Towards a More Flexible, Sustainable, Efficient and Reliable Induction Cooking: A Power Semiconductor Device Perspective

Esta tesis tiene como objetivo fundamental la mejora de la flexibilidad, sostenibilidad, eficiencia y fiabilidad de las cocinas de inducción por medio de la utilización de dispositivos semiconductores de potencia: Dentro de este marco, existe una funcionalidad que presenta un amplio rango de mejora. Se trata de la función de multiplexación de potencia, la cual pretende resolverse de una manera más eficaz por medio de la sustitución de los comúnmente utilizados relés electromecánicos por dispositivos de estado sólido. De entre todas las posibles implementaciones, se ha identificado entre las más prometedoras a aquellas basadas en dispositivos de alta movilidad de electrones (HEMT) de Nitruro de Galio (GaN) y de aquellas basadas en Carburo de Silicio (SiC), pues presentan unas características muy superiores a los relés a los que se pretende sustituir. Por el contrario, otras soluciones que inicialmente parecían ser muy prometedoras, como los MOSFETs de Súper-Unión, han presentado una serie de comportamientos anómalos, que han sido estudiados minuciosamente por medio de simulaciones físicas a nivel de chip. Además, se analiza en distintas condiciones la capacidad en cortocircuito de dispositivos convencionalmente empleados en cocinas de inducción, como son los IGBTs, tratándose de encontrar el equilibrio entre un comportamiento robusto al tiempo que se mantienen bajas las pérdidas de potencia. Por otra parte, también se estudia la robustez y fiabilidad de varios GaN HEMT de 600- 650 V tanto de forma experimental como por medio de simulaciones físicas. Finalmente se aborda el cálculo de las pérdidas de potencia en convertidores de potencia resonantes empleando técnicas de termografía infrarroja. Por medio de esta técnica no solo es posible medir de forma precisa las diferentes contribuciones de las pérdidas, sino que también es posible apreciar cómo se distribuye la corriente a nivel de chip cuando, por ejemplo, el componente opera en modo de conmutación dura. Como resultado, se obtiene información relevante relacionada con modos de fallo. Además, también ha sido aprovechar las caracterizaciones realizadas para obtener un modelo térmico de simulación.This thesis is focused on addressing a more flexible, sustainable, efficient and reliable induction cooking approach from a power semiconductor device perspective. In this framework, this PhD Thesis has identified the following activities to cover such demands: In view of the growing interest for an effective power multiplexing in Induction Heating (IH) applications, improved and efficient Solid State Relays (SSRs) as an alternative to the electromechanical relays (EMRs) are deeply investigated. In this context, emerging Gallium Nitride (GaN) High‐Electron‐Mobility Transistors (GaN HEMTs) and Silicon Carbide (SiC) based devices are identified as potential candidates for the mentioned application, featuring several improved characteristics over EMRs. On the contrary, other solutions, which seemed to be very promising, resulted to suffer from anomalous behaviors; i.e. SJ MOSFETs are thoroughly analysed by electro‐thermal physical simulations at the device level. Additionally, the Short Circuit (SC) capability of power semiconductor devices employed or with potential to be used in IH appliances is also analysed. On the one hand, conventional IGBTs SC behavior is evaluated under different test conditions so that to obtain the trade‐off between ruggedness and low power losses. Moreover, ruggedness and reliability of several normally‐off 600‐650 V GaN HEMTs are deeply investigated by experimentation and physics‐based simulation. Finally, power losses calculation at die‐level is performed for resonant power converters by means of using Infrared Thermography (IRT). This method assists to determine, at the die‐level, the power losses and current distribution in IGBTs used in resonant soft‐switching power converters when functioning within or outside the Zero Voltage Switching (ZVS) condition. As a result, relevant information is obtained related to decreasing the power losses during commutation in the final application, and a thermal model is extracted for simulation purposes.<br /

