Low-Power Embedded Design Solutions and Low-Latency On-Chip Interconnect Architecture for System-On-Chip Design

This dissertation presents three design solutions to support several key system-on-chip (SoC) issues to achieve low-power and high performance. These are: 1) joint source and channel decoding (JSCD) schemes for low-power SoCs used in portable multimedia systems, 2) efficient on-chip interconnect architecture for massive multimedia data streaming on multiprocessor SoCs (MPSoCs), and 3) data processing architecture for low-power SoCs in distributed sensor network (DSS) systems and its implementation. The first part includes a low-power embedded low density parity check code (LDPC) - H.264 joint decoding architecture to lower the baseband energy consumption of a channel decoder using joint source decoding and dynamic voltage and frequency scaling (DVFS). A low-power multiple-input multiple-output (MIMO) and H.264 video joint detector/decoder design that minimizes energy for portable, wireless embedded systems is also designed. In the second part, a link-level quality of service (QoS) scheme using unequal error protection (UEP) for low-power network-on-chip (NoC) and low latency on-chip network designs for MPSoCs is proposed. This part contains WaveSync, a low-latency focused network-on-chip architecture for globally-asynchronous locally-synchronous (GALS) designs and a simultaneous dual-path routing (SDPR) scheme utilizing path diversity present in typical mesh topology network-on-chips. SDPR is akin to having a higher link width but without the significant hardware overhead associated with simple bus width scaling. The last part shows data processing unit designs for embedded SoCs. We propose a data processing and control logic design for a new radiation detection sensor system generating data at or above Peta-bits-per-second level. Implementation results show that the intended clock rate is achieved within the power target of less than 200mW. We also present a digital signal processing (DSP) accelerator supporting configurable MAC, FFT, FIR, and 3-D cross product operations for embedded SoCs. It consumes 12.35mW along with 0.167mm2 area at 333MHz

CROSS-LAYER CUSTOMIZATION FOR LOW POWER AND HIGH PERFORMANCE EMBEDDED MULTI-CORE PROCESSORS

Due to physical limitations and design difficulties, computer processor architecture has shifted to multi-core and even many-core based approaches in recent years. Such architectures provide potentials for sustainable performance scaling into future peta-scale/exa-scale computing platforms, at affordable power budget, design complexity, and verification efforts. To date, multi-core processor products have been replacing uni-core processors in almost every market segment, including embedded systems, general-purpose desktops and laptops, and super computers. However, many issues still remain with multi-core processor architectures that need to be addressed before their potentials could be fully realized. People in both academia and industry research community are still seeking proper ways to make efficient and effective use of these processors. The issues involve hardware architecture trade-offs, the system software service, the run-time management, and user application design, which demand more research effort into this field. Due to the architectural specialties with multi-core based computers, a Cross-Layer Customization framework is proposed in this work, which combines application specific information and system platform features, along with necessary operating system service support, to achieve exceptional power and performance efficiency for targeted multi-core platforms. Several topics are covered with specific optimization goals, including snoop cache coherence protocol, inter-core communication for producer-consumer applications, synchronization mechanisms, and off-chip memory bandwidth limitations. Analysis of benchmark program execution with conventional mechanisms is made to reveal the overheads in terms of power and performance. Specific customizations are proposed to eliminate such overheads with support from hardware, system software, compiler, and user applications. Experiments show significant improvement on system performance and power efficiency

Architectural Support for Efficient Communication in Future Microprocessors

Traditionally, the microprocessor design has focused on the computational aspects of the problem at hand. However, as the number of components on a single chip continues to increase, the design of communication architecture has become a crucial and dominating factor in defining performance models of the overall system. On-chip networks, also known as Networks-on-Chip (NoC), emerged recently as a promising architecture to coordinate chip-wide communication. Although there are numerous interconnection network studies in an inter-chip environment, an intra-chip network design poses a number of substantial challenges to this well-established interconnection network field. This research investigates designs and applications of on-chip interconnection network in next-generation microprocessors for optimizing performance, power consumption, and area cost. First, we present domain-specific NoC designs targeted to large-scale and wire-delay dominated L2 cache systems. The domain-specifically designed interconnect shows 38% performance improvement and uses only 12% of the mesh-based interconnect. Then, we present a methodology of communication characterization in parallel programs and application of characterization results to long-channel reconfiguration. Reconfigured long channels suited to communication patterns enhance the latency of the mesh network by 16% and 14% in 16-core and 64-core systems, respectively. Finally, we discuss an adaptive data compression technique that builds a network-wide frequent value pattern map and reduces the packet size. In two examined multi-core systems, cache traffic has 69% compressibility and shows high value sharing among flows. Compression-enabled NoC improves the latency by up to 63% and saves energy consumption by up to 12%

