Analysis of the high frequency substrate noise effects on LC-VCOs

La integració de transceptors per comunicacions de radiofreqüència en CMOS pot quedar seriosament limitada per la interacció entre els seus blocs, arribant a desaconsellar la utilització de un únic dau de silici. El soroll d’alta freqüència generat per certs blocs, com l’amplificador de potencia, pot viatjar pel substrat i amenaçar el correcte funcionament de l’oscil·lador local. Trobem tres raons importants que mostren aquest risc d’interacció entre blocs i que justifiquen la necessitat d’un estudi profund per minimitzar-lo. Les característiques del substrat fan que el soroll d’alta freqüència es propagui m’és fàcilment que el de baixa freqüència. Per altra banda, les estructures de protecció perden eficiència a mesura que la freqüència augmenta. Finalment, el soroll d’alta freqüència que arriba a l’oscil·lador degrada al seu correcte comportament. El propòsit d’aquesta tesis és analitzar en profunditat la interacció entre el soroll d’alta freqüència que es propaga pel substrat i l’oscil·lador amb l’objectiu de poder predir, mitjançant un model, l’efecte que aquest soroll pot tenir sobre el correcte funcionament de l’oscil·lador. Es volen proporcionar diverses guies i normes a seguir que permeti als dissenyadors augmentar la robustesa dels oscil·ladors al soroll d’alta freqüència que viatja pel substrat. La investigació de l’efecte del soroll de substrat en oscil·ladors s’ha iniciat des d’un punt de vista empíric, per una banda, analitzant la propagació de senyals a través del substrat i avaluant l’eficiència d’estructures per bloquejar aquesta propagació, i per altra, determinant l’efecte d’un to present en el substrat en un oscil·lador. Aquesta investigació ha mostrat que la injecció d’un to d’alta freqüència en el substrat es pot propagar fins arribar a l’oscil·lador i que, a causa del ’pulling’ de freqüència, pot modular en freqüència la sortida de l’oscil·lador. A partir dels resultats de l’anàlisi empíric s’ha aportat un model matemàtic que permet predir l’efecte del soroll en l’oscil·lador. Aquest model té el principal avantatge en el fet de que està basat en paràmetres físics de l’oscil·lador o del soroll, permetent determinar les mesures que un dissenyador pot prendre per augmentar la robustesa de l’oscil·lador així com les conseqüències que aquestes mesures tenen sobre el seu funcionament global (trade-offs). El model ha estat comparat tant amb simulacions com amb mesures reals demostrant ser molt precís a l’hora de predir l’efecte del soroll de substrat. La utilitat del model com a eina de disseny s’ha demostrat en dos estudis. Primerament, les conclusions del model han estat aplicades en el procés de disseny d’un oscil·lador d’ultra baix consum a 2.5GHz, aconseguint un oscil·lador robust al soroll de substrat d’alta freqüència i amb característiques totalment compatibles amb els principals estàndards de comunicació en aquesta banda. Finalment, el model s’ha utilitzat com a eina d’anàlisi per avaluar la causa de les diferències, en termes de robustesa a soroll de substrat, mesurades en dos oscil·ladors a 60GHz amb dues diferents estratègies d’apantallament de l’inductor del tanc de ressonant, flotant en un cas i connectat a terra en l’altre. El model ha mostrat que les diferències en robustesa són causades per la millora en el factor de qualitat i en l’amplitud d’oscil·lació i no per un augment en l’aïllament entre tanc i substrat. Per altra banda, el model ha demostrat ser vàlid i molt precís inclús en aquest rang de freqüència tan extrem. el principal avantatge en el fet de que està basat en paràmetres físics de l’oscil·lador o del soroll, permetent determinar les mesures que un dissenyador pot prendre per augmentar la robustesa de l’oscil·lador així com les conseqüències que aquestes mesures tenen sobre el seu funcionament global (trade-offs). El model ha estat comparat tant amb simulacions com amb mesures reals demostrant ser molt precís a l’hora de predir l’efecte del soroll de substrat. La utilitat del model com a eina de disseny s’ha demostrat en dos estudis. Primerament, les conclusions del model han estat aplicades en el procés de disseny