) an improvement of the efficiency of the deposition process that results in a significant increase of the deposition rate aDof sputtered TiO2films and (b) a decrease of peak pulse voltage and sustaining of the magnetron discharge at higher target power densities. It was demonstrated that several hundreds nm thick hydrophilic TiO2films can be sputtered on unheated glass substrates at aD = 80 nm/min, Tsurf < 180 °C when high value of fr = 350 kHz was used. Properties of a thin hydrophilic TiO2film deposited on a polycarbonate substrate are given

    Photodegradation of Pollutants in Air: Enhanced Properties of Nano-TiO2Prepared by Ultrasound

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    Nanocrystalline TiO2samples were prepared by promoting the growth of a sol–gel precursor, in the presence of water, under continuous (CW), or pulsed (PW) ultrasound. All the samples turned out to be made of both anatase and brookite polymorphs. Pulsed US treatments determine an increase in the sample surface area and a decrease of the crystallite size, that is also accompanied by a more ordered crystalline structure and the samples appear to be more regular and can be considered to contain a relatively low concentration of lattice defects. These features result in a lower recombination rate between electrons and holes and, therefore, in a good photocatalytic performance toward the degradation of NOxin air. The continuous mode induces, instead, the formation of surface defects (two components are present in XPS Ti 2p3/2region) and consequently yields the best photocatalyst. The analysis of all the characterization data seems to suggest that the relevant parameter imposing the final features of the oxides is the ultrasound total energypervolume (Etot/V) and not the acoustic intensity or the pulsed/continuous mode

    Pulsed DC magnetron sputtering deposition of crystalline photocatalytic titania coatings at elevated process pressures

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    © 2017 Elsevier Ltd The use of elevated process pressures is described in the magnetron sputter deposition of titanium dioxide photocatalytic coatings to enable the direct low-temperature formation of the most photoactive titania crystal phase; anatase. Most other works on this subject deal with relatively low ‘conventional’ pressures (0.1–0.5 Pa). However, the present work describes pulsed DC reactive magnetron sputtering deposition of titanium dioxide thin films at process pressures in the range 2–5 Pa in a purpose-built sputtering rig. The influence of the other deposition conditions, such as pulse frequency and duty cycle, is also discussed. Additionally, a series of N-doped titania coatings was produced by using air as the reactive gas. The morphological and compositional properties of the coatings were studied using energy dispersive X-ray spectroscopy (EDX), scanning electron microscopy (SEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). Wettability of the films was studied through measurement of water contact angles under UV light irradiation. Photocatalytic properties of the samples were assessed through the degradation of two model pollutants, methylene blue and stearic acid, under UV light irradiation. The results showed that elevated process pressures (4 Pa and above) allow the direct deposition of anatase titania films, without additional heat treatment, while amorphous titania tends to form at lower process pressures
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