Analytical Query Execution Optimized for all Layers of Modern Hardware

Analytical database queries are at the core of business intelligence and decision support. To analyze the vast amounts of data available today, query execution needs to be orders of magnitude faster. Hardware advances have made a profound impact on database design and implementation. The large main memory capacity allows queries to execute exclusively in memory and shifts the bottleneck from disk access to memory bandwidth. In the new setting, to optimize query performance, databases must be aware of an unprecedented multitude of complicated hardware features. This thesis focuses on the design and implementation of highly efficient database systems by optimizing analytical query execution for all layers of modern hardware. The hardware layers include the network across multiple machines, main memory and the NUMA interconnection across multiple processors, the multiple levels of caches across multiple processor cores, and the execution pipeline within each core. For the network layer, we introduce a distributed join algorithm that minimizes the network traffic. For the memory hierarchy, we describe partitioning variants aware to the dynamics of the CPU caches and the NUMA interconnection. To improve the memory access rate of linear scans, we optimize lightweight compression variants and evaluate their trade-offs. To accelerate query execution within the core pipeline, we introduce advanced SIMD vectorization techniques generalizable across multiple operators. We evaluate our algorithms and techniques on both mainstream hardware and on many-integrated-core platforms, and combine our techniques in a new query engine design that can better utilize the features of many-core CPUs. In the era of hardware becoming increasingly parallel and datasets consistently growing in size, this thesis can serve as a compass for developing hardware-conscious databases with truly high-performance analytical query execution

GDP : using dataflow properties to accurately estimate interference-free performance at runtime

Multi-core memory systems commonly share resources between processors. Resource sharing improves utilization at the cost of increased inter-application interference which may lead to priority inversion, missed deadlines and unpredictable interactive performance. A key component to effectively manage multi-core resources is performance accounting which aims to accurately estimate interference-free application performance. Previously proposed accounting systems are either invasive or transparent. Invasive accounting systems can be accurate, but slow down latency-sensitive processes. Transparent accounting systems do not affect performance, but tend to provide less accurate performance estimates. We propose a novel class of performance accounting systems that achieve both performance-transparency and superior accuracy. We call the approach dataflow accounting, and the key idea is to track dynamic dataflow properties and use these to estimate interference-free performance. Our main contribution is Graph-based Dynamic Performance (GDP) accounting. GDP dynamically builds a dataflow graph of load requests and periods where the processor commits instructions. This graph concisely represents the relationship between memory loads and forward progress in program execution. More specifically, GDP estimates interference-free stall cycles by multiplying the critical path length of the dataflow graph with the estimated interference-free memory latency. GDP is very accurate with mean IPC estimation errors of 3.4% and 9.8% for our 4- and 8-core processors, respectively. When GDP is used in a cache partitioning policy, we observe average system throughput improvements of 11.9% and 20.8% compared to partitioning using the state-of-the-art Application Slowdown Model

근사 컴퓨팅을 이용한 회로 노화 보상과 에너지 효율적인 신경망 구현

학위논문 (박사) -- 서울대학교 대학원 : 공과대학 전기·정보공학부, 2020. 8. 이혁재.Approximate computing reduces the cost (energy and/or latency) of computations by relaxing the correctness (i.e., precision) of computations up to the level, which is dependent on types of applications. Moreover, it can be realized in various hierarchies of computing system design from circuit level to application level. This dissertation presents the methodologies applying approximate computing across such hierarchies; compensating aging-induced delay in logic circuit by dynamic computation approximation (Chapter 1), designing energy-efficient neural network by combining low-power and low-latency approximate neuron models (Chapter 2), and co-designing in-memory gradient descent module with neural processing unit so as to address a memory bottleneck incurred by memory I/O for high-precision data (Chapter 3). The first chapter of this dissertation presents a novel design methodology to turn the timing violation caused by aging into computation approximation error without the reliability guardband or increasing the supply voltage. It can be realized by accurately monitoring the critical path delay at run-time. The proposal is evaluated at two levels: RTL component level and system level. The experimental results at the RTL component level show a significant improvement in terms of (normalized) mean squared error caused by the timing violation and, at the system level, show that the proposed approach successfully transforms the aging-induced timing violation errors into much less harmful computation approximation errors, therefore it recovers image quality up to perceptually acceptable levels. It reduces the dynamic and static power consumption by 21.45% and 10.78%, respectively, with 0.8% area overhead compared to the conventional approach. The second chapter of this dissertation presents an energy-efficient neural network consisting of alternative neuron models; Stochastic-Computing (SC) and Spiking (SP) neuron models. SC has been adopted in various fields to improve the power efficiency of systems by performing arithmetic computations stochastically, which approximates binary computation in conventional computing systems. Moreover, a recent work showed that deep neural network (DNN) can be implemented in the manner of stochastic computing and it greatly reduces power consumption. However, Stochastic DNN (SC-DNN) suffers from problem of high latency as it processes only a bit per cycle. To address such problem, it is proposed to adopt Spiking DNN (SP-DNN) as an input interface for SC-DNN since SP effectively processes more bits per cycle than SC-DNN. Moreover, this chapter resolves the encoding mismatch problem, between two different neuron models, without hardware cost by compensating the encoding mismatch with synapse weight calibration. A resultant hybrid DNN (SPSC-DNN) consists of SP-DNN as bottom layers and SC-DNN as top layers. Exploiting the reduced latency from SP-DNN and low-power consumption from SC-DNN, the proposed SPSC-DNN achieves improved energy-efficiency with lower error-rate compared to SC-DNN and SP-DNN in same network configuration. The third chapter of this dissertation proposes GradPim architecture, which accelerates the parameter updates by in-memory processing which is codesigned with 8-bit floating-point training in Neural Processing Unit (NPU) for deep neural networks. By keeping the high precision processing algorithms in memory, such as the parameter update incorporating high-precision weights in its computation, the GradPim architecture can achieve high computational efficiency using 8-bit floating point in NPU and also gain power efficiency by eliminating massive high-precision data transfers between NPU and off-chip memory. A simple extension of DDR4 SDRAM utilizing bank-group parallelism makes the operation designs in processing-in-memory (PIM) module efficient in terms of hardware cost and performance. The experimental results show that the proposed architecture can improve the performance of the parameter update phase in the training by up to 40% and greatly reduce the memory bandwidth requirement while posing only a minimal amount of overhead to the protocol and the DRAM area.근사 컴퓨팅은 연산의 정확도의 손실을 어플리케이션 별 적절한 수준까지 허용함으로써 연산에 필요한 비용 (에너지나 지연시간)을 줄인다. 게다가, 근사 컴퓨팅은 컴퓨팅 시스템 설계의 회로 계층부터 어플리케이션 계층까지 다양한 계층에 적용될 수 있다. 본 논문에서는 근사 컴퓨팅 방법론을 다양한 시스템 설계의 계층에 적용하여 전력과 에너지 측면에서 이득을 얻을 수 있는 방법들을 제안하였다. 