Design of high-isolation and wideband RF switches in SiGe BiCMOS technology for radar applications

RF switches are an essential building block in numerous applications, including tactical radar systems, satellite communications, global positioning systems (GPS), automotive radars, wireless communications, radio astronomy, radar transceivers, and various instrumentation systems. For many of these applications the circuits have to operate reliably under extreme operating conditions, including conditions outside the domain of commercial military specifications. The objective of this thesis is to present the design procedure, simulation, and measurement results for Radio Frequency (RF) switches in 130 nm Silicon Germanium (SiGe) BiCMOS process technology. The novelty of this work lies in the proposed new topology of an ultrahigh-isolation single-pole, single-throw (SPST) and a single pole, four-throw (SP4T) nMOS based switch for multiband microwave radar systems. The analysis of cryogenic temperature effects on these circuits and devices are discussed in this work. The results shows that several key-figures-of-merits of a switch, like insertion loss, isolation, and power handling capability (P1dB) improve at cryogenic temperatures. These results are important for several applications, including space-based extreme environment application where FET based circuits would need to operate reliably across a wide-range of temperature.MSCommittee Chair: Cressler, John D.; Committee Member: Jeffrey Alan Davis; Committee Member: Papapolymerou, Ioanni

Wideband integrated circuits for optical communication systems

The exponential growth of internet traffic drives datacenters to constantly improvetheir capacity. Several research and industrial organizations are aiming towardsTbps Ethernet and beyond, which brings new challenges to the field of high-speedbroadband electronic circuit design. With datacenters rapidly becoming significantenergy consumers on the global scale, the energy efficiency of the optical interconnecttransceivers takes a primary role in the development of novel systems. Furthermore,wideband optical links are finding application inside very high throughput satellite(V/HTS) payloads used in the ever-expanding cloud of telecommunication satellites,enabled by the maturity of the existing fiber based optical links and the hightechnology readiness level of radiation hardened integrated circuit processes. Thereare several additional challenges unique in the design of a wideband optical system.The overall system noise must be optimized for the specific application, modulationscheme, PD and laser characteristics. Most state-of-the-art wideband circuits are builton high-end semiconductor SiGe and InP technologies. However, each technologydemands specific design decisions to be made in order to get low noise, high energyefficiency and adequate bandwidth. In order to overcome the frequency limitationsof the optoelectronic components, bandwidth enhancement and channel equalizationtechniques are used. In this work various blocks of optical communication systems aredesigned attempting to tackle some of the aforementioned challenges. Two TIA front-end topologies with 133 GHz bandwidth, a CB and a CE with shunt-shunt feedback,are designed and measured, utilizing a state-of-the-art 130 nm InP DHBT technology.A modular equalizer block built in 130 nm SiGe HBT technology is presented. Threeultra-wideband traveling wave amplifiers, a 4-cell, a single cell and a matrix single-stage, are designed in a 250 nm InP DHBT process to test the limits of distributedamplification. A differential VCSEL driver circuit is designed and integrated in a4x 28 Gbps transceiver system for intra-satellite optical communications based in arad-hard 130nm SiGe process

Aircraft electromagnetic compatibility

Illustrated are aircraft architecture, electromagnetic interference environments, electromagnetic compatibility protection techniques, program specifications, tasks, and verification and validation procedures. The environment of 400 Hz power, electrical transients, and radio frequency fields are portrayed and related to thresholds of avionics electronics. Five layers of protection for avionics are defined. Recognition is given to some present day electromagnetic compatibility weaknesses and issues which serve to reemphasize the importance of EMC verification of equipment and parts, and their ultimate EMC validation on the aircraft. Proven standards of grounding, bonding, shielding, wiring, and packaging are laid out to help provide a foundation for a comprehensive approach to successful future aircraft design and an understanding of cost effective EMC in an aircraft setting

Reconfigurable RF Front End Components for Multi-Radio Platform Applications

The multi-service requirements of the 3G and 4G communication systems, and their backward compatibility requirements, create challenges for the antenna and RF front-end designs with multi-band and wide-band techniques. These challenges include: multiple filters, which are lossy, bulky, and expensive, are needed in the system; device board size limitation and the associated isolation problems caused by the limited space and crowd circuits; and the insertion loss issues created by the single-pole-multi-through antenna switch. As will be shown, reconfigurable antennas can perform portions of the filter functions, which can help solve the multiple filters problem. Additionally, reconfigurable RF circuits can decrease the circuit size and output ports, which can help solve board size limitation, and isolation and antenna switch insertion loss issues. To validate the idea that reconfigurable antennas and reconfigurable RF circuits are a viable option for multi-service communication system, a reconfigurable patch antenna, a reconfigurable monopole antenna, and a reconfigurable power amplifier (PA) have been developed. All designs adapt state-of-the-art techniques. For the reconfigurable antenna designs, an experiment demonstrating its advantages, such as jamming signal resistance, has been performed. Reconfigurable antennas provide a better out-ofoperating- band noise performance than the multi-band antennas design, decreasing the need for filters in the system. A full investigation of reconfigurable antennas, including the single service reconfigurable antenna, the mixed signal service reconfigurable antenna, and the multi-band reconfigurable antenna, has been completed. The design challenges, which include switches investigation, switches integration, and service grouping techniques, have been discussed. In the reconfigurable PA portion, a reconfigurable PA structure has first been demonstrated, and includes a reconfigurable output matching network (MN) and a reconfigurable die design. To validate the proposed reconfigurable PA structure, a reconfigurable PA for a 3G cell phone system has been designed with a multi-chip module technique. The reconfigurable PA structure can significantly decrease the real-estate, cost, and complexity of the PA design. Further, by decreasing the number of output ports, the number of poles for the antenna switch will be decreased as well, leading to an insertion loss decrease

Analysis of the high frequency substrate noise effects on LC-VCOs

La integració de transceptors per comunicacions de radiofreqüència en CMOS pot quedar seriosament limitada per la interacció entre els seus blocs, arribant a desaconsellar la utilització de un únic dau de silici. El soroll d’alta freqüència generat per certs blocs, com l’amplificador de potencia, pot viatjar pel substrat i amenaçar el correcte funcionament de l’oscil·lador local. Trobem tres raons importants que mostren aquest risc d’interacció entre blocs i que justifiquen la necessitat d’un estudi profund per minimitzar-lo. Les característiques del substrat fan que el soroll d’alta freqüència es propagui m’és fàcilment que el de baixa freqüència. Per altra banda, les estructures de protecció perden eficiència a mesura que la freqüència augmenta. Finalment, el soroll d’alta freqüència que arriba a l’oscil·lador degrada al seu correcte comportament. El propòsit d’aquesta tesis és analitzar en profunditat la interacció entre el soroll d’alta freqüència que es propaga pel substrat i l’oscil·lador amb l’objectiu de poder predir, mitjançant un model, l’efecte que aquest soroll pot tenir sobre el correcte funcionament de l’oscil·lador. Es volen proporcionar diverses guies i normes a seguir que permeti als dissenyadors augmentar la robustesa dels oscil·ladors al soroll d’alta freqüència que viatja pel substrat. La investigació de l’efecte del soroll de substrat en oscil·ladors s’ha iniciat des d’un punt de vista empíric, per una banda, analitzant la propagació de senyals a través del substrat i avaluant l’eficiència d’estructures per bloquejar aquesta propagació, i per altra, determinant l’efecte d’un to present en el substrat en un oscil·lador. Aquesta investigació ha mostrat que la injecció d’un to d’alta freqüència en el substrat es pot propagar fins arribar a l’oscil·lador i que, a causa del ’pulling’ de freqüència, pot modular en freqüència la sortida de l’oscil·lador. A partir dels resultats de l’anàlisi empíric s’ha aportat un model matemàtic que permet predir l’efecte del soroll en l’oscil·lador. Aquest model té el principal avantatge en el fet de que està basat en paràmetres físics de l’oscil·lador o del soroll, permetent determinar les mesures que un dissenyador pot prendre per augmentar la robustesa de l’oscil·lador així com les conseqüències que aquestes mesures tenen sobre el seu funcionament global (trade-offs). El model ha estat comparat tant amb simulacions com amb mesures reals demostrant ser molt precís a l’hora de predir l’efecte del soroll de substrat. La utilitat del model com a eina de disseny s’ha demostrat en dos estudis. Primerament, les conclusions del model han estat aplicades en el procés de disseny d’un oscil·lador d’ultra baix consum a 2.5GHz, aconseguint un oscil·lador robust al soroll de substrat d’alta freqüència i amb característiques totalment compatibles amb els principals estàndards de comunicació en aquesta banda. Finalment, el model s’ha utilitzat com a eina d’anàlisi per avaluar la causa de les diferències, en termes de robustesa a soroll de substrat, mesurades en dos oscil·ladors a 60GHz amb dues diferents estratègies d’apantallament de l’inductor del tanc de ressonant, flotant en un cas i connectat a terra en l’altre. El model ha mostrat que les diferències en robustesa són causades per la millora en el factor de qualitat i en l’amplitud d’oscil·lació i no per un augment en l’aïllament entre tanc i substrat. Per altra banda, el model ha demostrat ser vàlid i molt precís inclús en aquest rang de freqüència tan extrem. el principal avantatge en el fet de que està basat en paràmetres físics de l’oscil·lador o del soroll, permetent determinar les mesures que un dissenyador pot prendre per augmentar la robustesa de l’oscil·lador així com les conseqüències que aquestes mesures tenen sobre el seu funcionament global (trade-offs). El model ha estat comparat tant amb simulacions com amb mesures reals demostrant ser molt precís a l’hora de predir l’efecte del soroll de substrat. La utilitat del model com a eina de disseny s’ha demostrat en dos estudis. Primerament, les conclusions del model han estat aplicades en el procés de disseny d’un oscil·lador d’ultra baix consum a 2.5GHz, aconseguint un oscil·lador robust al soroll de substrat d’alta freqüència i amb característiques totalment compatibles amb els principals estàndards de comunicació en aquesta banda. Finalment, el model s’ha utilitzat com a eina d’anàlisi per avaluar la causa de les diferències, en termes de robustesa a soroll de substrat, mesurades en dos oscil·ladors a 60GHz amb dues diferents estratègies d’apantallament de l’inductor del tanc de ressonant, flotant en un cas i connectat a terra en l’altre. El model ha mostrat que les diferències en robustesa són causades per la millora en el factor de qualitat i en l’amplitud d’oscil·lació i no per un augment en l’aïllament entre tanc i substrat. Per altra banda, el model ha demostrat ser vàlid i molt precís inclús en aquest rang de freqüència tan extrem.The integration of transceivers for RF communication in CMOS can be seriously limited by the interaction between their blocks, even advising against using a single silicon die. The high frequency noise generated by some of the blocks, like the power amplifier, can travel through the substrate, reaching the local oscillator and threatening its correct performance. Three important reasons can be stated that show the risk of the single die integration. Noise propagation is easier the higher the frequency. Moreover, the protection structures lose efficiency as the noise frequency increases. Finally, the high frequency noise that reaches the local oscillator degrades its performance. The purpose of this thesis is to deeply analyze the interaction between the high frequency substrate noise and the oscillator with the objective of being able to predict, thanks to a model, the effect that this noise may have over the correct behavior of the oscillator. We want to provide some guidelines to the designers to allow them to increase the robustness of the oscillator to high frequency substrate noise. The investigation of the effect of the high frequency substrate noise on oscillators has started from an empirical point of view, on one hand, analyzing the noise propagation through the substrate and evaluating the efficiency of some structures to block this propagation, and on the other hand, determining the effect on an oscillator of a high frequency noise tone present in the substrate. This investigation has shown that the injection of a high frequency tone in the substrate can reach the oscillator and, due to a frequency pulling effect, it can modulate in frequency the output of the oscillator. Based on the results obtained during the empirical analysis, a mathematical model to predict the effect of the substrate noise on the oscillator has been provided. The main advantage of this model is the fact that it is based on physical parameters of the oscillator and of the noise, allowing to determine the measures that a designer can take to increase the robustness of the oscillator as well as the consequences (trade-offs) that these measures have over its global performance. This model has been compared against both, simulations and real measurements, showing a very high accuracy to predict the effect of the high frequency substrate noise. The usefulness of the presented model as a design tool has been demonstrated in two case studies. Firstly, the conclusions obtained from the model have been applied in the design of an ultra low power consumption 2.5 GHz oscillator robust to the high frequency substrate noise with characteristics which make it compatible with the main communication standards in this frequency band. Finally, the model has been used as an analysis tool to evaluate the cause of the differences, in terms of performance degradation due to substrate noise, measured in two 60 GHz oscillators with two different tank inductor shielding strategies, floating and grounded. The model has determined that the robustness differences are caused by the improvement in the tank quality factor and in the oscillation amplitude and no by an increased isolation between the tank and the substrate. The model has shown to be valid and very accurate even in these extreme frequency range.Postprint (published version

High Frequency Devices and Circuit Modules for Biochemical Microsystems

This dissertation investigates high frequency devices and circuit modules for biochemical microsystems. These modules are designed towards replacing external bulky laboratory instruments and integrating with biochemical microsystems to generate and analyze signals in frequency and time domain. The first is a charge pump circuit with modified triple well diodes, which is used as an on-chip power supply. The second is an on-chip pulse generation circuit to generate high voltage short pulses. It includes a pulse-forming-line (PFL) based pulse generation circuit, a Marx generator and a Blumlein generator. The third is a six-port circuit based on four quadrature hybrids with 2.0~6.0 GHz operating frequency tuning range for analyzing signals in frequency domain on-chip. The fourth is a high-speed sample-and-hold circuit (SHC) with a 13.3 Gs/s sampling rate and ~11.5 GHz input bandwidth for analyzing signals in time domain on-chip. The fifth is a novel electron spin resonance (ESR) spectroscopy with high-sensitivity and wide frequency tuning range

Efficient and Linear CMOS Power Amplifier and Front-end Design for Broadband Fully-Integrated 28-GHz 5G Phased Arrays

Demand for data traffic on mobile networks is growing exponentially with time and on a global scale. The emerging fifth-generation (5G) wireless standard is being developed with millimeter-wave (mm-Wave) links as a key technological enabler to address this growth by a 2020 time frame. The wireless industry is currently racing to deploy mm-Wave mobile services, especially in the 28-GHz band. Previous widely-held perceptions of fundamental propagation limitations were overcome using phased arrays. Equally important for success of 5G is the development of low-power, broadband user equipment (UE) radios in commercial-grade technologies. This dissertation demonstrates design methodologies and circuit techniques to tackle the critical challenge of key phased array front-end circuits in low-cost complementary metal oxide semiconductor (CMOS) technology. Two power amplifier (PA) proof-of-concept prototypes are implemented in deeply scaled 28- nm and 40-nm CMOS processes, demonstrating state-of-the-art linearity and efficiency for extremely broadband communication signals. Subsequently, the 40 nm PA design is successfully embedded into a low-power fully-integrated transmit-receive front-end module. The 28 nm PA prototype in this dissertation is the first reported linear, bulk CMOS PA targeting low-power 5G mobile UE integrated phased array transceivers. An optimization methodology is presented to maximizing power added efficiency (PAE) in the PA output stage at a desired error vector magnitude (EVM) and range to address challenging 5G uplink requirements. Then, a source degeneration inductor in the optimized output stage is shown to further enable its embedding into a two-stage transformer-coupled PA. The inductor helps by broadening inter-stage impedance matching bandwidth, and helping to reduce distortion. Designed and fabricated in 1P7M 28 nm bulk CMOS and using a 1 V supply, the PA achieves +4.2 dBm/9% measured Pout/PAE at −25 dBc EVM for a 250 MHz-wide, 64-QAM orthogonal frequency division multiplexing (OFDM) signal with 9.6 dB peak-to-average power ratio (PAPR). The PA also achieves 35.5%/10% PAE for continuous wave signals at saturation/9.6dB back-off from saturation. To the best of the author’s knowledge, these are the highest measured PAE values among published K- and K a-band CMOS PAs to date. To drastically extend the communication bandwidth in 28 GHz-band UE devices, and to explore the potential of CMOS technology for more demanding access point (AP) devices, the second PA is demonstrated in a 40 nm process. This design supports a signal radio frequency bandwidth (RFBW) >3× the state-of-the-art without degrading output power (i.e. range), PAE (i.e. battery life), or EVM (i.e. amplifier fidelity). The three-stage PA uses higher-order, dual-resonance transformer matching networks with bandwidths optimized for wideband linearity. Digital gain control of 9 dB range is integrated for phased array operation. The gain control is a needed functionality, but it is largely absent from reported high-performance mm-Wave PAs in the literature. The PA is fabricated in a 1P6M 40 nm CMOS LP technology with 1.1 V supply, and achieves Pout/PAE of +6.7 dBm/11% for an 8×100 MHz carrier aggregation 64-QAM OFDM signal with 9.7 dB PAPR. This PA therefore is the first to demonstrate the viability of CMOS technology to address even the very challenging 5G AP/downlink signal bandwidth requirement. Finally, leveraging the developed PA design methodologies and circuits, a low power transmit-receive phased array front-end module is fully integrated in 40 nm technology. In transmit-mode, the front-end maintains the excellent performance of the 40 nm PA: achieving +5.5 dBm/9% for the same 8×100 MHz carrier aggregation signal above. In receive-mode, a 5.5 dB noise figure (NF) and a minimum third-order input intercept point (IIP₃) of −13 dBm are achieved. The performance of the implemented CMOS frontend is comparable to state-of-the-art publications and commercial products that were very recently developed in silicon germanium (SiGe) technologies for 5G communication

Reconfigurable Bulk Acoustic Wave Resonators and Filters Employing Electric-field-induced Piezoelectricity and Negative Piezoelectricity for 5G

The ever-expanding wireless communications and sensing are influencing every aspect of human life. With the persistent demand for higher data capacity and recent advancements in wireless technologies, the design of current radio frequency front-end circuitry in communication devices calls for transformative changes. Frequency band proliferation is the biggest contributor to the added RF front-ends complexity in the design of future radios. To operate at various frequency bands, a complex combination of switches and filters is used in mobile devices, and the number of these frequency selective components in each device is expected to exceed 100 with the advent of 5th generation (5G) communication networks. Acoustic wave filters based on piezoelectric materials are the primary technologies employed in current communication systems, including mobile phones. Alternatively, the integration of multifunctional ferroelectric materials into reconfigurable frequency selective components promises reduced complexity, diminished size, and high performance for future radios, enabling them to support 5G wireless technologies and beyond. A promising reconfigurable bulk acoustic wave technology, employing electric-field-induced piezoelectricity and negative piezoelectricity in ferroelectrics, is presented in this dissertation. Successful implementation of ferroelectric filters would eliminate the need for external switcheplexers in the RF front-ends and reduce the number of required filters, leading to a significant reduction in size, cost, and complexity. Contributions of this work are categorized into three major parts. In the first part, an intrinsically switchable thin film bulk acoustic wave resonator (FBAR) based on ferroelectric BST with the highest figure of merit (i.e., Q_m×K_t^2) in the literature is presented. The BST FBARs are then employed to design intrinsically switchable filters with the lowest insertion loss to date. Such filters combine filtering and switching functionalities onto a single device, eliminating the need for external switches in RF front-ends. The second part of this work focuses on the development of frequency and bandwidth reconfigurable filters based on BST FBARs. The first switchless acoustic wave filter bank is presented in chapter 3, demonstrating the capability of BST FBARs in simplifying future agile radios. Next, a novel bandwidth reconfigurable filter based on BST FBARs is introduced in chapter 4, where the idea is experimentally validated with multiple design examples. Finally, through rigorous mathematical analysis and experimental validation, it has been demonstrated that a dynamic ‘non-uniform piezoelectric coefficient’ created within a composite structure made up of multi-layers of ferroelectrics allows the selective excitation of different mechanical Eigenmodes with a constant electromechanical coupling coefficient. Such technology overcomes the fundamental limitations associated with the electromechanical coupling coefficient of harmonic resonances in bulk acoustic wave resonators. To create ‘non-uniform piezoelectric coefficients’ in such structures, ferroelectrics’ electric-field-induced piezoelectricity and negative piezoelectricity has been exploited. This innovative technology provides a fundamentally new approach and a framework for synthesizing programmable frequency selective components, which leads to transformative advances in wireless systems’ front-end architecture. As part of the future direction, it is suggested that the multilayer structure presented in this section to be further studies as part of a new acoustic wave resonator design, which: (a) is capable of operation at a wide frequency range up to mm-wave frequencies designated for 5G (b). Such a structure has the potential to overcome the fundamental limitation of acoustic resonator’s ever-decreasing electromechanical coupling factors (Kt2) as their frequency of operation increases.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/163011/1/milad_1.pd