381 research outputs found

    Physical map of the Eps-Am1 gene region in Triticum monococcum L.

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    The chromosome region including the earliness per se locus Eps-Am1 affects the duration of early developmental phases and spikelet number in diploid wheat

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    Earliness per se genes are those that regulate flowering time independently of vernalization and photoperiod, and are important for the fine tuning of flowering time and for the wide adaptation of wheat to different environments. The earliness per se locus Eps-Am1 was recently mapped within a 0.8 cM interval on chromosome 1AmL of diploid wheat Triticum monococcum L., and it was shown that its effect was modulated by temperature. In this study, this precise mapping information was used to characterize the effect of the Eps-Am1 region on both duration of different developmental phases and spikelet number. Near isogenic lines (NILs) carrying the Eps-Am1-l allele from the cultivated accession DV92 had significantly longer vegetative and spike development phases (P <0.0001) than NILs carrying the Eps-Am1-e allele from the wild accession G3116. These differences were paralleled by a significant increase in the number of spikelets per spike, in both greenhouse and field experiments (P <0.0001). Significant interactions between temperature and Eps-Am1 alleles were detected for heading time (P <0.0001) but not for spikelet number (P=0.67). Experiments using NILs homozygous for chromosomes with recombination events within the 0.8 cM Eps-Am1 region showed that the differences in number of spikelets per spike were linked to the differences in heading time controlled by the Eps-Am1 locus. These results indicate that the differences in these two traits are either pleiotropic effects of a single gene or the effect of closely linked genes. A similar effect on spikelet number was detected in the distal region of chromosome 1AL in common wheat (T. aestivum L.)

    Transient thermal finite element analysis of CFC–Cu ITER monoblock using X-ray tomography data

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    The thermal performance of a carbon fibre composite-copper monoblock, a sub-component of a fusion reactor divertor, was investigated by finite element analysis. High-accuracy simulations were created using an emerging technique, image-based finite element modelling, which converts X-ray tomography data into micro-structurally faithful models, capturing details such as manufacturing defects. For validation, a case study was performed where the thermal analysis by laser flash of a carbon fibre composite-copper disc was simulated such that computational and experimental results could be compared directly. Results showed that a high resolution image-based simulation (102 million elements of 32 μm width) provided increased accuracy over a low resolution image-based simulation (0.6 million elements of 194 μm width) and idealised computer aided design simulations. Using this technique to analyse a monoblock mock-up, it was possible to detect and quantify the effects of debonding regions at the carbon fibre composite-copper interface likely to impact both component performance and expected lifetime. These features would not have been accounted for in idealised computer aided design simulations

    Thermal characterisation of ceramic/metal joining techniques for fusion applications using X-ray tomography

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    This work investigates the thermal performance of four novel CFC–Cu joining techniques. Two involve direct casting and brazing of Cu onto a chromium modified CFC surface, the other two pre-coat a brazing alloy with chromium using galvanisation and sputtering processes. The chromium carbide layer at the interface has been shown to improve adhesion. Thermal conductivity across the join interface was measured by laser flash analysis. X-ray tomography was performed to investigate micro-structures that might influence the thermal behaviour. It was found that thermal conductivity varied by up to 72%. Quantification of the X-ray tomography data showed that the dominant feature in reducing thermal conductivity was the lateral spread of voids at the interface. Correlations were made to estimate the extent of this effect
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