d’un oscil·lador d’ultra baix consum a 2.5GHz, aconseguint un oscil·lador robust al soroll de substrat d’alta freqüència i amb característiques totalment compatibles amb els principals estàndards de comunicació en aquesta banda. Finalment, el model s’ha utilitzat com a eina d’anàlisi per avaluar la causa de les diferències, en termes de robustesa a soroll de substrat, mesurades en dos oscil·ladors a 60GHz amb dues diferents estratègies d’apantallament de l’inductor del tanc de ressonant, flotant en un cas i connectat a terra en l’altre. El model ha mostrat que les diferències en robustesa són causades per la millora en el factor de qualitat i en l’amplitud d’oscil·lació i no per un augment en l’aïllament entre tanc i substrat. Per altra banda, el model ha demostrat ser vàlid i molt precís inclús en aquest rang de freqüència tan extrem.The integration of transceivers for RF communication in CMOS can be seriously limited by the interaction between their blocks, even advising against using a single silicon die. The high frequency noise generated by some of the blocks, like the power amplifier, can travel through the substrate, reaching the local oscillator and threatening its correct performance. Three important reasons can be stated that show the risk of the single die integration. Noise propagation is easier the higher the frequency. Moreover, the protection structures lose efficiency as the noise frequency increases. Finally, the high frequency noise that reaches the local oscillator degrades its performance. The purpose of this thesis is to deeply analyze the interaction between the high frequency substrate noise and the oscillator with the objective of being able to predict, thanks to a model, the effect that this noise may have over the correct behavior of the oscillator. We want to provide some guidelines to the designers to allow them to increase the robustness of the oscillator to high frequency substrate noise. The investigation of the effect of the high frequency substrate noise on oscillators has started from an empirical point of view, on one hand, analyzing the noise propagation through the substrate and evaluating the efficiency of some structures to block this propagation, and on the other hand, determining the effect on an oscillator of a high frequency noise tone present in the substrate. This investigation has shown that the injection of a high frequency tone in the substrate can reach the oscillator and, due to a frequency pulling effect, it can modulate in frequency the output of the oscillator. Based on the results obtained during the empirical analysis, a mathematical model to predict the effect of the substrate noise on the oscillator has been provided. The main advantage of this model is the fact that it is based on physical parameters of the oscillator and of the noise, allowing to determine the measures that a designer can take to increase the robustness of the oscillator as well as the consequences (trade-offs) that these measures have over its global performance. This model has been compared against both, simulations and real measurements, showing a very high accuracy to predict the effect of the high frequency substrate noise. The usefulness of the presented model as a design tool has been demonstrated in two case studies. Firstly, the conclusions obtained from the model have been applied in the design of an ultra low power consumption 2.5 GHz oscillator robust to the high frequency substrate noise with characteristics which make it compatible with the main communication standards in this frequency band. Finally, the model has been used as an analysis tool to evaluate the cause of the differences, in terms of performance degradation due to substrate noise, measured in two 60 GHz oscillators with two different tank inductor shielding strategies, floating and grounded. The model has determined that the robustness differences are caused by the improvement in the tank quality factor and in the oscillation amplitude and no by an increased isolation between the tank and the substrate. The model has shown to be valid and very accurate even in these extreme frequency range.Postprint (published version

