Adaptive Latency Insensitive Protocols

Latency-insensitive design copes with excessive delays typical of global wires in current and future IC technologies. It achieves its goal via encapsulation of synchronous logic blocks in wrappers that communicate through a latency-insensitive protocol (LIP) and pipelined interconnects. Previously proposed solutions suffer from an excessive performance penalty in terms of throughput or from a lack of generality. This article presents an adaptive LIP that outperforms previous static implementations, as demonstrated by two relevant cases — a microprocessor and an MPEG encoder — whose components we made insensitive to the latencies of their interconnections through a newly developed wrapper. We also present an informal exposition of the theoretical basis of adaptive LIPs, as well as implementation detail

클럭 게이팅 및 플립 플롭 동시 최적화를 위한 설계 및 알고리즘

학위논문 (석사)-- 서울대학교 대학원 : 공과대학 전기·정보공학부, 2019. 2. 김태환.본 논문에서는 표준 셀에서부터 배치 단계에 이르는 다양한 설계단에에서 칩의 동적 전력을 최적화 기법을 소개한다. 이 연구는 우선 데이터 구동형 (즉, 토글링 기반) 클럭 게이팅이 종래 클럭 게이팅 기법들에서 결코 다루어지지 않았던 플립 플 롭의 합성과 밀접하게 통합될 수 있는 방법을 연구한다. 우리의 관측의 핵심은 플립 플롭 셀의 일부 내부 부품이 클럭 게이팅 인에이블 신호를 생성 하기 위해 재사용 될 수 있다는 것이다. 이를 바탕으로 eXOR-FF 라고 불리는 새롭게 최적화된 플립 플롭 배선 구조를 제안합니다. 이 구조에서는 매 클럭 주기마다 내부 로직을 재사용 하여 클럭 게이팅을 통해 플립 플롭을 활성화할지 또는 비활성화할지 결정합니다. 모든 쌍의 플립 플롭 및 토글릴 감지 로직에서의 영역을 절약함에 따라서 누설 및 동적 전력의 절전 효과를 달성합니다. 그런 다음, 두 가지고유한 장점을 제공하는 배치/타이밍 인식 클럭 게이팅 탐색에 대한 포괄적인 방법론을 제안합니다. 해당 방 법론은 eXOR-FF 의 이점을 극대화하고, 전력 소비 및 타이밍 영향의 분해에 대한 정밀 분석을 수행하고 틀럭 게이팅 참색의 핵심 엔진을 비용기능으로 변환하는데 가장 적합합니다. ISCAS89, ITC89, ITC99 및 IWLS 2005의 벤치 마크 회로를 사용 한 실험을 통해 제안 된 방법이 이전의 데이터 구동 클록 게이팅 방식과 비교하여 총 전력을 5.6 % 및 면적으로 5.3 % 줄일 수 있음을 보여 주었다.In this paper, we introduce dynamic power optimization techniques applicable for various design stage from standard cell to placement stage. This work firstly investi�gates the problem of how designing data-driven (i.e., toggling based) clock gating can be closely integrated with the synthesis of flip-flops, which has never been addressed in the prior clock gating works. Our key observation is that some internal part of a flip-flop cell can be reused to generate its clock gating enable signal. Based on this, we propose a newly optimized flip-flop wiring structure, called eXOR-FF, in which an internal logic can be reused for every clock cycle to decide if the flip-flop is to be activated or inactivated through clock gating, thereby achieving area saving (thus, leakage as well as dynamic power saving) on every pair of flip-flop and its toggling detection logic. Then, we propose a comprehensive methodology of placement/timing�aware clock gating exploration that provides two unique strengths: best suited for max�imally exploiting the benefit of eXOR-FFs and precise analyses on the decomposition of power consumptions and timing impact, and translating them into cost functions in core engine of clock gating exploration. Through experiments with benchmark circuits in ISCAS89, ITC89, ITC99 and IWLS 2005, it is shown that our proposed method is able to reduce the total power by 5.6% and total cell area by 5.3% compared with the previous data-driven clock gating method in [1].Abstract Contents List of Tables List of Figures 1 Introduction 1.1 Power Consumption in CMOS Digital Design 1.2 Low Power Design Methodologies 1.3 Contribution of This Thesis 2 Preliminary and Motivations 6 2.1 Background 2.2 Observation on Area and Power Saving 2.3 Observation on Timing Impact 3 Redesign of Flip-flops Specialized for Clock Gating 3.1 Observation on Area Impact 4 Placement-aware Clock Gating Methodology Utilizing eXOR-FF Cells 4.1 Overall Design Flow 4.2 Cost Formulation for Conventional Clock Gating 4.3 Cost Formulation for Our Clock Gating using eXOR-FFs 5 Experiments 5.1 Experimental Setup 5.2 Experimental Results 5.3 Comparing with Industry Algorithm 6 Conclusion Abstract (In Korean)Maste