이는, 연산 근사화 (computation Approximation)를 통해 회로의 노화로 인해 증가된 지연시간을 추가적인 전력소모 없이 보상하는 방법과 (챕터 1), 근사 뉴런모델 (approximate neuron model)을 이용해 에너지 효율이 높은 신경망을 구성하는 방법 (챕터 2), 그리고 메모리 대역폭으로 인한 병목현상 문제를 높은 정확도 데이터를 활용한 연산을 메모리 내에서 수행함으로써 완화시키는 방법을 (챕터3) 제안하였다. 첫 번째 챕터는 회로의 노화로 인한 지연시간위반을 (timing violation) 설계마진이나 (reliability guardband) 공급전력의 증가 없이 연산오차 (computation approximation error)를 통해 보상하는 설계방법론 (design methodology)를 제안하였다. 이를 위해 주요경로의 (critical path) 지연시간을 동작시간에 정확하게 측정할 필요가 있다. 여기서 제안하는 방법론은 RTL component와 system 단계에서 평가되었다. RTL component 단계의 실험결과를 통해 제안한 방식이 표준화된 평균제곱오차를 (normalized mean squared error) 상당히 줄였음을 볼 수 있다. 그리고 system 단계에서는 이미지처리 시스템에서 이미지의 품질이 인지적으로 충분히 회복되는 것을 보임으로써 회로노화로 인해 발생한 지연시간위반 오차가 에러의 크기가 작은 연산오차로 변경되는 것을 확인 할 수 있었다. 결론적으로, 제안된 방법론을 따랐을 때 0.8%의 공간을 (area) 더 사용하는 비용을 지불하고 21.45%의 동적전력소모와 (dynamic power consumption) 10.78%의 정적전력소모의 (static power consumption) 감소를 달성할 수 있었다. 두 번째 챕터는 근사 뉴런모델을 활용하는 고-에너지효율의 신경망을 (neural network) 제안하였다. 본 논문에서 사용한 두 가지의 근사 뉴런모델은 확률컴퓨팅과 (stochastic computing) 스파이킹뉴런 (spiking neuron) 이론들을 기반으로 모델링되었다. 확률컴퓨팅은 산술연산들을 확률적으로 수행함으로써 이진연산을 낮은 전력소모로 수행한다. 최근에 확률컴퓨팅 뉴런모델을 이용하여 심층 신경망 (deep neural network)를 구현할 수 있다는 연구가 진행되었다. 그러나, 확률컴퓨팅을 뉴런모델링에 활용할 경우 심층신경망이 매 클락사이클마다 (clock cycle) 하나의 비트만을 (bit) 처리하므로, 지연시간 측면에서 매우 나쁠 수 밖에 없는 문제가 있다. 따라서 본 논문에서는 이러한 문제를 해결하기 위하여 스파이킹 뉴런모델로 구성된 스파이킹 심층신경망을 확률컴퓨팅을 활용한 심층신경망 구조와 결합하였다. 스파이킹 뉴런모델의 경우 매 클락사이클마다 여러 비트를 처리할 수 있으므로 심층신경망의 입력 인터페이스로 사용될 경우 지연시간을 줄일 수 있다. 하지만, 확률컴퓨팅 뉴런모델과 스파이킹 뉴런모델의 경우 부호화 (encoding) 방식이 다른 문제가 있다. 따라서 본 논문에서는 해당 부호화 불일치 문제를 모델의 파라미터를 학습할 때 고려함으로써, 파라미터들의 값이 부호화 불일치를 고려하여 조절 (calibration) 될 수 있도록 하여 문제를 해결하였다. 이러한 분석의 결과로, 앞 쪽에는 스파이킹 심층신경망을 배치하고 뒷 쪽애는 확률컴퓨팅 심층신경망을 배치하는 혼성신경망을 제안하였다. 혼성신경망은 스파이킹 심층신경망을 통해 매 클락사이클마다 처리되는 비트 양의 증가로 인한 지연시간 감소 효과와 확률컴퓨팅 심층신경망의 저전력 소모 특성을 모두 활용함으로써 각 심층신경망을 따로 사용하는 경우 대비 우수한 에너지 효율성을 비슷하거나 더 나은 정확도 결과를 내면서 달성한다. 세 번째 챕터는 심층신경망을 8비트 부동소숫점 연산으로 학습하는 신경망처리유닛의 (neural processing unit) 파라미터 갱신을 (parameter update) 메모리-내-연산으로 (in-memory processing) 가속하는 GradPIM 아키텍쳐를 제안하였다. GradPIM은 8비트의 낮은 정확도 연산은 신경망처리유닛에 남기고, 높은 정확도를 가지는 데이터를 활용하는 연산은 (파라미터 갱신) 메모리 내부에 둠으로써 신경망처리유닛과 메모리간의 데이터통신의 양을 줄여, 높은 연산효율과 전력효율을 달성하였다. 또한, GradPIM은 bank-group 수준의 병렬화를 이루어 내 높은 내부 대역폭을 활용함으로써 메모리 대역폭을 크게 확장시킬 수 있게 되었다. 또한 이러한 메모리 구조의 변경이 최소화되었기 때문에 추가적인 하드웨어 비용도 최소화되었다. 실험 결과를 통해 GradPIM이 최소한의 DRAM 프로토콜 변화와 DRAM칩 내의 공간사용을 통해 심층신경망 학습과정 중 파라미터 갱신에 필요한 시간을 40%만큼 향상시켰음을 보였다.Chapter I: Dynamic Computation Approximation for Aging Compensation 1 1.1 Introduction 1 1.1.1 Chip Reliability 1 1.1.2 Reliability Guardband 2 1.1.3 Approximate Computing in Logic Circuits 2 1.1.4 Computation approximation for Aging Compensation 3 1.1.5 Motivational Case Study 4 1.2 Previous Work 5 1.2.1 Aging-induced Delay 5 1.2.2 Delay-Configurable Circuits 6 1.3 Proposed System 8 1.3.1 Overview of the Proposed System 8 1.3.2 Proposed Adder 9 1.3.3 Proposed Multiplier 11 1.3.4 Proposed Monitoring Circuit 16 1.3.5 Aging Compensation Scheme 19 1.4 Design Methodology 20 1.5 Evaluation 24 1.5.1 Experimental setup 24 1.5.2 RTL component level Adder/Multiplier 27 1.5.3 RTL component level Monitoring circuit 30 1.5.4 System level 31 1.6 Summary 38 Chapter II: Energy-Efficient Neural Network by Combining Approximate Neuron Models 40 2.1 Introduction 40 2.1.1 Deep Neural Network (DNN) 40 2.1.2 Low-power designs for DNN 41 2.1.3 Stochastic-Computing Deep Neural Network 41 2.1.4 Spiking Deep Neural Network 43 2.2 Hybrid of Stochastic and Spiking DNNs 44 2.2.1 Stochastic-Computing vs Spiking Deep Neural Network 44 2.2.2 Combining Spiking Layers and Stochastic Layers 46 2.2.3 Encoding Mismatch 47 2.3 Evaluation 49 2.3.1 Latency and Test Error 49 2.3.2 Energy Efficiency 51 2.4 Summary 54 Chapter III: GradPIM: In-memory Gradient Descent in Mixed-Precision DNN Training 55 3.1 Introduction 55 3.1.1 Neural Processing Unit 55 3.1.2 Mixed-precision Training 56 3.1.3 Mixed-precision Training with In-memory Gradient Descent 57 3.1.4 DNN Parameter Update Algorithms 59 3.1.5 Modern DRAM Architecture 61 3.1.6 Motivation 63 3.2 Previous Work 65 3.2.1 Processing-In-Memory 65 3.2.2 Co-design Neural Processing Unit and Processing-In-Memory 66 3.2.3 Low-precision Computation in NPU 67 3.3 GradPIM 68 3.3.1 GradPIM Architecture 68 3.3.2 GradPIM Operations 69 3.3.3 Timing Considerations 70 3.3.4 Update Phase Procedure 73 3.3.5 Commanding GradPIM 75 3.4 NPU Co-design with GradPIM 76 3.4.1 NPU Architecture 76 3.4.2 Data Placement 79 3.5 Evaluation 82 3.5.1 Evaluation Methodology 82 3.5.2 Experimental Results 83 3.5.3 Sensitivity Analysis 88 3.5.4 Layer Characterizations 90 3.5.5 Distributed Data Parallelism 90 3.6 Summary 92 3.6.1 Discussion 92 Bibliography 113 요약 114Docto

Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Design and Code Optimization for Systems with Next-generation Racetrack Memories

With the rise of computationally expensive application domains such as machine learning, genomics, and fluids simulation, the quest for performance and energy-efficient computing has gained unprecedented momentum. The significant increase in computing and memory devices in modern systems has resulted in an unsustainable surge in energy consumption, a substantial portion of which is attributed to the memory system. The scaling of conventional memory technologies and their suitability for the next-generation system is also questionable. This has led to the emergence and rise of nonvolatile memory ( NVM ) technologies. Today, in different development stages, several NVM technologies are competing for their rapid access to the market. Racetrack memory ( RTM ) is one such nonvolatile memory technology that promises SRAM -comparable latency, reduced energy consumption, and unprecedented density compared to other technologies. However, racetrack memory ( RTM ) is sequential in nature, i.e., data in an RTM cell needs to be shifted to an access port before it can be accessed. These shift operations incur performance and energy penalties. An ideal RTM , requiring at most one shift per access, can easily outperform SRAM . However, in the worst-cast shifting scenario, RTM can be an order of magnitude slower than SRAM . This thesis presents an overview of the RTM device physics, its evolution, strengths and challenges, and its application in the memory subsystem. We develop tools that allow the programmability and modeling of RTM -based systems. For shifts minimization, we propose a set of techniques including optimal, near-optimal, and evolutionary algorithms for efficient scalar and instruction placement in RTMs . For array accesses, we explore schedule and layout transformations that eliminate the longer overhead shifts in RTMs . We present an automatic compilation framework that analyzes static control flow programs and transforms the loop traversal order and memory layout to maximize accesses to consecutive RTM locations and minimize shifts. We develop a simulation framework called RTSim that models various RTM parameters and enables accurate architectural level simulation. Finally, to demonstrate the RTM potential in non-Von-Neumann in-memory computing paradigms, we exploit its device attributes to implement logic and arithmetic operations. As a concrete use-case, we implement an entire hyperdimensional computing framework in RTM to accelerate the language recognition problem. Our evaluation shows considerable performance and energy improvements compared to conventional Von-Neumann models and state-of-the-art accelerators

The Department of Electrical and Computer Engineering Newsletter

Summer 2017 News and notes for University of Dayton\u27s Department of Electrical and Computer Engineering.https://ecommons.udayton.edu/ece_newsletter/1010/thumbnail.jp

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems