Automating the IEEE std. 1500 compliance verification for embedded cores

The IEEE 1500 standard for embedded core testing proposes a very effective solution for testing modern system-on-chip (SoC). It proposes a flexible hardware test wrapper architecture, together with a core test language (CTL) used to describe the implemented wrapper functionalities. Already several IP providers have announced compliance in both existing and future design blocks. In this paper we address the challenge of guaranteeing the compliance of a wrapper architecture and its CTL description to the IEEE std. 1500. This is a mandatory step to fully trust the wrapper functionalities in applying the test sequences to the core. The proposed solution aims at implementing a verification framework allowing core providers and/or integrators to automatically verify the compliancy of their products (sold or purchased) to the standar

IEEE Standard 1500 Compliance Verification for Embedded Cores

Core-based design and reuse are the two key elements for an efficient system-on-chip (SoC) development. Unfortunately, they also introduce new challenges in SoC testing, such as core test reuse and the need of a common test infrastructure working with cores originating from different vendors. The IEEE 1500 Standard for Embedded Core Testing addresses these issues by proposing a flexible hardware test wrapper architecture for embedded cores, together with a core test language (CTL) used to describe the implemented wrapper functionalities. Several intellectual property providers have already announced IEEE Standard 1500 compliance in both existing and future design blocks. In this paper, we address the problem of guaranteeing the compliance of a wrapper architecture and its CTL description to the IEEE Standard 1500. This step is mandatory to fully trust the wrapper functionalities in applying the test sequences to the core. We present a systematic methodology to build a verification framework for IEEE Standard 1500 compliant cores, allowing core providers and/or integrators to verify the compliance of their products (sold or purchased) to the standar

SoC Test: Trends and Recent Standards

The well-known approaching test cost crisis, where semiconductor test costs begin to approach or exceed manufacturing costs has led test engineers to apply new solutions to the problem of testing System-On-Chip (SoC) designs containing multiple IP (Intellectual Property) cores. While it is not yet possible to apply generic test architectures to an IP core within a SoC, the emergence of a number of similar approaches, and the release of new industry standards, such as IEEE 1500 and IEEE 1450.6, may begin to change this situation. This paper looks at these standards and at some techniques currently used by SoC test engineers. An extensive reference list is included, reflecting the purpose of this publication as a review paper

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements

A Hardware Security Solution against Scan-Based Attacks

Scan based Design for Test (DfT) schemes have been widely used to achieve high fault coverage for integrated circuits. The scan technique provides full access to the internal nodes of the device-under-test to control them or observe their response to input test vectors. While such comprehensive access is highly desirable for testing, it is not acceptable for secure chips as it is subject to exploitation by various attacks. In this work, new methods are presented to protect the security of critical information against scan-based attacks. In the proposed methods, access to the circuit containing secret information via the scan chain has been severely limited in order to reduce the risk of a security breach. To ensure the testability of the circuit, a built-in self-test which utilizes an LFSR as the test pattern generator (TPG) is proposed. The proposed schemes can be used as a countermeasure against side channel attacks with a low area overhead as compared to the existing solutions in literature

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

A test architecture design for SoCs using ATAM method

Test arranging is a basic issue in structure on-a-chip (S.O.C) experiment mechanization. Capable investigation designs constrain the general organization check request time, keep away from analysis reserve conflicts, in addition to purpose of restriction control disseminating in the midst of examination manner. In this broadsheet, we absent a fused method to manage a couple of test arranging issues. We first present a system to choose perfect timetables for sensibly evaluated SOC’s among need associations, i.e., plans that spare alluring orderings among tests. This furthermore acquaints a capable heuristic estimation with plan examinations designed for enormous S.O.Cs through need necessities in polynomial occasion. We portray a narrative figuring with the purpose of uses pre-emption of tests to secure capable date-books in favour of SOCs. Exploratory marks on behalf of an educational S-O-C plus a cutting edge SOC exhibit with the aim of capable investigation timetables be able to subsist gained in sensible CPU occasion

Studies on Core-Based Testing of System-on-Chips Using Functional Bus and Network-on-Chip Interconnects

The tests of a complex system such as a microprocessor-based system-onchip (SoC) or a network-on-chip (NoC) are difficult and expensive. In this thesis, we propose three core-based test methods that reuse the existing functional interconnects-a flat bus, hierarchical buses of multiprocessor SoC's (MPSoC), and a N oC-in order to avoid the silicon area cost of a dedicated test access mechanism (TAM). However, the use of functional interconnects as functional TAM's introduces several new problems. During tests, the interconnects-including the bus arbitrator, the bus bridges, and the NoC routers-operate in the functional mode to transport the test stimuli and responses, while the core under tests (CUT) operate in the test mode. Second, the test data is transported to the CUT through the functional bus, and not directly to the test port. Therefore, special core test wrappers that can provide the necessary control signals required by the different functional interconnect are proposed. We developed two types of wrappers, one buffer-based wrapper for the bus-based systems and another pair of complementary wrappers for the NoCbased systems. Using the core test wrappers, we propose test scheduling schemes for the three functionally different types of interconnects. The test scheduling scheme for a flat bus is developed based on an efficient packet scheduling scheme that minimizes both the buffer sizes and the test time under a power constraint. The schedulingscheme is then extended to take advantage of the hierarchical bus architecture of the MPSoC systems. The third test scheduling scheme based on the bandwidth sharing is developed specifically for the NoC-based systems. The test scheduling is performed under the objective of co-optimizing the wrapper area cost and the resulting test application time using the two complementary NoC wrappers. For each of the proposed methodology for the three types of SoC architec .. ture, we conducted a thorough experimental evaluation in order to verify their effectiveness compared to other methods