Development of Si Device Based Power Converters for High Temperature Operation in HEV Applications

In this dissertation, the feasibility of operating Si devices at 200 ˚C [degree Celsius] is investigated and the guidelines on the development of a high temperature Si converter for operating with 105 ˚C high temperature liquid coolant in hybrid electrical vehicle (HEV) applications are provided. First, the characterization of a Si IGBT operating at 200 ˚C junction temperatures is presented. It is shown that the commercial 175 ˚C Si IGBT under test can be successfully switched at an elevated junction temperature of 200 ˚C with increased but acceptable losses. Second, a comprehensive evaluation of Si IGBT ruggedness at high temperature operation is provided through experiments. The important criteria considering latch-up immunity, short circuit capability, and avalanche capability are given to ensure the safe and reliable operation of Si IGBTs at 200 ˚C. Third, the feasibility of operating Si devices based converters continuously at the junction temperature of 200 ˚C is demonstrated. A Si IGBT phase-leg module is developed for 200 ˚C operation utilizing high temperature packaging technologies and appropriate thermal management. Fourth, a method is proposed to measure the junction temperatures of IGBTs during the converter operation using IGBT short circuit current. The calibration experiments show that the short circuit current has good sensitivity, linearity and selectivity, making the method suitable for use as temperature sensitive electrical parameter (TSEP). By connecting a temperature measurement unit to the converter and giving a short circuit pulse during the converter operation, the IGBT junction temperature can be measured. Fifth, a 30 kW Si IGBT based three-phase converter has been developed for operating at the junction temperature of 200 ˚C with the high temperature coolant in HEV applications. The experimental results demonstrate that the three-phase converter can operate at junction temperature of 200 ˚C with the 105 ˚C high temperature coolant, thus eliminating the need for the additional 65 ˚C coolant in HEV. Additionally, the emerging 600 V GaN HEMT is investigated as a potential replacement of Si devices for high efficiency and high temperature in future HEV applications

Analysis of performance of SiC bipolar semiconductor devices for grid-level converters

Recent commercialization of SiC bipolar devices, including SiC BJT, SiC MPS diode and SiC PiN diodes have enabled potential candidates to replace their SiC unipolar counterparts. However, the prospects of 4H-SiC power bipolar devices still need further investigation. This thesis compares the static and dynamic performance and reliability for the commercial SiC bipolar devices including SiC BJT, SiC MPS diode and SiC PiN diode and their similarly rated Silicon counterparts mainly by means of experimental measurements.Through comprehensive double-pulse measurements, the turn-on and turn-off transition in Silicon BJT is seen to be much slower than that of the SiC BJT while the transient time will increase with temperature and decreases with collector currents. The common-emitter current gain (β) of SiC BJT is also found to be much higher than its Silicon counterpart. Significant turn-off delay is observed in single Si BJT which becomes worse when in parallel connection as it aggravates the current mismatch across the two devices, while this delay is almost non-existent in SiC devices. The current collapse seen in single SiC BJT is mitigated by parallel connection. These are dependant on temperature and base resistance, especially in the case of Silicon BJT. The static performance of power Silicon and SiC BJT has also been evaluated. It has been found that the higher base-emitter junction voltage of SiC BJTs enables quasi-saturation mode of operation with low on-resistance, which is also the case for Silicon BJTs only at high base currents. In terms of DC gain measured under steady state operation, the observed negative temperature coefficient (NTC) of β in SiC BJTs and the positive coefficient (PTC) in Silicon BJTs can make the β of SiC BJT lower than that in Silicon at high temperatures. It has been found that parallel connection promotes both the on-state conductivity and current gain in Silicon BJTs and conductivity in SiC BJTs.The characterization of power diodes reveals that the superior switching performance of the SiC MPS &amp; JBS diode when compared with the Si PiN diode is due to the absence of the stored charge. This also leads to the larger on-state voltage in both SiC diodes and becomes worse at high currents under high temperatures. Through comprehensive Unclamped Inductive Switching (UIS) measurements, it is seen that the avalanche ruggedness of SiC MPS &amp; JBS diodes outperform that of the closely rated Silicon PiN diode taking advantage of the wide-bandgap properties of SiC. Higher critical avalanche energy and thus better avalanche ruggedness can also be observed in SiC JBS diode compared with the SiC MPS diode. SiC MPS diodes can compete with Si PiN diodes in terms of the surge current limits, while the SiC JBS diode failed under a lower electrothermal stress. This is observed by the dramatic increase in its reverse leakage current at lower voltages.The 15 kV SiC PiN diodes feature smaller device dimensions, less reverse recovery charge and less on-resistance when compared to the 15 kV Silicon PiN diodes. Nevertheless, when evaluating its long-term reliability by using the aggravated power cycling configuration, the high junction temperature together with the dislocation defects in the SiC PiN diode accelerate its degradation. Such degradations are not observed in Silicon PiN diodes for the same junction temperature and high-temperature stress periods

