Doctor of Philosophy in Computing

dissertationThe demand for main memory capacity has been increasing for many years and will continue to do so. In the past, Dynamic Random Access Memory (DRAM) process scaling has enabled this increase in memory capacity. Along with continued DRAM scaling, the emergence of new technologies like 3D-stacking, buffered Dual Inline Memory Modules (DIMMs), and crosspoint nonvolatile memory promise to continue this trend in the years ahead. However, these technologies will bring with them their own gamut of problems. In this dissertation, I look at the problems facing these technologies from a current delivery perspective. 3D-stacking increases memory capacity available per package, but the increased current requirement means that more pins on the package have to be now dedicated to provide Vdd/Vss, hence increasing cost. At the system level, using buffered DIMMs to increase the number of DRAM ranks increases the peak current requirements of the system if all the DRAM chips in the system are Refreshed simultaneously. Crosspoint memories promise to greatly increase bit densities but have long read latencies because of sneak currents in the cross-bar. In this dissertation, I provide architectural solutions to each of these problems. We observe that smart data placement by the architecture and the Operating System (OS) is a vital ingredient in all of these solutions. We thereby mitigate major bottlenecks in these technologies, hence enabling higher memory densities

Radiation Hardened by Design Methodologies for Soft-Error Mitigated Digital Architectures

abstract: Digital architectures for data encryption, processing, clock synthesis, data transfer, etc. are susceptible to radiation induced soft errors due to charge collection in complementary metal oxide semiconductor (CMOS) integrated circuits (ICs). Radiation hardening by design (RHBD) techniques such as double modular redundancy (DMR) and triple modular redundancy (TMR) are used for error detection and correction respectively in such architectures. Multiple node charge collection (MNCC) causes domain crossing errors (DCE) which can render the redundancy ineffectual. This dissertation describes techniques to ensure DCE mitigation with statistical confidence for various designs. Both sequential and combinatorial logic are separated using these custom and computer aided design (CAD) methodologies. Radiation vulnerability and design overhead are studied on VLSI sub-systems including an advanced encryption standard (AES) which is DCE mitigated using module level coarse separation on a 90-nm process with 99.999% DCE mitigation. A radiation hardened microprocessor (HERMES2) is implemented in both 90-nm and 55-nm technologies with an interleaved separation methodology with 99.99% DCE mitigation while achieving 4.9% increased cell density, 28.5 % reduced routing and 5.6% reduced power dissipation over the module fences implementation. A DMR register-file (RF) is implemented in 55 nm process and used in the HERMES2 microprocessor. The RF array custom design and the decoders APR designed are explored with a focus on design cycle time. Quality of results (QOR) is studied from power, performance, area and reliability (PPAR) perspective to ascertain the improvement over other design techniques. A radiation hardened all-digital multiplying pulsed digital delay line (DDL) is designed for double data rate (DDR2/3) applications for data eye centering during high speed off-chip data transfer. The effect of noise, radiation particle strikes and statistical variation on the designed DDL are studied in detail. The design achieves the best in class 22.4 ps peak-to-peak jitter, 100-850 MHz range at 14 pJ/cycle energy consumption. Vulnerability of the non-hardened design is characterized and portions of the redundant DDL are separated in custom and auto-place and route (APR). Thus, a range of designs for mission critical applications are implemented using methodologies proposed in this work and their potential PPAR benefits explored in detail.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

A compact high-energy particle detector for low-cost deep space missions

Over the last few decades particle physics has led to many new discoveries, laying the foundation for modern science. However, there are still many unanswered questions which the next generation of particle detectors could address, potentially expanding our knowledge and understanding of the Universe. Owing to recent technological advancements, electronic sensors are now able to acquire measurements previously unobtainable, creating opportunities for new deep-space high-energy particle missions. Consequently, a new compact instrument was developed capable of detecting gamma rays, neutrons and charged particles. This instrument combines the latest in FPGA System-on-Chip technology as the central processor and a 3x3 array of silicon photomultipliers coupled with an organic plastic scintillator as the detector. Using modern digital pulse shape discrimination and signal processing techniques, the scintillator and photomultiplier combination has been shown to accurately discriminate between the di_erent particle types and provide information such as total energy and incident direction. The instrument demonstrated the ability to capture 30,000 particle events per second across 9 channels - around 15 times that of the U.S. based CLAS detector. Furthermore, the input signals are simultaneously sampled at a maximum rate of 5 GSPS across all channels with 14-bit resolution. Future developments will include FPGA-implemented digital signal processing as well as hardware design for small satellite based deep-space missions that can overcome radiation vulnerability

