TOWARDS RELIABLE NANOPHOTONIC INTERCONNECTION NETWORK DESIGNS

As technology scales into deep submicron domains, electrical wires start to face critical challenges in latency and power since they do not scale well as compared to transistors. Many recent researches have shifted focus to optical on-chip interconnection because of its promises of high bandwidth density, low propagation delay, distance-independent power consumption (compared to metal), and natural support for multicast and broadcast. Unfortunately, while optical interconnect provides many attractive and promising features, there are also fundamental challenges in fabrication of those devices to providing robust and reliable on-chip communication. Microrings resonators, the basic components of nanophotonic interconnect, may not resonate at the designated wavelength under fabrication errors (a.k.a. process variations PV) or thermal fluctuation (TF), leading to communication errors and bandwidth loss. In addition, the power overhead required to correct the drift can overturn the benefits promised by this new technology. Hence, the objective of the thesis is to maximize network bandwidth through proper arrangement among microrings and wavelengths with minimum tuning power requirement. I propose the following techniques to achieve my goals. First, I will present a series of solutions, called ``MinTrim'', to address the wavelength drifting problem of microrings and subsequent bandwidth loss problem of an optical network, due to the PV. Next, to mitigate bandwidth loss and performance degradation caused by PV and TF, I will propose an architecture-level approach, ``BandArb'', which allocates the bandwidth at runtime according to network demands and temperature with low computation overhead. Finally, I will conclude the thesis and discuss the future works in this field

Variation-Aware Modeling and Design of Nanophotonic Interconnects

Optical interconnects have started to replace electrical interconnects in the communications between racks and circuit boards with potential benefits in bandwidth, delay, power efficiency, and crosstalk. Silicon photonics has emerged to be a highly promising enabling technology for the short-reach nanophotonic interconnects because it offers favorable CMOS compatibility and high integration level. The fast-growing complexity of photonic integrated circuit (PIC) and close electro-optical integration call for computer-aided design (CAD) for integrated photonics, and electronic-photonic design automation (EPDA) including accurate behavior models and efficient simulation methodologies for integrated electro-optical systems. Also, the nanophotonic devices are highly sensitive to fabrication process variation and thermal variation effects, which requires proper modeling, optimization, and management schemes. To address these problems, this thesis is dedicated to the following two tasks: (1) compact modeling and circuit-level simulation of nanophotonic interconnects, and (2) power-efficient management of the variation effects in nanophotonic interconnects.The first part of the thesis develops compact models for key components in nanophotonic interconnects including silicon microring modulators, diode lasers, electro-absorption modulators (EAM), photodetectors, etc. These compact models are developed based on their electrical and optical properties, and are then extensively validated by measurement data. The model parameters are extracted from common electrical and optical tests. Implemented in Verilog-A, the models are used in SPICE simulations of optical links, whose results again agree well with measurement data. The compact model library and the simulation methodology enable electro-optical co-simulations and optical device design explorations in the circuit-level.In the second part of the thesis, we propose modeling methods and power-efficient management schemes for the process and thermal variations in optical interconnects. The proposed adaptive tuning technique performs on-chip self-tests and adaptively allocates just enough power for link operations. The technique saves significant amount of power compared to worst-case based conservative designs, and scales well w.r.t. variations and network size. We also design power-efficient pairing algorithms for microring-based optical interconnects. Our algorithms optimally mix-and-match microring-based devices to minimize the power consumption for tuning. The algorithms are tested on both measured and synthetic data sets, demonstrating promising results of power reduction and scalability for handling a large number of devices. Lastly, we decompose and analyze wafer-scale spatial patterns of process variations in microring modulators. We further investigate the correlations between the spatial patterns and fabrication process steps, which is valuable for understanding process variation sources and improving fabrication processes for uniformity

Process Variation in Silicon Photonic Devices

The high index contrast of the silicon - silicon dioxide material system allows for dense integration of optical waveguide devices. Possible applications include intra-chip, inter-chip and fiber optic interconnection systems. Optical intra-chip interconnections become more desirable as the complementary metal-oxide-semiconductor (CMOS) circuit density puts ever tighter constraint on on-chip interconnection performance. Board level, rack level and rack-to-rack data center interconnections are ever more constrained by space and bandwidth to which silicon photonic modules may offer an improvement. As fiber optic systems serve smaller and smaller area systems, integrated switching systems that are enabled by silicon photonic devices involving wavelength division multiplexing (WDM) become more desirable. In this thesis, we firstly take a brief review of the development history of information technology, optical communication and silicon photonics. Secondly we examine the optical performance of an array of photonic devices which are the basic building blocks for silicon photonic circuits. Thirdly we turn the attention to the fabrication related issues. Silicon photonic circuits are prone to the thermal and fabrication induced process variations. We discover the process variation exhibits a “random walk” pattern with spatial extent at wafer scale. Fourthly we propose a simple method to extract fundamental parameters out of fabricated silicon photonic devices. Based on the systemic wafer-scale measurement results, our method combines the advantage of both numerical simulation and simple analytical modeling techniques. Lastly, we propose a variation-aware on-chip interconnect design for multi-core processors. This design adapts to on-chip thermal and process variation effects, pointing to the improvement of wafer-scale fabrication yield and interconnect network communication throughput

Microwave Photonic Applications - From Chip Level to System Level

Die Vermischung von Mikrowellen- und optischen Technologien – Mikrowellenphotonik – ist ein neu aufkommendes Feld mit hohem Potential. Durch die Nutzung der Vorzüge beider Welten hat die Mikrowellenphotonik viele Anwendungsfälle und ist gerade erst am Beginn ihrer Erfolgsgeschichte. Der Weg für neue Konzepte, neue Komponenten und neue Anwendungen wird dadurch geebnet, dass ein höherer Grad an Integration sowie neue Technologien wie Silicon Photonics verfügbar sind. In diesem Werk werden zuerst die notwendigen grundlegenden Basiskomponenten – optische Quelle, elektro-optische Wandlung, Übertragungsmedium und opto-elektrische Wandlung – eingeführt. Mithilfe spezifischer Anwendungsbeispiele, die von Chipebene bis hin zur Systemebene reichen, wird der elektrooptische Codesign-Prozess veranschaulicht. Schließlich werden zukünftige Ausrichtungen wie die Unterstützung von elektrischen Trägern im Millimeterwellen- und THz-Bereich sowie Realisierungsoptionen in integrierter Optik und Nanophotonik diskutiert.The hybridization between microwave and optical technologies – microwave photonics – is an emerging field with high potential. Benefitting from the best of both worlds, microwave photonics has many use cases and is just at the beginning of its success story. The availability of a higher degree of integration and new technologies such as silicon photonics paves the way for new concepts, new components and new applications. In this work, first, the necessary basic building blocks – optical source, electro-optical conversion, transmission medium and opto-electrical conversion – are introduced. With the help of specific application examples ranging from chip level to system level, the electro-optical co-design process for microwave photonic systems is illustrated. Finally, future directions such as the support of electrical carriers in the millimeter wave and THz range and realization options in integrated optics and nanophotonics are discussed

Novel Cache Hierarchies with Photonic Interconnects for Chip Multiprocessors

[ES] Los procesadores multinúcleo actuales cuentan con recursos compartidos entre los diferentes núcleos. Dos de estos recursos compartidos, la cache de último nivel y el ancho de banda de memoria principal, pueden convertirse en cuellos de botella para el rendimiento. Además, con el crecimiento del número de núcleos que implementan los diseños más recientes, la red dentro del chip también se convierte en un cuello de botella que puede afectar negativamente al rendimiento, ya que las redes tradicionales pueden encontrar limitaciones a su escalabilidad en el futuro cercano. Prácticamente la totalidad de los diseños actuales implementan jerarquías de memoria que se comunican mediante rápidas redes de interconexión. Esta organización es eficaz dado que permite reducir el número de accesos que se realizan a memoria principal y la latencia media de acceso a memoria. Las caches, la red de interconexión y la memoria principal, conjuntamente con otras técnicas conocidas como la prebúsqueda, permiten reducir las enormes latencias de acceso a memoria principal, limitando así el impacto negativo ocasionado por la diferencia de rendimiento existente entre los núcleos de cómputo y la memoria. Sin embargo, compartir los recursos mencionados es fuente de diferentes problemas y retos, siendo uno de los principales el manejo de la interferencia entre aplicaciones. Hacer un uso eficiente de la jerarquía de memoria y las caches, así como contar con una red de interconexión apropiada, es necesario para sostener el crecimiento del rendimiento en los diseños tanto actuales como futuros. Esta tesis analiza y estudia los principales problemas e inconvenientes observados en estos dos recursos: la cache de último nivel y la red dentro del chip. En primer lugar, se estudia la escalabilidad de las tradicionales redes dentro del chip con topología de malla, así como esta puede verse comprometida en próximos diseños que cuenten con mayor número de núcleos. Los resultados de este estudio muestran que, a mayor número de núcleos, el impacto negativo de la distancia entre núcleos en la latencia puede afectar seriamente al rendimiento del procesador. Como solución a este problema, en esta tesis proponemos una de red de interconexión óptica modelada en un entorno de simulación detallado, que supone una solución viable a los problemas de escalabilidad observados en los diseños tradicionales. A continuación, esta tesis dedica un esfuerzo importante a identificar y proponer soluciones a los principales problemas de diseño de las jerarquías de memoria actuales como son, por ejemplo, el sobredimensionado del espacio de cache privado, la existencia de réplicas de datos y rigidez e incapacidad de adaptación de las estructuras de cache. Aunque bien conocidos, estos problemas y sus efectos adversos en el rendimiento pueden ser evitados en procesadores de alto rendimiento gracias a la enorme capacidad de la cache de último nivel que este tipo de procesadores típicamente implementan. Sin embargo, en procesadores de bajo consumo, no existe la posibilidad de contar con tales capacidades y hacer un uso eficiente del espacio disponible es crítico para mantener el rendimiento. Como solución a estos problemas en procesadores de bajo consumo, proponemos una novedosa organización de jerarquía de dos niveles cache que utiliza una red de interconexión óptica. Los resultados obtenidos muestran que, comparado con diseños convencionales, el consumo de energía estática en la arquitectura propuesta es un 60% menor, pese a que los resultados de rendimiento presentan valores similares. Por último, hemos extendido la arquitectura propuesta para dar soporte tanto a aplicaciones paralelas como secuenciales. Los resultados obtenidos con la esta nueva arquitectura muestran un ahorro de hasta el 78 % de energía estática en la ejecución de aplicaciones paralelas.[CA] Els processadors multinucli actuals compten amb recursos compartits entre els diferents nuclis. Dos d'aquests recursos compartits, la memòria d’últim nivell i l'ample de banda de memòria principal, poden convertir-se en colls d'ampolla per al rendiment. A mes, amb el creixement del nombre de nuclis que implementen els dissenys mes recents, la xarxa dins del xip també es converteix en un coll d'ampolla que pot afectar negativament el rendiment, ja que les xarxes tradicionals poden trobar limitacions a la seva escalabilitat en el futur proper. Pràcticament la totalitat dels dissenys actuals implementen jerarquies de memòria que es comuniquen mitjançant rapides xarxes d’interconnexió. Aquesta organització es eficaç ates que permet reduir el nombre d'accessos que es realitzen a memòria principal i la latència mitjana d’accés a memòria. Les caches, la xarxa d’interconnexió i la memòria principal, conjuntament amb altres tècniques conegudes com la prebúsqueda, permeten reduir les enormes latències d’accés a memòria principal, limitant així l'impacte negatiu ocasionat per la diferencia de rendiment existent entre els nuclis de còmput i la memòria. No obstant això, compartir els recursos esmentats és font de diversos problemes i reptes, sent un dels principals la gestió de la interferència entre aplicacions. Fer un us eficient de la jerarquia de memòria i les caches, així com comptar amb una xarxa d’interconnexió apropiada, es necessari per sostenir el creixement del rendiment en els dissenys tant actuals com futurs. Aquesta tesi analitza i estudia els principals problemes i inconvenients observats en aquests dos recursos: la memòria cache d’últim nivell i la xarxa dins del xip. En primer lloc, s'estudia l'escalabilitat de les xarxes tradicionals dins del xip amb topologia de malla, així com aquesta es pot veure compromesa en propers dissenys que compten amb major nombre de nuclis. Els resultats d'aquest estudi mostren que, a major nombre de nuclis, l'impacte negatiu de la distància entre nuclis en la latència pot afectar seriosament al rendiment del processador. Com a solució' a aquest problema, en aquesta tesi proposem una xarxa d’interconnexió' òptica modelada en un entorn de simulació detallat, que suposa una solució viable als problemes d'escalabilitat observats en els dissenys tradicionals. A continuació, aquesta tesi dedica un esforç important a identificar i proposar solucions als principals problemes de disseny de les jerarquies de memòria actuals com son, per exemple, el sobredimensionat de l'espai de memòria cache privat, l’existència de repliques de dades i la rigidesa i incapacitat d’adaptació' de les estructures de memòria cache. Encara que ben coneguts, aquests problemes i els seus efectes adversos en el rendiment poden ser evitats en processadors d'alt rendiment gracies a l'enorme capacitat de la memòria cache d’últim nivell que aquest tipus de processadors típicament implementen. No obstant això, en processadors de baix consum, no hi ha la possibilitat de comptar amb aquestes capacitats, i fer un us eficient de l'espai disponible es torna crític per mantenir el rendiment. Com a solució a aquests problemes en processadors de baix consum, proposem una nova organització de jerarquia de dos nivells de memòria cache que utilitza una xarxa d’interconnexió òptica. Els resultats obtinguts mostren que, comparat amb dissenys convencionals, el consum d'energia estàtica en l'arquitectura proposada és un 60% menor, malgrat que els resultats de rendiment presenten valors similars. Per últim, hem estes l'arquitectura proposada per donar suport tant a aplicacions paral·leles com seqüencials. Els resultats obtinguts amb aquesta nova arquitectura mostren un estalvi de fins al 78 % d'energia estàtica en l’execució d'aplicacions paral·leles.[EN] Current multicores face the challenge of sharing resources among the different processor cores. Two main shared resources act as major performance bottlenecks in current designs: the off-chip main memory bandwidth and the last level cache. Additionally, as the core count grows, the network on-chip is also becoming a potential performance bottleneck, since traditional designs may find scalability issues in the near future. Memory hierarchies communicated through fast interconnects are implemented in almost every current design as they reduce the number of off-chip accesses and the overall latency, respectively. Main memory, caches, and interconnection resources, together with other widely-used techniques like prefetching, help alleviate the huge memory access latencies and limit the impact of the core-memory speed gap. However, sharing these resources brings several concerns, being one of the most challenging the management of the inter-application interference. Since almost every running application needs to access to main memory, all of them are exposed to interference from other co-runners in their way to the memory controller. For this reason, making an efficient use of the available cache space, together with achieving fast and scalable interconnects, is critical to sustain the performance in current and future designs. This dissertation analyzes and addresses the most important shortcomings of two major shared resources: the Last Level Cache (LLC) and the Network on Chip (NoC). First, we study the scalability of both electrical and optical NoCs for future multicoresand many-cores. To perform this study, we model optical interconnects in a cycle-accurate multicore simulation framework. A proper model is required; otherwise, important performance deviations may be observed otherwise in the evaluation results. The study reveals that, as the core count grows, the effect of distance on the end-to-end latency can negatively impact on the processor performance. In contrast, the study also shows that silicon nanophotonics are a viable solution to solve the mentioned latency problems. This dissertation is also motivated by important design concerns related to current memory hierarchies, like the oversizing of private cache space, data replication overheads, and lack of flexibility regarding sharing of cache structures. These issues, which can be overcome in high performance processors by virtue of huge LLCs, can compromise performance in low power processors. To address these issues we propose a more efficient cache hierarchy organization that leverages optical interconnects. The proposed architecture is conceived as an optically interconnected two-level cache hierarchy composed of multiple cache modules that can be dynamically turned on and off independently. Experimental results show that, compared to conventional designs, static energy consumption is improved by up to 60% while achieving similar performance results. Finally, we extend the proposal to support both sequential and parallel applications. This extension is required since the proposal adapts to the dynamic cache space needs of the running applications, and multithreaded applications's behaviors widely differ from those of single threaded programs. In addition, coherence management is also addressed, which is challenging since each cache module can be assigned to any core at a given time in the proposed approach. For parallel applications, the evaluation shows that the proposal achieves up to 78% static energy savings. In summary, this thesis tackles major challenges originated by the sharing of on-chip caches and communication resources in current multicores, and proposes new cache hierarchy organizations leveraging optical interconnects to address them. The proposed organizations reduce both static and dynamic energy consumption compared to conventional approaches while achieving similar performance; which results in better energy efficiency.Puche Lara, J. (2021). Novel Cache Hierarchies with Photonic Interconnects for Chip Multiprocessors [Tesis doctoral]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/165254TESI

High-Performance and Wavelength-Reused Optical Network on Chip (ONoC) Architectures and Communication Schemes for Manycore Processor

Optical Network on Chip (ONoC) is an emerging chip-scale optical interconnection technology to realize the high-performance and power-efficient inter-core communication for many-core processors. By utilizing the silicon photonic interconnects to transmit data packets with optical signals, it can achieve ultra low communication delay, high bandwidth capacity, and low power dissipation. With the benefits of Wavelength Division Multiplexing (WDM), multiple optical signals can simultaneously be transmitted in the same optical interconnect through different wavelengths. Thus, the WDM-based ONoC is becoming a hot research topic recently. However, the maximal number of available wavelengths is restricted for the reliable and power-efficient optical communication in ONoC. Hence, with a limited number of wavelengths, the design of high-performance and power-efficient ONoC architecture is an important and challenging problem. In this thesis, the design methodology of wavelength-reused ONoC architecture is explored. With the wavelength reuse scheme in optical routing paths, high-performance and power-efficient communication is realized for many-core processors only using a small number of available wavelengths. Three wavelength-reused ONoC architectures and communication schemes are proposed to fulfil different communication requirements, i.e., network scalability, multicast communication, and dark silicon. Firstly, WRH-ONoC, a wavelength-reused hierarchical Optical Network on Chip architecture, is proposed to achieve high network scalability, namely obtaining low communication delay and high throughput capacity for hundreds of thousands of cores by reusing the limited number of available wavelengths with the modest hardware cost and energy overhead. WRH-ONoC combines the advantages of non-blocking communication in each lambda-router and wavelength reuse in all lambda-routers through the hierarchical networking. Both theoretical analysis and simulation results indicate that WRH-ONoC can achieve prominent improvement on the communication performance and scalability (e.g., 46.0% of reduction on the zero-load packet delay and 72.7% of improvement on the network throughput for 400 cores with small hardware cost and energy overhead) in comparison with existing schemes. Secondly, DWRMR, a dynamical wavelength-reused multicast scheme based on the optical multicast ring, is proposed for widely existing multicast communications in many-core processors. In DWRMR, an optical multicast ring is dynamically constructed for each multicast group and the multicast packets are transmitted in a single-send-multi-receive manner requiring only one wavelength. All the cores in the same multicast group can reuse the established multicast ring through an optical token arbitration scheme for the interactive multicast communications, thereby avoiding the frequent construction of multicast routing paths dedicatedly for each core. Simulation results indicate that DWRMR can reduce more than 50% of end-to-end packet delay with slight hardware cost, or require only half number of wavelengths to achieve the same performance compared with existing schemes. Thirdly, Dark-ONoC, a dynamically configurable ONoC architecture, is proposed for the many-core processor with dark silicon. Dark silicon is an inevitable phenomenon that only a small number of cores can be activated simultaneously while the other cores must stay in dark state (power-gated) due to the restricted power budget. Dark-ONoC periodically allocates non-blocking optical routing paths only between the active cores with as less wavelengths as possible. Thus, it can obtain high-performance communication and low power consumption at the same time. Extensive simulations are conducted with the dark silicon patterns from both synthetic distribution and real data traces. The simulation results indicate that the number of wavelengths is reduced by around 15% and the overall power consumption is reduced by 23.4% compared to existing schemes. Finally, this thesis concludes several important principles on the design of wavelength-reused ONoC architecture, and summarizes some perspective issues for the future research

prediction Modeling for Design Space Exploration in Optical Network on Chip

In at least a decade chip multiprocessors (CMP) have been dominating new commercial releases due to computational advantages of parallel computing cores on a single chip. Network on Chip (NoC) has emerged as an interconnection network of CMPs. But significant bandwidth that is required for multicore chips is becoming a bottleneck in the traditional (electrical) network on chip, due to delays caused by long wires in the electric NoC. Integration of photonic links with traditional electronic interconnects proposes a promising solution for this challenge. Since there are numerous design parameters for opto-electrical network architectures, an accurate evaluation is needed to study the impact of each design parameter on network performance, and to provide the most suitable network for a given set of applications, a power or a performance goal. In this thesis, we present a prediction modeling technique for design space exploration of an opto-electrical network on chip. Our proposed model accurately predicts delay (includes network packet latency and network contention delay) and energy (includes static and dynamic energy consumption) of the network. Specifically, this work addresses the fundamental challenge of accurate estimation of desired metrics without having to incur high simulation cost of numerous configurations of the optical network on chip architecture. We reduce the number of required simulations by accurately selecting the parameters that have the most impact on the network. Furthermore, we sparsely and randomly sample the designs build using these parameters from an Optical Network on Chip (ONoC) design space, and simulate only the sampled designs. We validate our model with three different applications executing on a large set of network configurations in a large optical network on chip design space. We achieve average error rates (root relative squared error) as low as 5.5% for the delay and 3.05% for the energy consumption

Estudio de la viabilidad de una red híbrida foto-eléctrica

[ES] Recientemente, las redes ópticas han aparecido como una alternativa a las redes eléctricas dentro del chip, por su bajo consumo, alto ancho de banda, y latencia independiente de la distancia. Sin embargo, el coste temporal requerido por la conversión electro-óptica y viceversa de la información así como el coste de la integración de estas tecnologías en los procesos de fabricación actuales hace pensar que la implantación de las redes ópticas on-chip será gradual. Por tanto, es de esperar que en los próximos años convivirán ambas tecnologías. En este proyecto se analiza la viabilidad de algunas propuestas de redes híbridas que combinan ambas tecnologías.Puche Lara, J. (2015). Estudio de la viabilidad de una red híbrida foto-eléctrica. http://hdl.handle.net/10251/55233TFG