AUTOMATED WRAPPER DESIGN FOR ISCAS ’89 BENCHMARK CIRCUITS

System-on-chip (SOC) enables the reuse of existing IP blocks in a system, thereby making it possible to design complex systems within a short period of time. With the complexity of the design comes the problem of testing the SOC. A typical SOC can integrate many modules, therefore making it difficult to test these individual modules by accessing from the primary interfaces of the chip. To aleviate this test access issue for SOC‟s, the IEEE 1500 standard has been introduced. There are commercial tools from main EDA players such as Synopsys that can help with the insertion of the IEEE 1500 wrapper. However, most researchers have no access to the expensive tool. Even if they do, the tools are protected so they do not allow researchers access to the internal features to explore potential enhancements. There is no open source tools that can assist test researchers with the 1500 wrapper insertion. In this thesis, we illustrate our effort at automating the IEEE 1500 wrapper insertion. The design of the IEEE 1500 wrapper is done in Verilog and the automation is done using the Perl scripting language. The inserted wrapper modules are validated and an efficient approach of executing wrapper external tests is also illustrated in this thesis

Studies on Core-Based Testing of System-on-Chips Using Functional Bus and Network-on-Chip Interconnects

The tests of a complex system such as a microprocessor-based system-onchip (SoC) or a network-on-chip (NoC) are difficult and expensive. In this thesis, we propose three core-based test methods that reuse the existing functional interconnects-a flat bus, hierarchical buses of multiprocessor SoC's (MPSoC), and a N oC-in order to avoid the silicon area cost of a dedicated test access mechanism (TAM). However, the use of functional interconnects as functional TAM's introduces several new problems. During tests, the interconnects-including the bus arbitrator, the bus bridges, and the NoC routers-operate in the functional mode to transport the test stimuli and responses, while the core under tests (CUT) operate in the test mode. Second, the test data is transported to the CUT through the functional bus, and not directly to the test port. Therefore, special core test wrappers that can provide the necessary control signals required by the different functional interconnect are proposed. We developed two types of wrappers, one buffer-based wrapper for the bus-based systems and another pair of complementary wrappers for the NoCbased systems. Using the core test wrappers, we propose test scheduling schemes for the three functionally different types of interconnects. The test scheduling scheme for a flat bus is developed based on an efficient packet scheduling scheme that minimizes both the buffer sizes and the test time under a power constraint. The schedulingscheme is then extended to take advantage of the hierarchical bus architecture of the MPSoC systems. The third test scheduling scheme based on the bandwidth sharing is developed specifically for the NoC-based systems. The test scheduling is performed under the objective of co-optimizing the wrapper area cost and the resulting test application time using the two complementary NoC wrappers. For each of the proposed methodology for the three types of SoC architec .. ture, we conducted a thorough experimental evaluation in order to verify their effectiveness compared to other methods

A Hardware Security Solution against Scan-Based Attacks

Scan based Design for Test (DfT) schemes have been widely used to achieve high fault coverage for integrated circuits. The scan technique provides full access to the internal nodes of the device-under-test to control them or observe their response to input test vectors. While such comprehensive access is highly desirable for testing, it is not acceptable for secure chips as it is subject to exploitation by various attacks. In this work, new methods are presented to protect the security of critical information against scan-based attacks. In the proposed methods, access to the circuit containing secret information via the scan chain has been severely limited in order to reduce the risk of a security breach. To ensure the testability of the circuit, a built-in self-test which utilizes an LFSR as the test pattern generator (TPG) is proposed. The proposed schemes can be used as a countermeasure against side channel attacks with a low area overhead as compared to the existing solutions in literature

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements

SoC Test: Trends and Recent Standards

The well-known approaching test cost crisis, where semiconductor test costs begin to approach or exceed manufacturing costs has led test engineers to apply new solutions to the problem of testing System-On-Chip (SoC) designs containing multiple IP (Intellectual Property) cores. While it is not yet possible to apply generic test architectures to an IP core within a SoC, the emergence of a number of similar approaches, and the release of new industry standards, such as IEEE 1500 and IEEE 1450.6, may begin to change this situation. This paper looks at these standards and at some techniques currently used by SoC test engineers. An extensive reference list is included, reflecting the purpose of this publication as a review paper

Immunotronics - novel finite-state-machine architectures with built-in self-test using self-nonself differentiation

