Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Delay Measurements and Self Characterisation on FPGAs

This thesis examines new timing measurement methods for self delay characterisation of Field-Programmable Gate Arrays (FPGAs) components and delay measurement of complex circuits on FPGAs. Two novel measurement techniques based on analysis of a circuit's output failure rate and transition probability is proposed for accurate, precise and efficient measurement of propagation delays. The transition probability based method is especially attractive, since it requires no modifications in the circuit-under-test and requires little hardware resources, making it an ideal method for physical delay analysis of FPGA circuits. The relentless advancements in process technology has led to smaller and denser transistors in integrated circuits. While FPGA users benefit from this in terms of increased hardware resources for more complex designs, the actual productivity with FPGA in terms of timing performance (operating frequency, latency and throughput) has lagged behind the potential improvements from the improved technology due to delay variability in FPGA components and the inaccuracy of timing models used in FPGA timing analysis. The ability to measure delay of any arbitrary circuit on FPGA offers many opportunities for on-chip characterisation and physical timing analysis, allowing delay variability to be accurately tracked and variation-aware optimisations to be developed, reducing the productivity gap observed in today's FPGA designs. The measurement techniques are developed into complete self measurement and characterisation platforms in this thesis, demonstrating their practical uses in actual FPGA hardware for cross-chip delay characterisation and accurate delay measurement of both complex combinatorial and sequential circuits, further reinforcing their positions in solving the delay variability problem in FPGAs

Content-Aware Multimedia Communications

The demands for fast, economic and reliable dissemination of multimedia information are steadily growing within our society. While people and economy increasingly rely on communication technologies, engineers still struggle with their growing complexity. Complexity in multimedia communication originates from several sources. The most prominent is the unreliability of packet networks like the Internet. Recent advances in scheduling and error control mechanisms for streaming protocols have shown that the quality and robustness of multimedia delivery can be improved significantly when protocols are aware of the content they deliver. However, the proposed mechanisms require close cooperation between transport systems and application layers which increases the overall system complexity. Current approaches also require expensive metrics and focus on special encoding formats only. A general and efficient model is missing so far. This thesis presents efficient and format-independent solutions to support cross-layer coordination in system architectures. In particular, the first contribution of this work is a generic dependency model that enables transport layers to access content-specific properties of media streams, such as dependencies between data units and their importance. The second contribution is the design of a programming model for streaming communication and its implementation as a middleware architecture. The programming model hides the complexity of protocol stacks behind simple programming abstractions, but exposes cross-layer control and monitoring options to application programmers. For example, our interfaces allow programmers to choose appropriate failure semantics at design time while they can refine error protection and visibility of low-level errors at run-time. Based on some examples we show how our middleware simplifies the integration of stream-based communication into large-scale application architectures. An important result of this work is that despite cross-layer cooperation, neither application nor transport protocol designers experience an increase in complexity. Application programmers can even reuse existing streaming protocols which effectively increases system robustness.Der Bedarf unsere Gesellschaft nach kostengünstiger und zuverlässiger Kommunikation wächst stetig. Während wir uns selbst immer mehr von modernen Kommunikationstechnologien abhängig machen, müssen die Ingenieure dieser Technologien sowohl den Bedarf nach schneller Einführung neuer Produkte befriedigen als auch die wachsende Komplexität der Systeme beherrschen. Gerade die Übertragung multimedialer Inhalte wie Video und Audiodaten ist nicht trivial. Einer der prominentesten Gründe dafür ist die Unzuverlässigkeit heutiger Netzwerke, wie z.B.~dem Internet. Paketverluste und schwankende Laufzeiten können die Darstellungsqualität massiv beeinträchtigen. Wie jüngste Entwicklungen im Bereich der Streaming-Protokolle zeigen, sind jedoch Qualität und Robustheit der Übertragung effizient kontrollierbar, wenn Streamingprotokolle Informationen über den Inhalt der transportierten Daten ausnutzen. Existierende Ansätze, die den Inhalt von Multimediadatenströmen beschreiben, sind allerdings meist auf einzelne Kompressionsverfahren spezialisiert und verwenden berechnungsintensive Metriken. Das reduziert ihren praktischen Nutzen deutlich. Außerdem erfordert der Informationsaustausch eine enge Kooperation zwischen Applikationen und Transportschichten. Da allerdings die Schnittstellen aktueller Systemarchitekturen nicht darauf vorbereitet sind, müssen entweder die Schnittstellen erweitert oder alternative Architekturkonzepte geschaffen werden. Die Gefahr beider Varianten ist jedoch, dass sich die Komplexität eines Systems dadurch weiter erhöhen kann. Das zentrale Ziel dieser Dissertation ist es deshalb, schichtenübergreifende Koordination bei gleichzeitiger Reduzierung der Komplexität zu erreichen. Hier leistet die Arbeit zwei Beträge zum aktuellen Stand der Forschung. Erstens definiert sie ein universelles Modell zur Beschreibung von Inhaltsattributen, wie Wichtigkeiten und Abhängigkeitsbeziehungen innerhalb eines Datenstroms. Transportschichten können dieses Wissen zur effizienten Fehlerkontrolle verwenden. Zweitens beschreibt die Arbeit das Noja Programmiermodell für multimediale Middleware. Noja definiert Abstraktionen zur Übertragung und Kontrolle multimedialer Ströme, die die Koordination von Streamingprotokollen mit Applikationen ermöglichen. Zum Beispiel können Programmierer geeignete Fehlersemantiken und Kommunikationstopologien auswählen und den konkreten Fehlerschutz dann zur Laufzeit verfeinern und kontrolliere

On Fault Tolerance Methods for Networks-on-Chip

Technology scaling has proceeded into dimensions in which the reliability of manufactured devices is becoming endangered. The reliability decrease is a consequence of physical limitations, relative increase of variations, and decreasing noise margins, among others. A promising solution for bringing the reliability of circuits back to a desired level is the use of design methods which introduce tolerance against possible faults in an integrated circuit. This thesis studies and presents fault tolerance methods for network-onchip (NoC) which is a design paradigm targeted for very large systems-onchip. In a NoC resources, such as processors and memories, are connected to a communication network; comparable to the Internet. Fault tolerance in such a system can be achieved at many abstraction levels. The thesis studies the origin of faults in modern technologies and explains the classification to transient, intermittent and permanent faults. A survey of fault tolerance methods is presented to demonstrate the diversity of available methods. Networks-on-chip are approached by exploring their main design choices: the selection of a topology, routing protocol, and flow control method. Fault tolerance methods for NoCs are studied at different layers of the OSI reference model. The data link layer provides a reliable communication link over a physical channel. Error control coding is an efficient fault tolerance method especially against transient faults at this abstraction level. Error control coding methods suitable for on-chip communication are studied and their implementations presented. Error control coding loses its effectiveness in the presence of intermittent and permanent faults. Therefore, other solutions against them are presented. The introduction of spare wires and split transmissions are shown to provide good tolerance against intermittent and permanent errors and their combination to error control coding is illustrated. At the network layer positioned above the data link layer, fault tolerance can be achieved with the design of fault tolerant network topologies and routing algorithms. Both of these approaches are presented in the thesis together with realizations in the both categories. The thesis concludes that an optimal fault tolerance solution contains carefully co-designed elements from different abstraction levelsSiirretty Doriast

On Improving Robustness of Hardware Security Primitives and Resistance to Reverse Engineering Attacks

The continued growth of information technology (IT) industry and proliferation of interconnected devices has aggravated the problem of ensuring security and necessitated the need for novel, robust solutions. Physically unclonable functions (PUFs) have emerged as promising secure hardware primitives that can utilize the disorder introduced during manufacturing process to generate unique keys. They can be utilized as \textit{lightweight} roots-of-trust for use in authentication and key generation systems. Unlike insecure non-volatile memory (NVM) based key storage systems, PUFs provide an advantage -- no party, including the manufacturer, should be able to replicate the physical disorder and thus, effectively clone the PUF. However, certain practical problems impeded the widespread deployment of PUFs. This dissertation addresses such problems of (i) reliability and (ii) unclonability. Also, obfuscation techniques have proven necessary to protect intellectual property in the presence of an untrusted supply chain and are needed to aid against counterfeiting. This dissertation explores techniques utilizing layout and logic-aware obfuscation. Collectively, we present secure and cost-effective solutions to address crucial hardware security problems

Miniaturized Transistors, Volume II

In this book, we aim to address the ever-advancing progress in microelectronic device scaling. Complementary Metal-Oxide-Semiconductor (CMOS) devices continue to endure miniaturization, irrespective of the seeming physical limitations, helped by advancing fabrication techniques. We observe that miniaturization does not always refer to the latest technology node for digital transistors. Rather, by applying novel materials and device geometries, a significant reduction in the size of microelectronic devices for a broad set of applications can be achieved. The achievements made in the scaling of devices for applications beyond digital logic (e.g., high power, optoelectronics, and sensors) are taking the forefront in microelectronic miniaturization. Furthermore, all these achievements are assisted by improvements in the simulation and modeling of the involved materials and device structures. In particular, process and device technology computer-aided design (TCAD) has become indispensable in the design cycle of novel devices and technologies. It is our sincere hope that the results provided in this Special Issue prove useful to scientists and engineers who find themselves at the forefront of this rapidly evolving and broadening field. Now, more than ever, it is essential to look for solutions to find the next disrupting technologies which will allow for transistor miniaturization well beyond silicon’s physical limits and the current state-of-the-art. This requires a broad attack, including studies of novel and innovative designs as well as emerging materials which are becoming more application-specific than ever before

Asynchronous techniques for new generation variation-tolerant FPGA

PhD ThesisThis thesis presents a practical scenario for asynchronous logic implementation that would benefit the modern Field-Programmable Gate Arrays (FPGAs) technology in improving reliability. A method based on Asynchronously-Assisted Logic (AAL) blocks is proposed here in order to provide the right degree of variation tolerance, preserve as much of the traditional FPGAs structure as possible, and make use of asynchrony only when necessary or beneficial for functionality. The newly proposed AAL introduces extra underlying hard-blocks that support asynchronous interaction only when needed and at minimum overhead. This has the potential to avoid the obstacles to the progress of asynchronous designs, particularly in terms of area and power overheads. The proposed approach provides a solution that is complementary to existing variation tolerance techniques such as the late-binding technique, but improves the reliability of the system as well as reducing the design’s margin headroom when implemented on programmable logic devices (PLDs) or FPGAs. The proposed method suggests the deployment of configurable AAL blocks to reinforce only the variation-critical paths (VCPs) with the help of variation maps, rather than re-mapping and re-routing. The layout level results for this method's worst case increase in the CLB’s overall size only of 6.3%. The proposed strategy retains the structure of the global interconnect resources that occupy the lion’s share of the modern FPGA’s soft fabric, and yet permits the dual-rail iv completion-detection (DR-CD) protocol without the need to globally double the interconnect resources. Simulation results of global and interconnect voltage variations demonstrate the robustness of the method

A Group-Based Ring Oscillator Physical Unclonable Function

Silicon Physical Unclonable Function (PUF) is a physical structure of the chip which has functional characteristics that are hard to predict before fabrication but are expected to be unique after fabrication. This is caused by the random fabrication variations. The secret characteristics can only be extracted through physical measurement and will vanish immediately when the chip is powered down. PUF promises a securer means for cryptographic key generation and storage among many other security applications. However, there are still many practical challenges to cost effectively build secure and reliable PUF secrecy. This dissertation proposes new architectures for ring oscillator (RO) PUFs to answer these challenges. First, our temperature-aware cooperative (TAC) RO PUF can utilize certain ROs that were otherwise discarded due to their instability. Second, our novel group-based algorithm can generate secrecy higher than the theoretical upper bound of the conventional pairwise comparisons approach. Third, we build the first regression-based entropy distiller that can turn the PUF secrecy statistically random and robust, meeting the NIST standards. Fourth, we develop a unique Kendall syndrome coding (KSC) that makes the PUF secrecy error resilient against potential environmental fluctuations. Each of these methods can improve the hardware efficiency of the RO PUF implementation by 1.5X to 8X while improving the security and reliability of the PUF secrecy