Improved Physical Design for Manufacturing Awareness and Advanced VLSI

Increasing challenges arise with each new semiconductor technology node, especially in advanced nodes, where the industry tries to extract every ounce of benefit as it approaches the limits of physics, through manufacturing-aware design technology co-optimization and design-based equivalent scaling. The increasing complexity of design and process technologies, and ever-more complex design rules, also become hurdles for academic researchers, separating academic researchers from the most up-to-date technical issues.This thesis presents innovative methodologies and optimizations to address the above challenges. There are three directions in this thesis: (i) manufacturing-aware design technology co-optimization; (ii) advanced node design-based equivalent scaling; and (iii) an open source academic detailed routing flow.To realize manufacturing-aware design technology co-optimization, this thesis presents two works: (i) a multi-row detailed placement optimization for neighbor diffusion effect mitigation between neighboring standard cells; and (ii) a post-routing optimization to generate 2D block mask layout for dummy segment removal in self-aligned multiple patterning.To achieve advanced node design-based equivalent scaling, this thesis presents two improved physical design methodologies: (i) a post-placement flop tray generation approach for clock power reduction; and (ii) a detailed placement approach to exploit inter-row M1 routing for congestion and wirelength reduction.To address the increasing gap between academia and industry, this thesis presents two works toward an open source academic detailed routing flow: (i) a complete, robust, scalable and design ruleaware dynamic programming-based pin access analysis framework; and (ii) TritonRoute – the open source detailed router that is capable of delivering DRC-clean detailed routing solutions in advanced nodes.This thesis concludes with a summary of its contributions and open directions for future research

Standard cell optimization and physical design in advanced technology nodes

Integrated circuits (ICs) are at the heart of modern electronics, which rely heavily on the state-of-the-art semiconductor manufacturing technology. The key to pushing forward semiconductor technology is IC feature-size miniaturization. However, this brings ever-increasing design complexities and manufacturing challenges to the $340 billion semiconductor industry. The manufacturing of two-dimensional layout on high-density metal layers depends on complex design-for-manufacturing techniques and sophisticated empirical optimizations, which introduces huge amounts of turnaround time and yield loss in advanced technology nodes. Our study reveals that unidirectional layout design can significantly reduce the manufacturing complexities and improve the yield, which is becoming increasingly adopted in semiconductor industry [61, 89]. The lithography printing of unidirectional layout can be tightly controlled using advanced patterning techniques, such as self-aligned double and quadruple patterning. Despite the manufacturing benefits, unidirectional layout leads to more restrictive solution space and brings significant impacts on the IC design automation ow for routing closure. Notably, unidirectional routing limits the standard cell pin accessibility, which further exacerbates the resource competitions during routing. Moreover, for post-routing optimization, traditional redundant-via insertion has become obsolete under unidirectional routing style, which makes the yield enhancement task extremely challenging. Regardless of complex multiple patterning and design-for-manufacturing approaches, mask optimization through resolution enhancement techniques remains as the key strategy to improve the yield of the semiconductor manufacturing processes. Among them, Sub-Resolution Assist Feature (SRAF) generation is a very important method to improve lithographic process windows. Model-based SRAF generation has been widely used to achieve high accuracy but it is time-consuming and hard to obtain consistent SRAFs. This dissertation proposes novel CAD algorithms and methodologies for standard cell optimization and physical design in advanced technology nodes, which ultimately reduces the design cycle and manufacturing cost of IC design. First, a standard cell pin access optimization engine is proposed to evaluate the pin accessibility of a given standard cell library. We further propose novel pin access planning techniques and concurrent pin access optimizations to efficiently resolve the routing resource competitions, which generates much better routing solutions than state-of-the-art, manufacturing-friendly routers. To systematically improve the manufacturing yield in the post-routing stage, a global optimization engine has been introduced for redundant local-loop insertion considering advanced manufacturing constraints. Finally, we propose the first machine learning-based framework for fast yet consistent SRAF generation with the high quality of results.Electrical and Computer Engineerin