A novel approach to hardware fault tolerance is demonstrated that takes inspiration from the human immune system as a method of fault detection. The human immune system is a remarkable system of interacting cells and organs that protect the body from invasion and maintains reliable operation even in the presence of invading bacteria or viruses. This paper seeks to address the field of electronic hardware fault tolerance from an immunological perspective with the aim of showing how novel methods based upon the operation of the immune system can both complement and create new approaches to the development of fault detection mechanisms for reliable hardware systems. In particular, it is shown that by use of partial matching, as prevalent in biological systems, high fault coverage can be achieved with the added advantage of reducing memory requirements. The development of a generic finite-state-machine immunization procedure is discussed that allows any system that can be represented in such a manner to be "immunized" against the occurrence of faulty operation. This is demonstrated by the creation of an immunized decade counter that can detect the presence of faults in real tim

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

<p>As integrated circuits (ICs) continue to scale to smaller dimensions, long interconnects</p><p>have become the dominant contributor to circuit delay and a significant component of</p><p>power consumption. In order to reduce the length of these interconnects, 3D integration</p><p>and 3D stacked ICs (3D SICs) are active areas of research in both academia and industry.</p><p>3D SICs not only have the potential to reduce average interconnect length and alleviate</p><p>many of the problems caused by long global interconnects, but they can offer greater design</p><p>flexibility over 2D ICs, significant reductions in power consumption and footprint in</p><p>an era of mobile applications, increased on-chip data bandwidth through delay reduction,</p><p>and improved heterogeneous integration.</p><p>Compared to 2D ICs, the manufacture and test of 3D ICs is significantly more complex.</p><p>Through-silicon vias (TSVs), which constitute the dense vertical interconnects in a</p><p>die stack, are a source of additional and unique defects not seen before in ICs. At the same</p><p>time, testing these TSVs, especially before die stacking, is recognized as a major challenge.</p><p>The testing of a 3D stack is constrained by limited test access, test pin availability,</p><p>power, and thermal constraints. Therefore, efficient and optimized test architectures are</p><p>needed to ensure that pre-bond, partial, and complete stack testing are not prohibitively</p><p>expensive.</p><p>Methods of testing TSVs prior to bonding continue to be a difficult problem due to test</p><p>access and testability issues. Although some built-in self-test (BIST) techniques have been</p><p>proposed, these techniques have numerous drawbacks that render them impractical. In this dissertation, a low-cost test architecture is introduced to enable pre-bond TSV test through</p><p>TSV probing. This has the benefit of not needing large analog test components on the die,</p><p>which is a significant drawback of many BIST architectures. Coupled with an optimization</p><p>method described in this dissertation to create parallel test groups for TSVs, test time for</p><p>pre-bond TSV tests can be significantly reduced. The pre-bond probing methodology is</p><p>expanded upon to allow for pre-bond scan test as well, to enable both pre-bond TSV and</p><p>structural test to bring pre-bond known-good-die (KGD) test under a single test paradigm.</p><p>The addition of boundary registers on functional TSV paths required for pre-bond</p><p>probing results in an increase in delay on inter-die functional paths. This cost of test</p><p>architecture insertion can be a significant drawback, especially considering that one benefit</p><p>of 3D integration is that critical paths can be partitioned between dies to reduce their delay.</p><p>This dissertation derives a retiming flow that is used to recover the additional delay added</p><p>to TSV paths by test cell insertion.</p><p>Reducing the cost of test for 3D-SICs is crucial considering that more tests are necessary</p><p>during 3D-SIC manufacturing. To reduce test cost, the test architecture and test</p><p>scheduling for the stack must be optimized to reduce test time across all necessary test</p><p>insertions. This dissertation examines three paradigms for 3D integration - hard dies, firm</p><p>dies, and soft dies, that give varying degrees of control over 2D test architectures on each</p><p>die while optimizing the 3D test architecture. Integer linear programming models are developed</p><p>to provide an optimal 3D test architecture and test schedule for the dies in the 3D</p><p>stack considering any or all post-bond test insertions. Results show that the ILP models</p><p>outperform other optimization methods across a range of 3D benchmark circuits.</p><p>In summary, this dissertation targets testing and design-for-test (DFT) of 3D SICs.</p><p>The proposed techniques enable pre-bond TSV and structural test while maintaining a</p><p>relatively low test cost. Future work will continue to enable testing of 3D SICs to move</p><p>industry closer to realizing the true potential of 3D integration.</p>Dissertatio