Power Reductions with Energy Recovery Using Resonant Topologies

The problem of power densities in system-on-chips (SoCs) and processors has become more exacerbated recently, resulting in high cooling costs and reliability issues. One of the largest components of power consumption is the low skew clock distribution network (CDN), driving large load capacitance. This can consume as much as 70% of the total dynamic power that is lost as heat, needing elaborate sensing and cooling mechanisms. To mitigate this, resonant clocking has been utilized in several applications over the past decade. An improved energy recovering reconfigurable generalized series resonance (GSR) solution with all the critical support circuitry is developed in this work. This LC resonant clock driver is shown to save about 50% driver power (\u3e40% overall), on a 22nm process node and has 50% less skew than a non-resonant driver at 2GHz. It can operate down to 0.2GHz to support other energy savings techniques like dynamic voltage and frequency scaling (DVFS). As an example, GSR can be configured for the simpler pulse series resonance (PSR) operation to enable further power saving for double data rate (DDR) applications, by using de-skewing latches instead of flip-flop banks. A PSR based subsystem for 40% savings in clocking power with 40% driver active area reduction xii is demonstrated. This new resonant driver generates tracking pulses at each transition of clock for dual edge operation across DVFS. PSR clocking is designed to drive explicit-pulsed latches with negative setup time. Simulations using 45nm IBM/PTM device and interconnect technology models, clocking 1024 flip-flops show the reductions, compared to non-resonant clocking. DVFS range from 2GHz/1.3V to 200MHz/0.5V is obtained. The PSR frequency is set \u3e3× the clock rate, needing only 1/10th the inductance of prior-art LC resonance schemes. The skew reductions are achieved without needing to increase the interconnect widths owing to negative set-up times. Applications in data circuits are shown as well with a 90nm example. Parallel resonant and split-driver non-resonant configurations as well are derived from GSR. Tradeoffs in timing performance versus power, based on theoretical analysis, are compared for the first time and verified. This enables synthesis of an optimal topology for a given application from the GSR

System-level design and RF front-end implementation for a 3-10ghz multiband-ofdm ultrawideband receiver and built-in testing techniques for analog and rf integrated circuits

This work consists of two main parts: a) Design of a 3-10GHz UltraWideBand (UWB) Receiver and b) Built-In Testing Techniques (BIT) for Analog and RF circuits. The MultiBand OFDM (MB-OFDM) proposal for UWB communications has received significant attention for the implementation of very high data rate (up to 480Mb/s) wireless devices. A wideband LNA with a tunable notch filter, a downconversion quadrature mixer, and the overall radio system-level design are proposed for an 11-band 3.4-10.3GHz direct conversion receiver for MB-OFDM UWB implemented in a 0.25mm BiCMOS process. The packaged IC includes an RF front-end with interference rejection at 5.25GHz, a frequency synthesizer generating 11 carrier tones in quadrature with fast hopping, and a linear phase baseband section with 42dB of gain programmability. The receiver IC mounted on a FR-4 substrate provides a maximum gain of 67-78dB and NF of 5-10dB across all bands while consuming 114mA from a 2.5V supply. Two BIT techniques for analog and RF circuits are developed. The goal is to reduce the test cost by reducing the use of analog instrumentation. An integrated frequency response characterization system with a digital interface is proposed to test the magnitude and phase responses at different nodes of an analog circuit. A complete prototype in CMOS 0.35mm technology employs only 0.3mm2 of area. Its operation is demonstrated by performing frequency response measurements in a range of 1 to 130MHz on 2 analog filters integrated on the same chip. A very compact CMOS RF RMS Detector and a methodology for its use in the built-in measurement of the gain and 1dB compression point of RF circuits are proposed to address the problem of on-chip testing at RF frequencies. The proposed device generates a DC voltage proportional to the RMS voltage amplitude of an RF signal. A design in CMOS 0.35mm technology presents and input capacitance <15fF and occupies and area of 0.03mm2. The application of these two techniques in combination with a loop-back test architecture significantly enhances the testability of a wireless transceiver system