SiC power MOSFETs performance, robustness and technology maturity

Relatively recently, SiC power MOSFETs have transitioned from being a research exercise to becoming an industrial reality. The potential benefits that can be drawn from this technology in the electrical energy conversion domain have been amply discussed and partly demonstrated. Before their widespread use in the field, the transistors need to be thoroughly investigated and later validated for robustness and longer term stability and reliability. This paper proposes a review of commercial SiC power MOSFETs state-of-the-art characteristics and discusses trends and needs for further technology improvements, as well as device design and engineering advancements to meet the increasing demands of power electronics

Study of Novel Power Semiconductor Devices for Performance and Reliability.

Power Semiconductor Devices are crucial components in present day power electronic systems. The performance and efficiency of the devices have a direct correlation with the power system efficiency. This dissertation will examine some of the components that are commonly used in a power system, with emphasis on their performance characteristics and reliability. In recent times, there has a proliferation of charge balance devices in high voltage discrete power devices. We examine the same charge balance concept in a fast recovery diode and a MOSFET. This is crucial in the extending system performance at compact dimensions. At smaller device and system sizes, the performance trade-off between the ON and OFF states becomes all the more critical. The focus on reducing the switching losses while maintaining system reliability increases. In a conventional planar technology, the technology places a limit on the switching performance owing to the larger die sizes. Using a charge balance structure helps achieve the improved trade-off, while working towards ultimately improving system reliability, size and cost. Chapter 1 introduces the basic power system based on an inductive switching circuit, and the various components that determine its efficiency. Chapter 2 presents a novel Trench Fast Recovery Diode (FRD) structure with injection control is proposed in this dissertation. The proposed structure achieves improved carrier profile without the need for excess lifetime control. This substantially improves the device performance, especially at extreme temperatures (-40oC to 175oC). The device maintains low leakage at high temperatures, and it\u27s Qrr and Irm do not degrade as is the usual case in heavily electron radiated devices. A 1600 diode using this structure has been developed, with a low forward turn-on voltage and good reverse recovery properties. The experimental results show that the structure maintains its performance at high temperatures. In chapter 3, we develop a termination scheme for the previously mentioned diode. A major limitation on the performance of high voltage power semiconductor is the edge termination of the device. It is critical to maintain the breakdown voltage of the device without compromising the reliability of the device by controlling the surface electric field. A good termination structure is critical to the reliability of the power semiconductor device. The proposed termination uses a novel trench MOS with buried guard ring structure to completely eliminate high surface electric field in the silicon region of the termination. The termination scheme was applied towards a 1350 V fast recovery diode, and showed excellent results. It achieved 98% of parallel plane breakdown voltage, with low leakage and no shifts after High Temperature Reverse Bias testing due to mobile ion contamination from packaging mold compound. In chapter 4, we also investigate the device physics behind a superjunction MOSFET structure for improved robustness. The biggest issue with a completely charge balanced MOSFET is decreased robustness in an Unclamped Inductive Switching (UIS) Circuit. The equally charged P and N pillars result in a flat electric field profile, with the peak carrier density closer to the P-N junction at the surface. This results in an almost negligible positive dynamic Rds-on effect in the MOSFET. By changing the charge profile of the P-column, either by increasing it completely or by implementing a graded profile with the heavier P on top, we can change the field profile and shift the carrier density deeper into silicon, increasing the positive dynamic Rds-on effect. Simulation and experimental results are presented to support the theory and understanding. Chapter 5 summarizes all the theories presented and the contributions made by them in the field. It also seeks to highlight future work to be done in these areas

A review of power electronic devices for heavy goods vehicles electrification : performance and reliability

This review explores the performance and reliability of power semiconductor devices required to enable the electrification of heavy goods vehicles (HGVs). HGV electrification can be implemented using (i) batteries charged with ultra-rapid DC charging (350 kW and above); (ii) road electrification with overhead catenaries supplying power through a pantograph to the HGV powertrain; (iii) hydrogen supplying power to the powertrain through a fuel cell; (iv) any combination of the first three technologies. At the heart of the HGV powertrain is the power converter implemented through power semiconductor devices. Given that the HGV powertrain is rated typically between 500 kW and 1 MW, power devices with voltage ratings between 650 V and 1200 V are required for the off-board/on-board charger’s rectifier and DC-DC converter as well as the powertrain DC-AC traction inverter. The power devices available for HGV electrification at 650 V and 1.2 kV levels are SiC planar MOSFETs, SiC Trench MOSFETs, silicon super-junction MOSFETs, SiC Cascode JFETs, GaN HEMTs, GaN Cascode HEMTs and silicon IGBTs. The MOSFETs can be implemented with anti-parallel SiC Schottky diodes or can rely on their body diodes for third quadrant operation. This review examines the various power semiconductor technologies in terms of losses, electrothermal ruggedness under short circuits, avalanche ruggedness, body diode and conduction performance

Driving and Protection of High Density High Temperature Power Module for Electric Vehicle Application

There has been an increasing trend for the commercialization of electric vehicles (EVs) to reduce greenhouse gas emissions and dependence on petroleum. However, a key technical barrier to their wide application is the development of high power density electric drive systems due to limited space within EVs. High temperature environment inherent in EVs further introduces a new level of complexity. Under high power density and high temperature operation, system reliability and safety also become important. This dissertation deals with the development of advanced driving and protection technologies for high temperature high density power module capable of operating under the harsh environment of electric vehicles, while ensuring system reliability and safety under short circuit conditions. Several related research topics will be discussed in this dissertation. First, an active gate driver (AGD) for IGBT modules is proposed to improve their overall switching performance. The proposed one has the capability of reducing the switching loss, delay time, and Miller plateau duration during turn-on and turn-off transient without sacrificing current and voltage stress. Second, a board-level integrated silicon carbide (SiC) MOSFET power module is developed for high temperature and high power density application. Specifically, a silicon-on-insulator (SOI) based gate driver board is designed and fabricated through chip-on-board (COB) technique. Also, a 1200 V / 100 A SiC MOSFET phase-leg power module is developed utilizing high temperature packaging technologies. Third, a comprehensive short circuit ruggedness evaluation and numerical investigation of up-to-date commercial silicon carbide (SiC) MOSFETs is presented. The short circuit capability of three types of commercial 1200 V SiC MOSFETs is tested under various conditions. The experimental short circuit behaviors are compared and analyzed through numerical thermal dynamic simulation. Finally, according to the short circuit ruggedness evaluation results, three short circuit protection methods are proposed to improve the reliability and overall cost of the SiC MOSFET based converter. A comparison is made in terms of fault response time, temperature dependent characteristics, and applications to help designers select a proper protection method