Embedded electronic systems driven by run-time reconfigurable hardware

Abstract This doctoral thesis addresses the design of embedded electronic systems based on run-time reconfigurable hardware technology –available through SRAM-based FPGA/SoC devices– aimed at contributing to enhance the life quality of the human beings. This work does research on the conception of the system architecture and the reconfiguration engine that provides to the FPGA the capability of dynamic partial reconfiguration in order to synthesize, by means of hardware/software co-design, a given application partitioned in processing tasks which are multiplexed in time and space, optimizing thus its physical implementation –silicon area, processing time, complexity, flexibility, functional density, cost and power consumption– in comparison with other alternatives based on static hardware (MCU, DSP, GPU, ASSP, ASIC, etc.). The design flow of such technology is evaluated through the prototyping of several engineering applications (control systems, mathematical coprocessors, complex image processors, etc.), showing a high enough level of maturity for its exploitation in the industry.Resumen Esta tesis doctoral abarca el diseño de sistemas electrónicos embebidos basados en tecnología hardware dinámicamente reconfigurable –disponible a través de dispositivos lógicos programables SRAM FPGA/SoC– que contribuyan a la mejora de la calidad de vida de la sociedad. Se investiga la arquitectura del sistema y del motor de reconfiguración que proporcione a la FPGA la capacidad de reconfiguración dinámica parcial de sus recursos programables, con objeto de sintetizar, mediante codiseño hardware/software, una determinada aplicación particionada en tareas multiplexadas en tiempo y en espacio, optimizando así su implementación física –área de silicio, tiempo de procesado, complejidad, flexibilidad, densidad funcional, coste y potencia disipada– comparada con otras alternativas basadas en hardware estático (MCU, DSP, GPU, ASSP, ASIC, etc.). Se evalúa el flujo de diseño de dicha tecnología a través del prototipado de varias aplicaciones de ingeniería (sistemas de control, coprocesadores aritméticos, procesadores de imagen, etc.), evidenciando un nivel de madurez viable ya para su explotación en la industria.Resum Aquesta tesi doctoral està orientada al disseny de sistemes electrònics empotrats basats en tecnologia hardware dinàmicament reconfigurable –disponible mitjançant dispositius lògics programables SRAM FPGA/SoC– que contribueixin a la millora de la qualitat de vida de la societat. S’investiga l’arquitectura del sistema i del motor de reconfiguració que proporcioni a la FPGA la capacitat de reconfiguració dinàmica parcial dels seus recursos programables, amb l’objectiu de sintetitzar, mitjançant codisseny hardware/software, una determinada aplicació particionada en tasques multiplexades en temps i en espai, optimizant així la seva implementació física –àrea de silici, temps de processat, complexitat, flexibilitat, densitat funcional, cost i potència dissipada– comparada amb altres alternatives basades en hardware estàtic (MCU, DSP, GPU, ASSP, ASIC, etc.). S’evalúa el fluxe de disseny d’aquesta tecnologia a través del prototipat de varies aplicacions d’enginyeria (sistemes de control, coprocessadors aritmètics, processadors d’imatge, etc.), demostrant un nivell de maduresa viable ja per a la seva explotació a la indústria

Design of High Performance SRAM Based Memory Chip

The semiconductor memory SRAM uses bi-stable latch circuit to store the logic data 1 or 0. It differs from Dynamic RAM (DRAM) which needs periodic refreshment operation for the storage of logic data. Depending upon the frequency of operation SRAM power consumption varies i.e. it consumes very high power at higher frequencies like DRAM. The Cache memory present in the microprocessor needs high speed memory hence SRAM can be used for that purpose in microprocessors. The DRAM is normally used in the Main memory of processors, where importance is given to the density than its speed. The SRAM is also used in industrial subsystems, scientific and automotive electronics. In this thesis 16-Kb Memory is designed by using memory banking method in UMC 90nm technology ,which operates at a frequency of 1GHz.The post layout simulation for the complete design is performed and also obtained power analysis for the overall design. All peripherals like pre-charge, Row Decoder, Word line driver, Sense amplifier, Column Decoder/Mux and write driver are designed and layouts of all the above peripherals also drawn in an optimised manner such that their layout occupies minimum area. The 6T SRAM cell is designed with operating frequency of 8 GHz and stability analysis are also performed for single SRAM cell. The layout of Single SRAM cell is drawn in a symmetric manner, such that two adjacent cells can share same contact, which results reduction in the area of cell layout. The Static Noise Margin, Read noise margin and Write Noise Margin of single cell are found to be 240mV, 115mV and 425mV respectively for a supply voltage of 1V.The effect of pull-up ratio and cell ratio on the stability of SRAM cell is observed

Nouvelles Architectures Hybrides (Logique / Mémoires Non-Volatiles et technologies associées.)

Les nouvelles approches de technologies mémoires permettront une intégration dite back-end, où les cellules élémentaires de stockage seront fabriquées lors des dernières étapes de réalisation à grande échelle du circuit. Ces approches innovantes sont souvent basées sur l'utilisation de matériaux actifs présentant deux états de résistance distincts. Le passage d'un état à l'autre est contrôlé en courant ou en tension donnant lieu à une caractéristique I-V hystérétique. Nos mémoires résistives sont composées d'argent en métal électrochimiquement actif et de sulfure amorphe agissant comme électrolyte. Leur fonctionnement repose sur la formation réversible et la dissolution d'un filament conducteur. Le potentiel d'application de ces nouveaux dispositifs n'est pas limité aux mémoires ultra-haute densité mais aussi aux circuits embarqués. En empilant ces mémoires dans la troisième dimension au niveau des interconnections des circuits logiques CMOS, de nouvelles architectures hybrides et innovantes deviennent possibles. Il serait alors envisageable d'exploiter un fonctionnement à basse énergie, à haute vitesse d'écriture/lecture et de haute performance telles que l'endurance et la rétention. Dans cette thèse, en se concentrant sur les aspects de la technologie de mémoire en vue de développer de nouvelles architectures, l'introduction d'une fonctionnalité non-volatile au niveau logique est démontrée par trois circuits hybrides: commutateurs de routage non volatiles dans un Field Programmable Gate Arrays, un 6T-SRAM non volatile, et les neurones stochastiques pour un réseau neuronal. Pour améliorer les solutions existantes, les limitations de la performances des dispositifs mémoires sont identifiés et résolus avec des nouveaux empilements ou en fournissant des défauts de circuits tolérants.Novel approaches in the field of memory technology should enable backend integration, where individual storage nodes will be fabricated during the last fabrication steps of the VLSI circuit. In this case, memory operation is often based upon the use of active materials with resistive switching properties. A topology of resistive memory consists of silver as electrochemically active metal and amorphous sulfide acting as electrolyte and relies on the reversible formation and dissolution of a conductive filament. The application potential of these new memories is not limited to stand-alone (ultra-high density), but is also suitable for embedded applications. By stacking these memories in the third dimension at the interconnection level of CMOS logic, new ultra-scalable hybrid architectures becomes possible which exploit low energy operation, fast write/read access and high performance with respect to endurance and retention. In this thesis, focusing on memory technology aspects in view of developing new architectures, the introduction of non-volatile functionality at the logic level is demonstrated through three hybrid (CMOS logic ReRAM devices) circuits: nonvolatile routing switches in a Field Programmable Gate Array, nonvolatile 6T-SRAMs, and stochastic neurons of an hardware neural network. To be competitive or even improve existing solutions, limitations on the memory devices performances are identified and solved by stack engineering of CBRAM devices or providing faults tolerant circuits.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Muon (g-2) Technical Design Report

The Muon (g-2) Experiment, E989 at Fermilab, will measure the muon anomalous magnetic moment a factor-of-four more precisely than was done in E821 at the Brookhaven National Laboratory AGS. The E821 result appears to be greater than the Standard-Model prediction by more than three standard deviations. When combined with expected improvement in the Standard-Model hadronic contributions, E989 should be able to determine definitively whether or not the E821 result is evidence for physics beyond the Standard Model. After a review of the physics motivation and the basic technique, which will use the muon storage ring built at BNL and now relocated to Fermilab, the design of the new experiment is presented. This document was created in partial fulfillment of the requirements necessary to obtain DOE CD-2/3 approval