Constraint-driven RF test stimulus generation and built-in test

With the explosive growth in wireless applications, the last decade witnessed an ever-increasing test challenge for radio frequency (RF) circuits. While the design community has pushed the envelope far into the future, by expanding CMOS process to be used with high-frequency wireless devices, test methodology has not advanced at the same pace. Consequently, testing such devices has become a major bottleneck in high-volume production, further driven by the growing need for tighter quality control. RF devices undergo testing during the prototype phase and during high-volume manufacturing (HVM). The benchtop test equipment used throughout prototyping is very precise yet specialized for a subset of functionalities. HVM calls for a different kind of test paradigm that emphasizes throughput and sufficiency, during which the projected performance parameters are measured one by one for each device by automated test equipment (ATE) and compared against defined limits called specifications. The set of tests required for each product differs greatly in terms of the equipment required and the time taken to test individual devices. Together with signal integrity, precision, and repeatability concerns, the initial cost of RF ATE is prohibitively high. As more functionality and protocols are integrated into a single RF device, the required number of specifications to be tested also increases, adding to the overall cost of testing, both in terms of the initial and recurring operating costs. In addition to the cost problem, RF testing proposes another challenge when these components are integrated into package-level system solutions. In systems-on-packages (SOP), the test problems resulting from signal integrity, input/output bandwidth (IO), and limited controllability and observability have initiated a paradigm shift in high-speed analog testing, favoring alternative approaches such as built-in tests (BIT) where the test functionality is brought into the package. This scheme can make use of a low-cost external tester connected through a low-bandwidth link in order to perform demanding response evaluations, as well as make use of the analog-to-digital converters and the digital signal processors available in the package to facilitate testing. Although research on analog built-in test has demonstrated hardware solutions for single specifications, the paradigm shift calls for a rather general approach in which a single methodology can be applied across different devices, and multiple specifications can be verified through a single test hardware unit, minimizing the area overhead. Specification-based alternate test methodology provides a suitable and flexible platform for handling the challenges addressed above. In this thesis, a framework that integrates ATE and system constraints into test stimulus generation and test response extraction is presented for the efficient production testing of high-performance RF devices using specification-based alternate tests. The main components of the presented framework are as follows: Constraint-driven RF alternate test stimulus generation: An automated test stimulus generation algorithm for RF devices that are evaluated by a specification-based alternate test solution is developed. The high-level models of the test signal path define constraints in the search space of the optimized test stimulus. These models are generated in enough detail such that they inherently define limitations of the low-cost ATE and the I/O restrictions of the device under test (DUT), yet they are simple enough that the non-linear optimization problem can be solved empirically in a reasonable amount of time. Feature extractors for BIT: A methodology for the built-in testing of RF devices integrated into SOPs is developed using additional hardware components. These hardware components correlate the high-bandwidth test response to low bandwidth signatures while extracting the test-critical features of the DUT. Supervised learning is used to map these extracted features, which otherwise are too complicated to decipher by plain mathematical analysis, into the specifications under test. Defect-based alternate testing of RF circuits: A methodology for the efficient testing of RF devices with low-cost defect-based alternate tests is developed. The signature of the DUT is probabilistically compared with a class of defect-free device signatures to explore possible corners under acceptable levels of process parameter variations. Such a defect filter applies discrimination rules generated by a supervised classifier and eliminates the need for a library of possible catastrophic defects.Ph.D.Committee Chair: Chatterjee, Abhijit; Committee Member: Durgin, Greg; Committee Member: Keezer, David; Committee Member: Milor, Linda; Committee Member: Sitaraman, Sures

Architectures and Integrated Circuits for Efficient, High-power "Digital'' Transmitters for Millimeter-wave Applications

This thesis presents architectures and integrated circuits for the implementation of energy-efficient, high-power "digital'' transmitters to realize high-speed long-haul links at millimeter-wave frequencies in nano-scale silicon-based processes

Broadband RF Front-End Design for Multi-Standard Receiver with High-Linearity and Low-Noise Techniques

Future wireless communication devices must support multiple standards and features on a single-chip. The trend towards software-defined radio requires flexible and efficient RF building blocks which justifies the adoption of broadband receiver front-ends in modern and future communication systems. The broadband receiver front-end significantly reduces cost, area, pins, and power, and can process several signal channels simultaneously. This research is mainly focused on the analysis and realization of the broadband receiver architecture and its various building blocks (LNA, Active Balun-LNA, Mixer, and trans-impedance amplifier) for multi-standard applications. In the design of the mobile DTV tuner, a direct-conversion receiver architecture is adopted achieving low power, low cost, and high dynamic-range for DVB-H standard. The tuner integrates a single-ended RF variable gain amplifier (RFVGA), a current-mode passive mixer, and a combination of continuous and discrete-time baseband filter with built-in anti-aliasing. The proposed RFVGA achieves high dynamic-range and gain-insensitive input impedance matching performance. The current-mode passive mixer achieves high gain, low noise, and high linearity with low power supplies. A wideband common-gate LNA is presented that overcomes the fundamental trade-off between power and noise match without compromising its stability. The proposed architecture can achieve the minimum noise figure over the previously reported feedback amplifiers in common-gate configuration. The proposed architecture achieves broadband impedance matching, low noise, large gain, enhanced linearity, and wide bandwidth concurrently by employing an efficient and reliable dual negative-feedback. For the wideband Inductorless Balun-LNA, active single-to-differential architecture has been proposed without using any passive inductor on-chip which occupies a lot of silicon area. The proposed Balun-LNA features lower power, wider bandwidth, and better gain and phase balance than previously reported architectures of the same kind. A surface acoustic wave (SAW)-less direct conversion receiver targeted for multistandard applications is proposed and fabricated with TSMC 0.13?m complementary metal-oxide-semiconductor (CMOS) technology. The target is to design a wideband SAW-less direct coversion receiver with a single low noise transconductor and current-mode passive mixer with trans-impedance amplifier utilizing feed-forward compensation. The innovations in the circuit and architecture improves the receiver dynamic range enabling highly linear direct-conversion CMOS front-end for a multi-standard receiver

La modélisation de l’immunité des circuits intégrés au-delà de 1 GHz

Electromagnetic Compatibility (EMC) is the faculty of working devices to co-exist electromagnetically. In practice, it turns out to be very complex to create electromagnetically compatible devices. The weapon to succeed the complex challenge of creating First-Time-Right (FTR) compatible devices is modelling. This thesis investigates whether it makes sense to model the conducted immunity of Integrated Circuits (ICs) beyond 1 GHz and how to do that. If the Printed Circuit Board (PCB) traces determine a PCB's radiated immunity, it is interesting to predict their coupling efficiency and to understand how that depends on the trace routing. Because full-wave solvers are slow and do not yield understanding, the existing Taylor cell model is modified to yield another 100 times speedup and an insightful upper bound, for vertically polarised, grazing-incident plane wave illumination of electrically long, multi-segment traces with arbitrary terminal loads. The results up to 20 GHz match with full-wave simulations to within 2.6 dB average absolute error and with Gigahertz Transverse Electromagnetic-cell (GTEM-cell) measurements to within 4.0 dB average absolute error. If the conducted immunity of ICs is interesting above 1 GHz, a measurement method is needed that is valid beyond 1 GHz. There is no standardised method yet, because with rising frequency, the common measurement set-up increasingly obscures the IC's immunity. An attempt to model and remove the set-up's impact on the measurement result proved difficult. Therefore, a simplified set-up and extraction method is proposed and a proof-of-concept of the automatic generation of the set-up's PCB is given. The conducted immunity of an LM7805 voltage regulator is measured up to 4.2 GHz to demonstrate the method. Except for a general trend of rising frequencies, there is only little concrete proof for the relevance of IC immunity modelling beyond 1 GHz. A full-wave simulation suggests that up to 10 GHz, most energy enters the die via the trace. Similarly, the radiated immunity of a microstrip trace and an LM7805 voltage regulator is predicted by concatenating the models developed above. Although this model neglects the radiated immunity of the IC itself, the prediction corresponds with GTEM-cell measurement to within 2.1 dB average absolute error. These experiments suggest the most radiation enters a PCB via its traces, well beyond 1 GHz, hence it is useful to model the conducted immunity of IC beyond 1 GHz. Therefore, the extension of IEC 62132-4 to 10 GHz should be seriously considered. Moreover, the speed and transparency of the modified Taylor model for field-to-trace coupling open up new possibilities for computer-aided design. The semi-automatic generation of lean extraction PCB could facilitate model extraction. There are also critical remaining questions, remaining to be answered.La compatibilité électromagnétique (CEM) est l'aptitude des produits électroniques à coexister au niveau électromagnétique. Dans la pratique, c'est une tâche très complexe que de concevoir des produits compatibles. L'arme permettant de concevoir des produits bon-du-premier-coup est la modélisation. Cette thèse étudie l'utilité et la faisabilité de la modélisation de l'immunité des circuits intégrés (CI) au-delà de 1 GHz. Si les pistes des circuits imprimés déterminent l'immunité rayonnée de ces circuits, il serait pertinent de pouvoir prévoir l'efficacité de couplage et de comprendre comment elle découle du routage des pistes. Les solveurs full-wave sont lents et ne contribuent pas à la compréhension. En conséquence, un modèle existant (la cellule de Taylor) est modifié de manière à ce que son temps de calcul soit divisé par 100. De plus, ce modèle modifié est capable de fournir une explication de la limite supérieure pour le couplage d'une onde plane, rasante et polarisée verticalement vers une piste de plusieurs segments, électriquement longue et avec des terminaisons arbitraires. Les résultats jusqu'à 20 GHz corrèlent avec des simulations fullwave à une erreur absolue moyenne de 2,6 dB près et avec des mesures en cellule GTEM (Gigahertz Transversale Electromagnétique) à une erreur absolue moyenne de 4,0 dB près. Si l'immunité conduite des CI est intéressante au-delà de 1 GHz, il faut une méthode de mesure, valable au-delà de 1 GHz. Actuellement, il n'y a pas de méthode normalisée, car la fréquence élevée fausse les observations faites avec la manipulation normalisée. Il est difficile de modéliser et de compenser le comportement de la manipulation normalisée. Par conséquent, une manipulation simplifiée et sa méthode d'extraction correspondante sont proposées, ainsi qu'une démonstration du principe de génération automatique de la carte d'essai utilisée dans la manipulation simplifiée. Pour illustrer la méthode simplifiée, l'immunité conduite d'un régulateur de tension LM7805 est mesurée jusqu'à 4,2 GHz. À part la tendance générale des fréquences qui montent, il y a peu de preuve concrète qui étaye la pertinence de la modélisation de l'immunité conduite des CI au-delà de 1 GHz. Une simulation full-wave suggère que jusqu'à 10 GHz, la plus grande partie de l'énergie rentre dans la puce à travers la piste. Par concaténation des modèles développés ci-dessus, l'immunité rayonnée d'une piste micro-ruban et d'un régulateur de tension LM7805 est prédite. Bien que ce modèle néglige l'immunité rayonnée du CI lui-même, la prédiction corrèle avec des mesures en cellule GTEM à une erreur absolue de 2,1 dB en moyenne. Ces expériences suggèrent que la plus grande partie du rayonnement entre dans un circuit imprimé à travers ses pistes, bien au-delà de 1 GHz. Dans ce cas, la modélisation de l'immunité conduite au-delà de 1 GHz serait utile. Par conséquent, l'extension jusqu'à 10 GHz de la méthode de mesure CEI 62132-4 devrait être considérée. De plus, la vitesse et la transparence du modèle de Taylor modifié pour le couplage champ-à-ligne permettent des innovations dans la conception assistée par l'ordinateur. La génération semiautomatique des cartes d'essais dites maigres pourrait faciliter l'extraction des modèles. Certaines questions critiques et importantes demeurent ouvertes

Analyse et caractérisation des couplages substrat et de la connectique dans les circuits 3D : Vers des modèles compacts

The 3D integration is the most promising technological solution to track the level of integration dictated by Moore's Law (see more than Moore, Moore versus more). It leads to important research for a dozen years. It can superimpose different circuits and components in one box. Its main advantage is to allow a combination of heterogeneous and highly specialized technologies for the establishment of a complete system, while maintaining a high level of performance with very short connections between the different circuits. The objective of this work is to provide consistent modeling via crossing, and / or contacts in the substrate, with various degrees of finesse / precision to allow the high-level designer to manage and especially to optimize the partitioning between the different strata. This modelization involves the development of multiple views at different levels of abstraction: the physical model to "high level" model. This would allow to address various issues faced in the design process: - The physical model using an electromagnetic simulation based on 2D or 3D ( finite element solver ) is used to optimize the via (materials, dimensions etc..) It determines the electrical performance of the via, including high frequency. Electromagnetic simulations also quantify the coupling between adjacent via. - The analytical compact of via their coupling model, based on a description of transmission line or Green cores is used for the simulations at the block level and Spice type simulations. Analytical models are often validated against measurements and / or physical models.L’intégration 3D est la solution technologique la plus prometteuse pour suivre le niveau d’intégration dictée par la loi de Moore (cf. more than Moore, versus more Moore). Elle entraine des travaux de recherche importants depuis une douzaine d’années. Elle permet de superposer différents circuits et composants dans un seul boitier. Son principal avantage est de permettre une association de technologies hétérogènes et très spécialisées pour la constitution d’un système complet, tout en préservant un très haut niveau de performance grâce à des connexions très courtes entre ces différents circuits. L’objectif de ce travail est de fournir des modélisations cohérentes de via traversant, ou/et de contacts dans le substrat, avec plusieurs degrés de finesse/précision, pour permettre au concepteur de haut niveau de gérer et surtout d’optimiser le partitionnement entre les différentes strates. Cette modélisation passe par le développement de plusieurs vues à différents niveaux d’abstraction: du modèle physique au modèle « haut niveau ». Elle devait permettre de répondre à différentes questions rencontrées dans le processus de conception :- le modèle physique de via basé sur une simulation électromagnétique 2D ou 3D (solveur « éléments finis ») est utilisé pour optimiser l’architecture du via (matériaux, dimensions etc.) Il permet de déterminer les performances électriques des via, notamment en haute fréquence. Les simulations électromagnétiques permettent également de quantifier le couplage entre via adjacents. - le modèle compact analytique de via et de leur couplage, basé sur une description de type ligne de transmission ou noyaux de Green, est utilisé pour les simulations au niveau bloc, ainsi que des simulations de type Spice. Les modèles analytiques sont souvent validés par rapport à des mesures et/ou des modèles physiques

CMOS Integrated Power Amplifiers for RF Reconfigurable and Digital Transmitters

abstract: This dissertation focuses on three different efficiency enhancement methods that are applicable to handset applications. These proposed designs are based on three critical requirements for handset application: 1) Small form factor, 2) CMOS compatibility and 3) high power handling. The three presented methodologies are listed below: 1) A transformer-based power combiner architecture for out-phasing transmitters 2) A current steering DAC-based average power tracking circuit for on-chip power amplifiers (PA) 3) A CMOS-based driver stage for GaN-based switched-mode power amplifiers applicable to fully digital transmitters This thesis highlights the trends in wireless handsets, the motivates the need for fully-integrated CMOS power amplifier solutions and presents the three novel techniques for reconfigurable and digital CMOS-based PAs. Chapter 3, presents the transformer-based power combiner for out-phasing transmitters. The simulation results reveal that this technique is able to shrink the power combiner area, which is one of the largest parts of the transmitter, by about 50% and as a result, enhances the output power density by 3dB. The average power tracking technique (APT) integrated with an on-chip CMOS-based power amplifier is explained in Chapter 4. This system is able to achieve up to 32dBm saturated output power with a linear power gain of 20dB in a 45nm CMOS SOI process. The maximum efficiency improvement is about ∆η=15% compared to the same PA without APT. Measurement results show that the proposed method is able to amplify an enhanced-EDGE modulated input signal with a data rate of 70.83kb/sec and generate more than 27dBm of average output power with EVM<5%. Although small form factor, high battery lifetime, and high volume integration motivate the need for fully digital CMOS transmitters, the output power generated by this type of transmitter is not high enough to satisfy the communication standards. As a result, compound materials such as GaN or GaAs are usually being used in handset applications to increase the output power. Chapter 5 focuses on the analysis and design of two CMOS based driver architectures (cascode and house of cards) for driving a GaN power amplifier. The presented results show that the drivers are able to generate ∆Vout=5V, which is required by the compound transistor, and operate up to 2GHz. Since the CMOS driver is expected to drive an off-chip capacitive load, the interface components, such as bond wires, and decoupling and pad capacitors, play a critical role in the output transient response. Therefore, extensive analysis and simulation results have been done on the interface circuits to investigate their effects on RF transmitter performance. The presented results show that the maximum operating frequency when the driver is connected to a 4pF capacitive load is about 2GHz, which is perfectly matched with the reported values in prior literature.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

RF techniques for IEEE 802.15.4: circuit design and device modelling

The RF circuitry in the physical layer of any wireless communication node is arguably its most important part. The front-end radio is the hardware that enables communication by transmitting and receiving information. Without a robust and high performance front-end, all other higher layers of signal processing and data handling in a wireless network are irrelevant. This thesis investigates the radio circuitry of wireless-networked nodes, and introduces several proposals for improvement. As an emerging market, analysis starts by examining available and ratified network standards suitable for low power applications. After identifying the IEEE 802.15.4 standard (commercially known as ZigBee) as the one of choice, and analysing several front-end architectures on which its transceiver circuitry can be based, an application, the Tyre Pressure Monitoring System (TPMS) is selected to examine the capabilities of the standard and its most suitable architecture in satisfying the application’s requirements. From this compatibility analysis, the most significant shortcomings are identified as interference and power consumption. The work presented in this thesis focuses on the power consumption issues. A comparison of available high frequency transistor technologies concludes Silicon CMOS to be the most appropriate solution for the implementation of low cost and low power ZigBee transceivers. Since the output power requirement of ZigBee is relatively modest, it is possible to consider the design of a single amplifier block which can act as both a Low Noise Amplifier (LNA) in the receiver chain and a Power Amplifier (PA) on the transmitter side. This work shows that by employing a suitable design methodology, a single dual-function amplifier can be realised which meets the required performance specification. In this way, power consumption and chip area can both be reduced, leading to cost savings so vital to the widespread utilisation of the ZigBee standard. Given the importance of device nonlinearity in such a design, a new transistor model based on independent representation of each of the transistor’s nonlinear elements is developed with the aim of quantifying the individual contribution of each of the transistors nonlinear elements, to the total distortion. The methodology to the design of the dual functionality (LNA/PA) amplifier starts by considering various low noise amplifier architectures and comparing them in terms of the trade-off between noise (required for LNA operation) and linearity (important for PA operation), and then examining the behaviour of the selected architecture (the common-source common-gate cascode) at higher than usual input powers. Due to the need to meet the far apart performance requirements of both the LNA and PA, a unique amplifier design methodology is developed The design methodology is based on simultaneous graphical visualisation of the relationship between all relevant performance parameters and corresponding design parameters. A design example is then presented to demonstrate the effectiveness of the methodology and the quality of trade-offs it allows the designer to make. The simulated performance of the final amplifier satisfies both the requirements of ZigBee’s low noise and power amplification. At 2.4GHz, the amplifier is predicted to have 1.6dB Noise Figure (NF), 6dBm Input-referred 3rd-order Intercept Point (IIP3), and 1dB compression point of -3.5dBm. In low power operation, it is predicted to have 10dB gain, consuming only 8mW. At the higher input power of 0dBm, it is predicted to achieve 24% Power-Added Efficiency (PAE) with 8dB gain and 22mW power consumption. Finally, this thesis presents a set of future research proposals based on problems identified throughout its development