An Experimental Evaluation of Resistive Defects and Different Testing Solutions in Low-Power Back-Biased SRAM Cells

This paper compares different types of resistive defects that may occur inside low-power SRAM cells, focusing on their impact on device operation. Notwithstanding the continuous evolution of SRAM device integration, manufacturing processes continue to be very sensitive to production faults, giving rise to defects that can be modeled as resistances, especially for devices designed to work in low-power modes. This work analyzes this type of resistive defect that may impair the device functionalities in subtle ways, depending on the defect characteristics and values that may not be directly or easily detectable by traditional test methods. We analyze each defect in terms of the possible effects inside the SRAM cell, its impact on power consumption, and provide guidelines for selecting the best test methods

Self-healing concepts involving fine-grained redundancy for electronic systems

The start of the digital revolution came through the metal-oxide-semiconductor field-effect transistor (MOSFET) in 1959 followed by massive integration onto a silicon die by means of constant down scaling of individual components. Digital systems for certain applications require fault-tolerance against faults caused by temporary or permanent influence. The most widely used technique is triple module redundancy (TMR) in conjunction with a majority voter, which is regarded as a passive fault mitigation strategy. Design by functional resilience has been applied to circuit structures for increased fault-tolerance and towards self-diagnostic triggered self-healing. The focus of this thesis is therefore to develop new design strategies for fault detection and mitigation within transistor, gate and cell design levels. The research described in this thesis makes three contributions. The first contribution is based on adding fine-grained transistor level redundancy to logic gates in order to accomplish stuck-at fault-tolerance. The objective is to realise maximum fault-masking for a logic gate with minimal added redundant transistors. In the case of non-maskable stuck-at faults, the gate structure generates an intrinsic indication signal that is suitable for autonomous self-healing functions. As a result, logic circuitry utilising this design is now able to differentiate between gate faults and faults occurring in inter-gate connections. This distinction between fault-types can then be used for triggering selective self-healing responses. The second contribution is a logic matrix element which applies the three core redundancy concepts of spatial- temporal- and data-redundancy. This logic structure is composed of quad-modular redundant structures and is capable of selective fault-masking and localisation depending of fault-type at the cell level, which is referred to as a spatiotemporal quadded logic cell (QLC) structure. This QLC structure has the capability of cellular self-healing. Through the combination of fault-tolerant and masking logic features the QLC is designed with a fault-behaviour that is equal to existing quadded logic designs using only 33.3% of the equivalent transistor resources. The inherent self-diagnosing feature of QLC is capable of identifying individual faulty cells and can trigger self-healing features. The final contribution is focused on the conversion of finite state machines (FSM) into memory to achieve better state transition timing, minimal memory utilisation and fault protection compared to common FSM designs. A novel implementation based on content-addressable type memory (CAM) is used to achieve this. The FSM is further enhanced by creating the design out of logic gates of the first contribution by achieving stuck-at fault resilience. Applying cross-data parity checking, the FSM becomes equipped with single bit fault detection and correction

Technology and layout-related testing of static random-access memories

Static random-access memories (SRAMs) exhibit faults that are electrical in nature. Functional and electrical testing are performed to diagnose faulty operation. These tests are usually designed from simple fault models that describe the chip interface behavior without a thorough analysis of the chip layout and technology. However, there are certain technology and layout-related defects that are internal to the chip and are mostly time-dependent in nature. The resulting failures may or may not seriously degrade the input/output interface behavior. They may show up as electrical faults (such as a slow access fault) and/or functional faults (such as a pattern sensitive fault). However, these faults cannot be described properly with the functional fault models because these models do not take timing into account. Also, electrical fault models that describe merely the input/output interface behavior are inadequate to characterize every possible defect in the basic SRAM cell. Examples of faults produced by these defects are: (a) static data loss, (b) abnormally high currents drawn from the power supply, etc. Generating tests for such faults often requires a thorough understanding and analysis of the circuit technology and layout. In this article, we shall examine ways to characterize and test such faults. We shall divide such faults into two categories depending on the types of SRAMs they effect—silicon SRAMs and GaAs SRAMs.Peer Reviewedhttp://deepblue.lib.umich.edu/bitstream/2027.42/43015/1/10836_2004_Article_BF00972519.pd

Demonstration of SRAM Design with LED Cube Display

There is a constant push to reduce power consumption and increase speed in transistor memory devices. The goal of this project is to improve Allegro MicroSystems’ current Static Random Access Memory technology by designing and implementing a new sense amplifier. The final design is latch based and uses positive feedback to quickly display data at the output, which stops static current flow and dramatically reduces power consumption. Additionally a three-dimensional LED structure was designed and built to display a series of letters, characters or visual effects

The Fifth NASA Symposium on VLSI Design

The fifth annual NASA Symposium on VLSI Design had 13 sessions including Radiation Effects, Architectures, Mixed Signal, Design Techniques, Fault Testing, Synthesis, Signal Processing, and other Featured Presentations. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The presentations share insights into next generation advances that will serve as a basis for future VLSI design

CMOS VLSI correlator design for radio-astronomical signal processing : a thesis presented in partial fulfilment of the requirements for the degree of Doctor of Philosophy in Engineering at Massey University, Auckland, New Zealand

Multi-element radio telescopes employ methods of indirect imaging to capture the image of the sky. These methods are in contrast to direct imaging methods whereby the image is constructed from sensor measurements directly and involve extensive signal processing on antenna signals. The Square Kilometre Array, or the SKA, is a future radio telescope of this type that, once built, will become the largest telescope in the world. The unprecedented scale of the SKA requires novel solutions to be developed for its signal processing pipeline one of the most resource-consuming parts of which is the correlator. The SKA uses the FX correlator construction that consists of two parts: the F part that translates antenna signals into frequency domain and the X part that cross-correlates these signals between each other. This research focuses on the integrated circuit design and VLSI implementation issues of the X part of a very large FX correlator in 28 nm and 130 nm CMOS. The correlator’s main processing operation is the complex multiply-accumulation (CMAC) for which custom 28 nm CMAC designs are presented and evaluated. Performance of various memories inside the correlator also affects overall efficiency, and input-buffered and output-buffered approaches are considered with the goal of improving upon it. For output-buffered designs, custom memory control circuits have been designed and prototyped in 130 nm that improve upon eDRAM by taking advantage of sequential access patterns. For the input-buffered architecture, a new scheme is proposed that decreases the usage of the input-buffer memory by a third by making use of multiple accumulators in every CMAC. Because cross-correlation is a very data-intensive process, high-performance SerDes I/O is essential to any practical ASIC implementation. On the I/O design, the 28 nm full-rate transmitter delivering 15 Gbps per lane is presented. This design consists of the scrambler, the serialiser, the digital VCO with analog fine-tuning and the SST driver including features of a 4-tap FFE, impedance tuning and amplitude tuning

Interconnect yield analysis and fault tolerance for field programmable gate arrays

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