Physical Design and Clock Tree Synthesis Methods For A 8-Bit Processor

Now days a number of processors are available with a lot kind of feature from different industries. A processor with similar kind of architecture of the current processors only missing the memory stuffs like the RAM and ROM has been designed here with the help of Verilog style of coding. This processor contains architecturally the program counter, instruction register, ALU, ALU latch, General Purpose Registers, control state module, flag registers and the core module containing all the modules. And a test module is designed for testing the processor. After the design of the processor with successful functionality, the processor is synthesized with 180nm technology. The synthesis is performed with the data path optimization like the selection of proper adders and multipliers for timing optimization in the data path while the ALU operations are performed. During synthesis how to take care of the worst negative slack (WNS), how to include the clock gating cells, how to define the cost and path groups etc. have been covered. After the proper synthesis we get the proper net list and the synthesized constraint file for carrying out the physical design. In physical design the steps like floor-planning, partitioning, placement, legalization of the placement, clock tree synthesis, and routing etc. have been performed. At all the stages the static timing analysis is performed for the timing meet of the design for better performance in terms of timing or frequency. Each steps of physical design are discussed with special effort towards the concepts behind the step. Out of all the steps of physical design the clock tree synthesis is performed with some improvement in the performance of the clock tree by creating a symmetrical clock tree and maintaining more common clock paths. A special algorithm has been framed for creating a symmetrical clock tree and thereby making the power consumption of the clock tree low

The impact of design techniques in the reduction of power consumption of SoCs Multimedia

Orientador: Guido Costa Souza de AraújoDissertação (mestrado) - Universidade Estadual de Campinas, Instituto de ComputaçãoResumo: A indústria de semicondutores sempre enfrentou fortes demandas em resolver problema de dissipação de calor e reduzir o consumo de energia em dispositivos. Esta tendência tem sido intensificada nos últimos anos com o movimento de sustentabilidade ambiental. A concepção correta de um sistema eletrônico de baixo consumo de energia é um problema de vários níveis de complexidade e exige estratégias sistemáticas na sua construção. Fora disso, a adoção de qualquer técnica de redução de energia sempre está vinculada com objetivos especiais e provoca alguns impactos no projeto. Apesar dos projetistas conheçam bem os impactos de forma qualitativa, as detalhes quantitativas ainda são incógnitas ou apenas mantidas dentro do 'know-how' das empresas. Neste trabalho, de acordo com resultados experimentais baseado num plataforma de SoC1 industrial, tentamos quantificar os impactos derivados do uso de técnicas de redução de consumo de energia. Nos concentramos em relacionar o fator de redução de energia de cada técnica aos impactos em termo de área, desempenho, esforço de implementação e verificação. Na ausência desse tipo de dados, que relacionam o esforço de engenharia com as metas de consumo de energia, incertezas e atrasos serão frequentes no cronograma de projeto. Esperamos que este tipo de orientações possam ajudar/guiar os arquitetos de projeto em selecionar as técnicas adequadas para reduzir o consumo de energia dentro do alcance de orçamento e cronograma de projetoAbstract: The semiconductor industry has always faced strong demands to solve the problem of heat dissipation and reduce the power consumption in electronic devices. This trend has been increased in recent years with the action of environmental sustainability. The correct conception of an electronic system for low power consumption is an issue with multiple levels of complexities and requires systematic approaches in its construction. However, the adoption of any technique for reducing the power consumption is always linked with some specific goals and causes some impacts on the project. Although the designers know well that these impacts can affect the design in a quality aspect, the quantitative details are still unkown or just be kept inside the company's know-how. In this work, according to the experimental results based on an industrial SoC2 platform, we try to quantify the impacts of the use of low power techniques. We will relate the power reduction factor of each technique to the impact in terms of area, performance, implementation and verification effort. In the absence of such data, which relates the engineering effort to the goals of power consumption, uncertainties and delays are frequent. We hope that such guidelines can help/guide the project architects in selecting the appropriate techniques to reduce the power consumption within the limit of budget and project scheduleMestradoCiência da ComputaçãoMestre em Ciência da Computaçã

Automated Hardware Prototyping for 3D Network on Chips

Vor mehr als 50 Jahren stellte Intel® Mitbegründer Gordon Moore eine Prognose zum Entwicklungsprozess der Transistortechnologie auf. Er prognostizierte, dass sich die Zahl der Transistoren in integrierten Schaltungen alle zwei Jahre verdoppeln wird. Seine Aussage ist immer noch gültig, aber ein Ende von Moores Gesetz ist in Sicht. Mit dem Ende von Moore’s Gesetz müssen neue Aspekte untersucht werden, um weiterhin die Leistung von integrierten Schaltungen zu steigern. Zwei mögliche Ansätze für "More than Moore” sind 3D-Integrationsverfahren und heterogene Systeme. Gleichzeitig entwickelt sich ein Trend hin zu Multi-Core Prozessoren, basierend auf Networks on chips (NoCs). Neben dem Ende des Mooreschen Gesetzes ergeben sich bei immer kleiner werdenden Technologiegrößen, vor allem jenseits der 60 nm, neue Herausforderungen. Eine Schwierigkeit ist die Wärmeableitung in großskalierten integrierten Schaltkreisen und die daraus resultierende Überhitzung des Chips. Um diesem Problem in modernen Multi-Core Architekturen zu begegnen, muss auch die Verlustleistung der Netzwerkressourcen stark reduziert werden. Diese Arbeit umfasst eine durch Hardware gesteuerte Kombination aus Frequenzskalierung und Power Gating für 3D On-Chip Netzwerke, einschließlich eines FPGA Prototypen. Dafür wurde ein Takt-synchrones 2D Netzwerk auf ein dreidimensionales asynchrones Netzwerk mit mehreren Frequenzbereichen erweitert. Zusätzlich wurde ein skalierbares Online-Power-Management System mit geringem Ressourcenaufwand entwickelt. Die Verifikation neuer Hardwarekomponenten ist einer der zeitaufwendigsten Schritte im Entwicklungsprozess hochintegrierter digitaler Schaltkreise. Um diese Aufgabe zu beschleunigen und um eine parallele Softwareentwicklung zu ermöglichen, wurde im Rahmen dieser Arbeit ein automatisiertes und benutzerfreundliches Tool für den Entwurf neuer Hardware Projekte entwickelt. Eine grafische Benutzeroberfläche zum Erstellen des gesamten Designablaufs, vom Erstellen der Architektur, Parameter Deklaration, Simulation, Synthese und Test ist Teil dieses Werkzeugs. Zudem stellt die Größe der Architektur für die Erstellung eines Prototypen eine besondere Herausforderung dar. Frühere Arbeiten haben es versäumt, eine schnelles und unkompliziertes Prototyping, insbesondere von Architekturen mit mehr als 50 Prozessorkernen, zu realisieren. Diese Arbeit umfasst eine Design Space Exploration und FPGA-basierte Prototypen von verschiedenen 3D-NoC Implementierungen mit mehr als 80 Prozessoren

Physical design of USB1.1

In earlier days, interfacing peripheral devices to host computer has a big problematic. There existed so many different kinds’ ports like serial port, parallel port, PS/2 etc. And their use restricts many situations, Such as no hot-pluggability and involuntary configuration. There are very less number of methods to connect the peripheral devices to host computer. The main reason that Universal Serial Bus was implemented to provide an additional benefits compared to earlier interfacing ports. USB is designed to allow many peripheral be connecting using single standardize interface. It provides an expandable fast, cost effective, hot-pluggable plug and play serial hardware interface that makes life of computer user easier allowing them to plug different devices to into USB port and have them configured automatically. In this thesis demonstrated the USB v1.1 architecture part in briefly and generated gate level net list form RTL code by applying the different constraints like timing, area and power. By applying the various types design constraints so that the performance was improved by 30%. And then it implemented in physically by using SoC encounter EDI system, estimation of chip size, power analysis and routing the clock signal to all flip-flops presented in the design. To reduce the clock switching power implemented register clustering algorithm (DBSCAN). In this design implementation TSMC 180nm technology library is used

Throughput-driven floorplanning with wire pipelining

The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires

Skybridge: A New Nanoscale 3-D Computing Framework for Future Integrated Circuits

Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, continuing the traditional way of scaling to sub-20nm technologies is proving to be very difficult as MOSFETs are reaching their fundamental performance limits [1] and interconnection bottleneck is dominating IC operational power and performance [2]. Migrating to 3-D, as a way to advance scaling, has been elusive due to inherent customization and manufacturing requirements in CMOS architecture that are incompatible with 3-D organization. Partial attempts with die-die [3] and layer-layer [4] stacking have their own limitations [5]. We propose a new 3-D IC fabric technology, Skybridge [6], which offers paradigm shift in technology scaling as well as design. We co-architect Skybridge’s core aspects, from device to circuit style, connectivity, thermal management, and manufacturing pathway in a 3-D fabric-centric manner, building on a uniform 3-D template. Our extensive bottom-up simulations, accounting for detailed material system structures, manufacturing process, device, and circuit parasitics, carried through for several designs including a designed microprocessor, reveal a 30-60x density, 3.5x performance/watt benefits, and 10x reduction in interconnect lengths vs. scaled 16-nm CMOS [6]. Fabric-level heat extraction features are found to be effective in managing IC thermal profiles in 3-D. This 3-D integrated fabric proposal overcomes the current impasse of CMOS in a manner that can be immediately adopted, and offers unique solution to continue technology scaling in the 21st century

VLSI design of configurable low-power coarse-grained array architecture

Biomedical signal acquisition from in- or on-body sensors often requires local (on-node) low-level pre-processing before the data are sent to a remote node for aggregation and further processing. Local processing is required for many different operations, which include signal cleanup (noise removal), sensor calibration, event detection and data compression. In this environment, processing is subject to aggressive energy consumption restrictions, while often operating under real-time requirements. These conflicting requirements impose the use of dedicated circuits addressing a very specific task or the use of domain-specific customization to obtain significant gains in power efficiency. However, economic and time-to-market constraints often make the development or use of application-specific platforms very risky.One way to address these challenges is to develop a sensor node with a general-purpose architecture combining a low-power, low-performance general microprocessor or micro-controller with a coarse-grained reconfigurable array (CGRA) acting as an accelerator. A CGRA consists of a fixed number of processing units (e.g., ALUs) whose function and interconnections are determined by some configuration data.The objective of this work is to create an RTL-level description of a low-power CGRA of ALUs and produce a low-power VLSI (standard cell) implementation, that supports power-saving features.The CGRA implementation should use as few resources as possible and fully exploit the intended operation environment. The design will be evaluated with a set of simple signal processing task