Fault Detection Methodology for Caches in Reliable Modern VLSI Microprocessors based on Instruction Set Architectures

Η παρούσα διδακτορική διατριβή εισάγει μία χαμηλού κόστους μεθοδολογία για την ανίχνευση ελαττωμάτων σε μικρές ενσωματωμένες κρυφές μνήμες που βασίζεται σε σύγχρονες Αρχιτεκτονικές Συνόλου Εντολών και εφαρμόζεται με λογισμικό αυτοδοκιμής. Η προτεινόμενη μεθοδολογία εφαρμόζει αλγορίθμους March μέσω λογισμικού για την ανίχνευση τόσο ελαττωμάτων αποθήκευσης όταν εφαρμόζεται σε κρυφές μνήμες που περιέχουν μόνο στατικές μνήμες τυχαίας προσπέλασης όπως για παράδειγμα κρυφές μνήμες επιπέδου 1, όσο και ελαττωμάτων σύγκρισης όταν εφαρμόζεται σε κρυφές μνήμες που περιέχουν εκτός από SRAM μνήμες και μνήμες διευθυνσιοδοτούμενες μέσω περιεχομένου, όπως για παράδειγμα πλήρως συσχετιστικές κρυφές μνήμες αναζήτησης μετάφρασης. Η προτεινόμενη μεθοδολογία εφαρμόζεται και στις τρεις οργανώσεις συσχετιστικότητας κρυφής μνήμης και είναι ανεξάρτητη της πολιτικής εγγραφής στο επόμενο επίπεδο της ιεραρχίας. Η μεθοδολογία αξιοποιεί υπάρχοντες ισχυρούς μηχανισμούς των μοντέρνων ISAs χρησιμοποιώντας ειδικές εντολές, που ονομάζονται στην παρούσα διατριβή Εντολές Άμεσης Προσπέλασης Κρυφής Μνήμης (Direct Cache Access Instructions - DCAs). Επιπλέον, η προτεινόμενη μεθοδολογία εκμεταλλεύεται τους έμφυτους μηχανισμούς καταγραφής απόδοσης και τους μηχανισμούς χειρισμού παγίδων που είναι διαθέσιμοι στους σύγχρονους επεξεργαστές. Επιπρόσθετα, η προτεινόμενη μεθοδολογία εφαρμόζει την λειτουργία σύγκρισης των αλγορίθμων March όταν αυτή απαιτείται (για μνήμες CAM) και επαληθεύει το αποτέλεσμα του ελέγχου μέσω σύντομης απόκρισης, ώστε να είναι συμβατή με τις απαιτήσεις του ελέγχου εντός λειτουργίας. Τέλος, στη διατριβή προτείνεται μία βελτιστοποίηση της μεθοδολογίας για πολυνηματικές, πολυπύρηνες αρχιτεκτονικές.The present PhD thesis introduces a low cost fault detection methodology for small embedded cache memories that is based on modern Instruction Set Architectures and is applied with Software-Based Self-Test (SBST) routines. The proposed methodology applies March tests through software to detect both storage faults when applied to caches that comprise Static Random Access Memories (SRAM) only, e.g. L1 caches, and comparison faults when applied to caches that apart from SRAM memories comprise Content Addressable Memories (CAM) too, e.g. Translation Lookaside Buffers (TLBs). The proposed methodology can be applied to all three cache associativity organizations: direct mapped, set-associative and full-associative and it does not depend on the cache write policy. The methodology leverages existing powerful mechanisms of modern ISAs by utilizing instructions that we call in this PhD thesis Direct Cache Access (DCA) instructions. Moreover, our methodology exploits the native performance monitoring hardware and the trap handling mechanisms which are available in modern microprocessors. Moreover, the proposed Methodology applies March compare operations when needed (for CAM arrays) and verifies the test result with a compact response to comply with periodic on-line testing needs. Finally, a multithreaded optimization of the proposed methodology that targets multithreaded, multicore architectures is also presented in this thesi

Test Quality Analysis and Improvement for an Embedded Asynchronous FIFO

Embedded First-InFirst-Out (FIFO) memories are increasingly used in many IC designs.We have created a new full-custom embedded FIFO module withasynchronous read and write clocks, which is at least a factor twosmaller and also faster than SRAM-based and standard-cell-basedcounterparts. The detection qualities of the FIFO test for bothhard and weak resistive shorts and opens have been analyzed by anIFA-like method based on analog simulation. The defect coverage ofthe initial FIFO test for shorts in the bit-cell matrix has beenimproved by inclusion of an additional data background andlow-voltage testing; for low-resistant shorts, 100% defect coverageis obtained. The defect coverage for opens has been improved by anew test procedure which includes waitingperiods