Modeling of an implantable device for remote arterial pressure measurement

Cardiovascular diseases are the leading causes of illness and death in Europe, having a major impact on healthcare costs. An intelligent stent (e-stent), capable of obtaining and transmitting measurements of physiological parameters, can be a useful tool for real-time monitorization of arterial blockage without patient hospitalization. In this paper, a behavioral model of a pressure sensing-based e-stent is proposed and simulated under several restenosis conditions. Special attention has been given to the need of an accurate fault model, obtained from realistic finite-element simulations, to ensure long-term reliability; particularly for those faults whose behavior cannot be described by usual analytical models

Energy autonomous systems : future trends in devices, technology, and systems

The rapid evolution of electronic devices since the beginning of the nanoelectronics era has brought about exceptional computational power in an ever shrinking system footprint. This has enabled among others the wealth of nomadic battery powered wireless systems (smart phones, mp3 players, GPS, …) that society currently enjoys. Emerging integration technologies enabling even smaller volumes and the associated increased functional density may bring about a new revolution in systems targeting wearable healthcare, wellness, lifestyle and industrial monitoring applications

MEMS Accelerometers

Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc

Solid State Circuits Technologies

The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book

A MICROGYRO WITH QUARTZ FORK SENSOR

ABSTRACT Mainly targeting the automotive application, Systron Donner's MicroGyro with quartz fork sensor uses a vibrating quartz tuning fork to sense angular rate, acting as a Coriolis sensor, coupled to a similar fork as a pickup to produce the rate output signal. In this paper, the theoretical analysis of the quartz fork model is presented. Following that, the control of the drive magnitude and design of the pickup path are discussed in details. Experiment results from mechanical testing and electrical testing are presented to show that the MicroGyro has achieved 0.03°/s/rtHz

Built-In Self-Test Solution for CMOS MEMS Sensors

This thesis presents a new readout circuit with integrated Built-in Self-Test (BIST) structure for capacitive Micro-Electro-Mechanical Systems (MEMS). In the proposed solution instead of commonly used voltage control signals to test the device, charge control stimuli are employed to cover a wider range of structural defects. The proposed test solution eliminates the risk of MEMS structural collapse in the test phase. Measurement results using a prototype fabricated in TSMC 65nm CMOS technology indicate that the proposed BIST scheme can successfully detect minor structural defects altering MEMS nominal capacitance

A PLL based built-in self-test for MEMS sensors

A new readout circuit for capacitive Micro-Electrical-Mechanical System (MEMS) devices has been proposed, developed and simulated in this thesis. The readout circuit utilizes a Phase Locked Loop (PLL) to convert variations of MEM capacitance to time domain signals. The proposed circuit demonstrates a robust performance against process, power supply and temperature variations due to inherent feedback of PLL systems. Post layout simulation results in Cadence environment using TSMC CMOS 65nm technology indicate that the implemented readout circuit can successfully measure and detect minor variations of MEMS capacitance from its nominal value

High Speed Test Interface Module Using MEMS Technology

With the transient frequency of available CMOS technologies exceeding hundreds of gigahertz and the increasing complexity of Integrated Circuit (IC) designs, it is now apparent that the architecture of current testers needs to be greatly improved to keep up with the formidable challenges ahead. Test requirements for modern integrated circuits are becoming more stringent, complex and costly. These requirements include an increasing number of test channels, higher test-speeds and enhanced measurement accuracy and resolution. In a conventional test configuration, the signal path from Automatic Test Equipment (ATE) to the Device-Under-Test (DUT) includes long traces of wires. At frequencies above a few gigahertz, testing integrated circuits becomes a challenging task. The effects on transmission lines become critical requiring impedance matching to minimize signal reflection. AC resistance due to the skin effect and electromagnetic coupling caused by radiation can also become important factors affecting the test results. In the design of a Device Interface Board (DIB), the greater the physical separation of the DUT and the ATE pin electronics, the greater the distortion and signal degradation. In this work, a new Test Interface Module (TIM) based on MEMS technology is proposed to reduce the distance between the tester and device-under-test by orders of magnitude. The proposed solution increases the bandwidth of test channels and reduces the undesired effects of transmission lines on the test results. The MEMS test interface includes a fixed socket and a removable socket. The removable socket incorporates MEMS contact springs to provide temporary with the DUT pads and the fixed socket contains a bed of micro-pins to establish electrical connections with the ATE pin electronics. The MEMS based contact springs have been modified to implement a high-density wafer level test probes for Through Silicon Vias (TSVs) in three dimensional integrated circuits (3D-IC). Prototypes have been fabricated using Silicon On Insulator SOI wafer. Experimental results indicate that the proposed architectures can operate up to 50 GHz without much loss or distortion. The MEMS probes can also maintain a good elastic performance without any damage or deformation in the test phase

Doctor of Philosophy

dissertationMicroelectromechanical systems (MEMS) resonators on Si have the potential to replace the discrete passive components in a power converter. The main intention of this dissertation is to present a ring-shaped aluminum nitride (AlN) piezoelectric microreson