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

The IPS fidelity scale as a guideline to implement Supported Employment

info:eu-repo/semantics/publishe

초미세 회로 설계를 위한 인터커넥트의 타이밍 분석 및 디자인 룰 위반 예측

학위논문 (박사) -- 서울대학교 대학원 : 공과대학 전기·컴퓨터공학부, 2021. 2. 김태환.타이밍 분석 및 디자인 룰 위반 제거는 반도체 칩 제조를 위한 마스크 제작 전에 완료되어야 할 필수 과정이다. 그러나 트랜지스터와 인터커넥트의 변이가 증가하고 있고 디자인 룰 역시 복잡해지고 있기 때문에 타이밍 분석 및 디자인 룰 위반 제거는 초미세 회로에서 더 어려워지고 있다. 본 논문에서는 초미세 설계를 위한 두가지 문제인 타이밍 분석과 디자인 룰 위반에 대해 다룬다. 첫번째로 공정 코너에서 타이밍 분석은 실리콘으로 제작된 회로의 성능을 정확히 예측하지 못한다. 그 이유는 공정 코너에서 가장 느린 타이밍 경로가 모든 공정 조건에서도 가장 느린 것은 아니기 때문이다. 게다가 칩 내의 임계 경로에서 인터커넥트에 의한 지연 시간이 전체 지연 시간에서의 영향이 증가하고 있고, 10나노 이하 공정에서는 20%를 초과하고 있다. 즉, 실리콘으로 제작된 회로의 성능을 정확히 예측하기 위해서는 대표 회로가 트랜지스터의 변이 뿐만아니라 인터커넥트의 변이도 반영해야한다. 인터커넥트를 구성하는 금속이 10층 이상 사용되고 있고, 각 층을 구성하는 금속의 저항과 캐패시턴스와 비아 저항이 모두 회로 지연 시간에 영향을 주기 때문에 대표 회로를 찾는 문제는 차원이 매우 높은 영역에서 최적의 해를 찾는 방법이 필요하다. 이를 위해 인터커넥트를 제작하는 공정(백 엔드 오브 라인)의 변이를 반영한 대표 회로를 생성하는 방법을 제안하였다. 공정 변이가 없을때 가장 느린 타이밍 경로에 사용된 게이트와 라우팅 패턴을 변경하면서 점진적으로 탐색하는 방법이다. 구체적으로, 본 논문에서 제안하는 합성 프레임워크는 다음의 새로운 기술들을 통합하였다: (1) 라우팅을 구성하는 여러 금속 층과 비아를 추출하고 탐색 시간 감소를 위해 유사한 구성들을 같은 범주로 분류하였다. (2) 빠르고 정확한 타이밍 분석을 위하여 여러 금속 층과 비아들의 변이를 수식화하였다. (3) 확장성을 고려하여 일반적인 링 오실레이터로 대표회로를 탐색하였다. 두번째로 디자인 룰의 복잡도가 증가하고 있고, 이로 인해 표준 셀들의 인터커넥트를 통한 연결을 진행하는 동안 디자인 룰 위반이 증가하고 있다. 게다가 표준 셀의 크기가 계속 작아지면서 셀들의 연결은 점점 어려워지고 있다. 기존에는 회로 내 모든 표준 셀을 연결하는데 필요한 트랙 수, 가능한 트랙 수, 이들 간의 차이를 이용하여 연결 가능성을 판단하고, 디자인 룰 위반이 발생하지 않도록 셀 배치를 최적화하였다. 그러나 기존 방법은 최신 공정에서는 정확하지 않기 때문에 더 많은 정보를 이용한 회로내 모든 표준 셀 사이의 연결 가능성을 예측하는 방법이 필요하다. 본 논문에서는 기계 학습을 통해 디자인 룰 위반이 발생하는 영역 및 개수를 예측하고 이를 줄이기 위해 표준 셀의 배치를 바꾸는 방법을 제안하였다. 디자인 룰 위반 영역은 이진 분류로 예측하였고 표준 셀의 배치는 디자인 룰 위반 개수를 최소화하는 방향으로 최적화를 수행하였다. 제안하는 프레임워크는 다음의 세가지 기술로 구성되었다: (1) 회로 레이아웃을 여러 개의 정사각형 격자로 나누고 각 격자에서 라우팅을 예측할 수 있는 요소들을 추출한다. (2) 각 격자에서 디자인 룰 위반이 있는지 여부를 판단하는 이진 분류를 수행한다. (3) 메타휴리스틱 최적화 또는 베이지안 최적화를 이용하여 전체 디자인 룰 위반 개수가 감소하도록 각 격자에 있는 표준 셀을 움직인다.Timing analysis and clearing design rule violations are the essential steps for taping out a chip. However, they keep getting harder in deep sub-micron circuits because the variations of transistors and interconnects have been increasing and design rules have become more complex. This dissertation addresses two problems on timing analysis and design rule violations for synthesizing deep sub-micron circuits. Firstly, timing analysis in process corners can not capture post-Si performance accurately because the slowest path in the process corner is not always the slowest one in the post-Si instances. In addition, the proportion of interconnect delay in the critical path on a chip is increasing and becomes over 20% in sub-10nm technologies, which means in order to capture post-Si performance accurately, the representative critical path circuit should reflect not only FEOL (front-end-of-line) but also BEOL (backend-of-line) variations. Since the number of BEOL metal layers exceeds ten and the layers have variation on resistance and capacitance intermixed with resistance variation on vias between them, a very high dimensional design space exploration is necessary to synthesize a representative critical path circuit which is able to provide an accurate performance prediction. To cope with this, I propose a BEOL-aware methodology of synthesizing a representative critical path circuit, which is able to incrementally explore, starting from an initial path circuit on the post-Si target circuit, routing patterns (i.e., BEOL reconfiguring) as well as gate resizing on the path circuit. Precisely, the synthesis framework of critical path circuit integrates a set of novel techniques: (1) extracting and classifying BEOL configurations for lightening design space complexity, (2) formulating BEOL random variables for fast and accurate timing analysis, and (3) exploring alternative (ring oscillator) circuit structures for extending the applicability of this work. Secondly, the complexity of design rules has been increasing and results in more design rule violations during routing. In addition, the size of standard cell keeps decreasing and it makes routing harder. In the conventional P&R flow, the routability of pre-routed layout is predicted by routing congestion obtained from global routing, and then placement is optimized not to cause design rule violations. But it turned out to be inaccurate in advanced technology nodes so that it is necessary to predict routability with more features. I propose a methodology of predicting the hotspots of design rule violations (DRVs) using machine learning with placement related features and the conventional routing congestion, and perturbating placed cells to reduce the number of DRVs. Precisely, the hotspots are predicted by a pre-trained binary classification model and placement perturbation is performed by global optimization methods to minimize the number of DRVs predicted by a pre-trained regression model. To do this, the framework is composed of three techniques: (1) dividing the circuit layout into multiple rectangular grids and extracting features such as pin density, cell density, global routing results (demand, capacity and overflow), and more in the placement phase, (2) predicting if each grid has DRVs using a binary classification model, and (3) perturbating the placed standard cells in the hotspots to minimize the number of DRVs predicted by a regression model.1 Introduction 1 1.1 Representative Critical Path Circuit . . . . . . . . . . . . . . . . . . . 1 1.2 Prediction of Design Rule Violations and Placement Perturbation . . . 5 1.3 Contributions of This Dissertation . . . . . . . . . . . . . . . . . . . 7 2 Methodology for Synthesizing Representative Critical Path Circuits reflecting BEOL Timing Variation 9 2.1 Motivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2 Definitions and Overall Flow . . . . . . . . . . . . . . . . . . . . . . 12 2.3 Techniques for BEOL-Aware RCP Generation . . . . . . . . . . . . . 17 2.3.1 Clustering BEOL Configurations . . . . . . . . . . . . . . . . 17 2.3.2 Formulating Statistical BEOL Random Variables . . . . . . . 18 2.3.3 Delay Modeling . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.4 Exploring Ring Oscillator Circuit Structures . . . . . . . . . . 24 2.4 Experimental Results . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2.5 Further Study on Variations . . . . . . . . . . . . . . . . . . . . . . . 37 3 Methodology for Reducing Routing Failures through Enhanced Prediction on Design Rule Violations in Placement 39 3.1 Motivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.2 Overall Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 3.3 Techniques for Reducing Routing Failures . . . . . . . . . . . . . . . 43 3.3.1 Binary Classification . . . . . . . . . . . . . . . . . . . . . . 43 3.3.2 Regression . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 3.3.3 Optimization . . . . . . . . . . . . . . . . . . . . . . . . . . 46 3.3.4 Placement Perturbation . . . . . . . . . . . . . . . . . . . . . 47 3.4 Experiments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 3.4.1 Experiments Setup . . . . . . . . . . . . . . . . . . . . . . . 51 3.4.2 Hotspot Prediction . . . . . . . . . . . . . . . . . . . . . . . 51 3.4.3 Regression . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 3.4.4 Placement Perturbation . . . . . . . . . . . . . . . . . . . . . 57 4 Conclusions 61 4.1 Synthesis of Representative Critical Path Circuits reflecting BEOL Timing Variation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 4.2 Reduction of Routing Failures through Enhanced Prediction on Design Rule Violations in Placement . . . . . . . . . . . . . . . . . . . . . . 62 Abstract (In Korean) 69Docto

Rapid SoC Design: On Architectures, Methodologies and Frameworks

Modern applications like machine learning, autonomous vehicles, and 5G networking require an order of magnitude boost in processing capability. For several decades, chip designers have relied on Moore’s Law - the doubling of transistor count every two years to deliver improved performance, higher energy efficiency, and an increase in transistor density. With the end of Dennard’s scaling and a slowdown in Moore’s Law, system architects have developed several techniques to deliver on the traditional performance and power improvements we have come to expect. More recently, chip designers have turned towards heterogeneous systems comprised of more specialized processing units to buttress the traditional processing units. These specialized units improve the overall performance, power, and area (PPA) metrics across a wide variety of workloads and applications. While the GPU serves as a classical example, accelerators for machine learning, approximate computing, graph processing, and database applications have become commonplace. This has led to an exponential growth in the variety (and count) of these compute units found in modern embedded and high-performance computing platforms. The various techniques adopted to combat the slowing of Moore’s Law directly translates to an increase in complexity for modern system-on-chips (SoCs). This increase in complexity in turn leads to an increase in design effort and validation time for hardware and the accompanying software stacks. This is further aggravated by fabrication challenges (photo-lithography, tooling, and yield) faced at advanced technology nodes (below 28nm). The inherent complexity in modern SoCs translates into increased costs and time-to-market delays. This holds true across the spectrum, from mobile/handheld processors to high-performance data-center appliances. This dissertation presents several techniques to address the challenges of rapidly birthing complex SoCs. The first part of this dissertation focuses on foundations and architectures that aid in rapid SoC design. It presents a variety of architectural techniques that were developed and leveraged to rapidly construct complex SoCs at advanced process nodes. The next part of the dissertation focuses on the gap between a completed design model (in RTL form) and its physical manifestation (a GDS file that will be sent to the foundry for fabrication). It presents methodologies and a workflow for rapidly walking a design through to completion at arbitrary technology nodes. It also presents progress on creating tools and a flow that is entirely dependent on open-source tools. The last part presents a framework that not only speeds up the integration of a hardware accelerator into an SoC ecosystem, but emphasizes software adoption and usability.PHDElectrical and Computer EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/168119/1/ajayi_1.pd

Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi.Postprint (published version

Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi