49 research outputs found

    Stress Analysis and Thermal Characterization of High Pin Count

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    A three-dimensional finite element model of a high pin count plastic-quad-flat-pack (PQFP) Introduction One major trend in integrated circuit (IC) package design is the use of relatively large die in smaller packages Although both the finite differenc

    Tanrıöver ve Türk milliyetçiliği

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    Taha Toros Arşivi, Dosya No: 42-Hamdullah Suphi Tanrıöver. Not: Makale ekli dokümanın 60. sayfasında yer almaktadır

    Stress Analysis and Thermal Characterization of a High Pin Count PQFP

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