The design and development of a 64-Bit Linux based single board computer specifically for visible light positioning

Thesis (MEng)--Stellenbosch University, 2022.ENGLISH SUMMARY: The University of Stellenbosch and Katholieke Universiteit Leuven currently utilise freely available single board computers (SBC) for teaching and research purposes, but updates in future hardware iterations may render current software incompatible. A custom SBC is designed specifically for the needs of both institutions. This SBC is based on the NXP i.MX8MQ ARM processor. The processor has 4 high performance ARM Cortex-A53 cores and 1 high efficiency ARM Cortex-M4F core. This work successfully implements the i.MX8MQ processor alongside 2GB of LPDDR4 memory and SD card storage. This SBC has an analogue to digital converter (ADC), 2 46-pin expansion connectors, 100Mbps Ethernet, HDMI, 2 USB 3.0 and a UART-to-USB serial debug port. The power system of this SBC provides 16 voltage rails and is capable of delivering up to 50W . This design is implemented on a 6-layer 86.36mm x 55.88mm printed circuit board (PCB). The PCB has 4mi l/4mi l minimum width and spacing and 0.2mm via holes. The layer stackup of the PCB is custom designed to meet required impedance-, crosstalk- and timing constraints. The stackup has 4 signal layers, 1 power layer and 1 ground layer. The PCB is manufactured and sub-assembled in China and completed at the University of Stellenbosch. Debugging is performed and the design is deemed to function well. A custom Linux image is compiled, loaded and found to function reliably.AFRIKAANSE OPSMMING: Die Universiteit van Stellenbosch en Katholieke Universiteit Leuven gebruik tans kommersiële enkelbordrekenaars vir onderrig- en navorsingsdoeleindes, maar toekomstige opdateering van hardeware kan bestaande sagteware onbruikbaar maak. ’n Doelgemaakte enkelbordrekenaar is spesifiek ontwerp vir die behoeftes van beide instansies. Hierdie enkelbordrekenaar is gebaseer op die NXP i.MX8MQ ARM verwerker. Die verwerker het 4 hoë krag ARM Cortex-A53 kerne en 1 hoë effektiwiteit ARM Cortex-M4F kern. Die navorsingsprojek implementeer die i.MX8MQ verwerker suksesvol tesame met 2GB LPDDR4 geheue en SD kaartberging. Hierdie enkelbordrekenaar het ’n analoog na digitaal omsetter, 2 46-pen uitbreidingsverbindings, 100Mbps Ethernet, HDMI, 2 USB 3.0 en ’n UART-na-USB ontfoutingspoort. Die kragstelsel van hierdie enkelbordrekenaar lewer 16 spanningsvlakke en is in staat om tot en met 50W te verskaf. Die ontwerp is geïmplementeer op ’n 6-laag 86.36mm x 55.88mm etsbord. Die etsbord het 4mi l/4mi l minimum wydte en spasiëring en 0.2mm via gate. Die laagstapel van die etsbord is spesiaal ontwerp om aan die vereiste impedansie-, kruiskoppeling- en tydsbeperkings te voldoen. Die laagstapel het 4 seinlae, 1 kraglaag en 1 grondlaag. Die etsbord is in Sjina vervaardig en gedeeltelik aanmekaar gesit en dan by die Universiteit van Stellenbosch voltooi. Ontfouting is gedoen en daar is gevind dat die ontwerp goed funksioneer. ’n Doelgemaakte Linux bedryfstelsel is gebou, gelaai en gevind om betroubaar werk.Master

Intelligent Circuits and Systems

ICICS-2020 is the third conference initiated by the School of Electronics and Electrical Engineering at Lovely Professional University that explored recent innovations of researchers working for the development of smart and green technologies in the fields of Energy, Electronics, Communications, Computers, and Control. ICICS provides innovators to identify new opportunities for the social and economic benefits of society.　 This conference bridges the gap between academics and R&D institutions, social visionaries, and experts from all strata of society to present their ongoing research activities and foster research relations between them. It provides opportunities for the exchange of new ideas, applications, and experiences in the field of smart technologies and finding global partners for future collaboration. The ICICS-2020 was conducted in two broad categories, Intelligent Circuits & Intelligent Systems and Emerging Technologies in Electrical Engineering