Power-Bus Decoupling with Embedded Capacitance in Printed Circuit Board Design

This paper experimentally investigates the effectiveness of embedded capacitance for reducing power-bus noise in high-speed printed circuit board designs. Boards with embedded capacitance employ closely spaced power-return plane pairs separated by a thin layer of dielectric material. In this paper, test boards with four embedded capacitance materials are evaluated. Power-bus input impedance measurements and power-bus noise measurements are presented for boards with various dimensions and layer stack ups. Unlike discrete decoupling capacitors, whose effective frequency range is generally limited to a few hundred megahertz due to interconnect inductance, embedded capacitance was found to efficiently reduce power-bus noise over the entire frequency range evaluated (up to 5 GHz)

High-speed PCB Inspection System Based on ECT Technique With Multi SV-GMR Sensor

This paper describes high-speed printed circuit board (PCB) inspection based on eddy-current testing (ECT) technique. The proposed ECT probe consists only of meander exciter coil and multi spin-valve giant magnetoresistance (SV-GMR) sensor that it was designed for detection of microcrack on PCB surface. To conduct high-speed scanning, harmonic analysis based on Fourier analysis is applied to acquire ECT signal at fundamental frequency. Signal variation at defect point is enhanced by applied averaging of multisignal obtained from the multi SV-GMR sensor.Special Issue of the Asia-Pacific Symposium on Applied Electromagnetics and Mechanics (APSAEM06

Design and Testing of a Prototype High Speed Data Acquisition System for Nasa

Modern radar and signal processing applications require data acquisition systems capable of high-speed analog data reception and processing. These systems need to support sophisticated signal processing algorithms and reliable high-speed interfaces. The objective of this project is to develop a prototype of a state of the art data acquisition system to aid NASA’s Surface Water and Ocean Topography (SWOT) mission. The SWOT mission aims at monitoring water levels of various water bodies to predict and avoid any catastrophic events. The principal instrument is a Ka-band Radar Interferometer (KaRIN) that is used for the measurement of water levels. The collected data need to be digitized and processed using an FPGA based-data acquisition system housed in a satellite. The scope of this project involves the design, implementation and test of a high-speed printed circuit board (PCB) that serves as the prototype data acquisition system. A lot of emphasis is placed on layout design, as the PCB needs to support data rates up to three Giga samples per second. The goal of this research is to provide Jet Propulsion Laboratory (JPL), NASA with a prototype version of the high- speed acquisition system that can be integrated with the KaRIN system in future

A Novel Calibration Algorithm for a Special Class of Multiport Vector Network Analyzers

A new error model for a special class of multiport vector network analyzers (VNAs) is presented in this paper. This model can be applied to multiport network analyzers with noncomplete reflectometers, i.e., when the measurement of the incident waves at each port is not always available. The method used to compute the error coefficients proposed here is based on a compact and easy formulation. This method is an extension of the already existing general theory for complete reflectometer multiport network analyzers. Furthermore, the new error model generalizes the theory for three-sampler two-port VNAs. The proposed model has been tested against the complete reflectometer one and exhibits the same accuracy leve

High-Speed Differential Via Optimization using a High-Accuracy and High-Bandwidth Via Model

A Physics-Based Equivalent Model of the High-Speed Differential Via Pair with High Accuracy and High Bandwidth is Proposed for the First Time. the Proposed Physics-Based Equivalent Circuit Model of the Differential Via Pair Includes the Effect of Adjacent Ground (GND) Vias. the Proposed Model is Verified using 3D Full-Wave Numerical Simulation Results. in Addition, the Change in Electrical Performance Due to Change in Anti-Pad Radius, the Via Pitch and the GND-Via-To-Differential-Via Distance is Analyzed. based on the Analysis, Electrical Performance of Differential Via Pair Can Be Accurately and Rapidly Optimized with Respect to Design Parameters, such as the Via Pitch, the Anti-Pad Radius and the GND-Via-To-Differential-Via Distance using the Proposed Model, to Provide Pre-Layout Design Guide for High-Speed Channel Designers. by using the Proposed High-Accuracy and High-Bandwidth Physics-Based Via Model, the Via Optimization Time Can Be Drastically Reduced with High Accuracy

Métodos de transducción usados en biosensores: amperometría y fluorescencia

RESUMEN: Los biosensores tienen aplicación en una gran variedad de campos, incluyendo el análisis ambiental, biomedicina, biodefensa, alimentación y agricultura, entre otros. En este tipo de sensores, un material biológico (conocido como biomediador) reacciona con el analito y un sistema de transducción apropiado transforma dicha reacción en una señal eléctrica que puede ser procesada, almacenada o transmitida usando sistemas electrónicos. En este artículo, se describen dos métodos de transducción usados en aplicaciones bio-sensoriales: la amperometria que consiste en la medida del transferimento electrónico (corriente) del biomediador y fluorescencia que es basada en la medida de la luz re-emitida. Se enfatiza en el diseño electrónico (selección de componentes, topologia de los circuitos, problemas comunes y soluciones). Estos diseños han sido utilizados en el desarrollo de instrumentos comerciales para biosensores, caracterizados por bajos costes de producción y portabilidad.ABSTRACT: Biosensor devices have applications in a variety of fields as environmental analysis, biomedical, bio-defense, food and agriculture. On this kind of sensors, a biological material (known as biomediator) reacts with target analytes and an appropriated transduction system converts that reaction to an electrical signal that can be processed, saved and transmitted by using electronic systems. In this article, two transduction methods used for biosensing applications are described: amperometry that is based on the measurement of the electron transfer occurring inside the biomediator and fluorescence, that is based on the measurement of the re-emitted light. Emphasis has been done on the electronics design, including component selection, useful circuit topologies and common problems and solutions. Electronics has been validated for the development of biosensor-based instruments characterized by low production costs and portability

Maximum Radiated Emissions of Printed Circuit Board Using Analytical Methods

The rapid progress of technology has imposed significant challenges on Printed Circuit Boards (PCB) designers. Once of those challenges is to satisfy the electromagnetic compatibility (EMC) compliance requirements. For that reason, EMC compliance must be considered earlier at the design stage for time and cost savings. Conventionally, full wave simulation is employed to check whether the designed PCB meets EMC standards or not. However, this method is not a suitable option since it requires intensive computational time and thus increasing the unit cost. This paper describes novel analytical models for estimating the radiated emissions (RE) of PCB. These models can be used to help the circuit designer to modify their circuit based on the maximum allowable RE comparing to the relevant EMC-RE standard limit. Although there are many RE sources on PCB, this paper focuses on the significant source of RE on PCB; namely PCB-traces. The trace geometry, termination impedance, dielectric type, etc. can be specified based on the maximum allowable emissions. The proposed models were verified by comparing the results of the proposed models with both simulation and experimental results. Good agreements were obtained between the analytically computed results and simulation/measurement results with accuracy of ±3dB

The Development of a Closed-form Expression for the Input Impedance of Power-return Plane Structures

In multilayer printed circuit boards, the noise on the power bus is influenced by the impedance between the power and ground planes. Power-bus noise estimates require an accurate estimate of the power-bus input impedance. This paper develops a closed-form estimate of the input impedance for circular power-return plane structures. When the structure is lossy (e.g., boards employing embedded capacitance or densely populated boards), the energy reflected from the board edge does not significantly affect the input impedance. In general, the expressions developed here for circular structures can be used to estimate the impedance of lossy power-return plane structures of any shape

Estimating the Power Bus Impedance of Printed Circuit Boards with Embedded Capacitance

Embedded capacitance is an alternative to discrete decoupling capacitors and is achieved by enhancing the natural capacitance between closely spaced power and return planes. This paper employs a simple cavity model to investigate the features affecting the power bus impedance of printed circuit boards with embedded capacitance