A Survey of Fault-Tolerance Techniques for Embedded Systems from the Perspective of Power, Energy, and Thermal Issues

The relentless technology scaling has provided a significant increase in processor performance, but on the other hand, it has led to adverse impacts on system reliability. In particular, technology scaling increases the processor susceptibility to radiation-induced transient faults. Moreover, technology scaling with the discontinuation of Dennard scaling increases the power densities, thereby temperatures, on the chip. High temperature, in turn, accelerates transistor aging mechanisms, which may ultimately lead to permanent faults on the chip. To assure a reliable system operation, despite these potential reliability concerns, fault-tolerance techniques have emerged. Specifically, fault-tolerance techniques employ some kind of redundancies to satisfy specific reliability requirements. However, the integration of fault-tolerance techniques into real-time embedded systems complicates preserving timing constraints. As a remedy, many task mapping/scheduling policies have been proposed to consider the integration of fault-tolerance techniques and enforce both timing and reliability guarantees for real-time embedded systems. More advanced techniques aim additionally at minimizing power and energy while at the same time satisfying timing and reliability constraints. Recently, some scheduling techniques have started to tackle a new challenge, which is the temperature increase induced by employing fault-tolerance techniques. These emerging techniques aim at satisfying temperature constraints besides timing and reliability constraints. This paper provides an in-depth survey of the emerging research efforts that exploit fault-tolerance techniques while considering timing, power/energy, and temperature from the real-time embedded systems’ design perspective. In particular, the task mapping/scheduling policies for fault-tolerance real-time embedded systems are reviewed and classified according to their considered goals and constraints. Moreover, the employed fault-tolerance techniques, application models, and hardware models are considered as additional dimensions of the presented classification. Lastly, this survey gives deep insights into the main achievements and shortcomings of the existing approaches and highlights the most promising ones

Design Space Exploration and Resource Management of Multi/Many-Core Systems

The increasing demand of processing a higher number of applications and related data on computing platforms has resulted in reliance on multi-/many-core chips as they facilitate parallel processing. However, there is a desire for these platforms to be energy-efficient and reliable, and they need to perform secure computations for the interest of the whole community. This book provides perspectives on the aforementioned aspects from leading researchers in terms of state-of-the-art contributions and upcoming trends

Virtual Runtime Application Partitions for Resource Management in Massively Parallel Architectures

This thesis presents a novel design paradigm, called Virtual Runtime Application Partitions (VRAP), to judiciously utilize the on-chip resources. As the dark silicon era approaches, where the power considerations will allow only a fraction chip to be powered on, judicious resource management will become a key consideration in future designs. Most of the works on resource management treat only the physical components (i.e. computation, communication, and memory blocks) as resources and manipulate the component to application mapping to optimize various parameters (e.g. energy efficiency). To further enhance the optimization potential, in addition to the physical resources we propose to manipulate abstract resources (i.e. voltage/frequency operating point, the fault-tolerance strength, the degree of parallelism, and the configuration architecture). The proposed framework (i.e. VRAP) encapsulates methods, algorithms, and hardware blocks to provide each application with the abstract resources tailored to its needs. To test the efficacy of this concept, we have developed three distinct self adaptive environments: (i) Private Operating Environment (POE), (ii) Private Reliability Environment (PRE), and (iii) Private Configuration Environment (PCE) that collectively ensure that each application meets its deadlines using minimal platform resources. In this work several novel architectural enhancements, algorithms and policies are presented to realize the virtual runtime application partitions efficiently. Considering the future design trends, we have chosen Coarse Grained Reconfigurable Architectures (CGRAs) and Network on Chips (NoCs) to test the feasibility of our approach. Specifically, we have chosen Dynamically Reconfigurable Resource Array (DRRA) and McNoC as the representative CGRA and NoC platforms. The proposed techniques are compared and evaluated using a variety of quantitative experiments. Synthesis and simulation results demonstrate VRAP significantly enhances the energy and power efficiency compared to state of the art.Siirretty Doriast

Energy-Efficient and Reliable Computing in Dark Silicon Era

Dark silicon denotes the phenomenon that, due to thermal and power constraints, the fraction of transistors that can operate at full frequency is decreasing in each technology generation. Moore’s law and Dennard scaling had been backed and coupled appropriately for five decades to bring commensurate exponential performance via single core and later muti-core design. However, recalculating Dennard scaling for recent small technology sizes shows that current ongoing multi-core growth is demanding exponential thermal design power to achieve linear performance increase. This process hits a power wall where raises the amount of dark or dim silicon on future multi/many-core chips more and more. Furthermore, from another perspective, by increasing the number of transistors on the area of a single chip and susceptibility to internal defects alongside aging phenomena, which also is exacerbated by high chip thermal density, monitoring and managing the chip reliability before and after its activation is becoming a necessity. The proposed approaches and experimental investigations in this thesis focus on two main tracks: 1) power awareness and 2) reliability awareness in dark silicon era, where later these two tracks will combine together. In the first track, the main goal is to increase the level of returns in terms of main important features in chip design, such as performance and throughput, while maximum power limit is honored. In fact, we show that by managing the power while having dark silicon, all the traditional benefits that could be achieved by proceeding in Moore’s law can be also achieved in the dark silicon era, however, with a lower amount. Via the track of reliability awareness in dark silicon era, we show that dark silicon can be considered as an opportunity to be exploited for different instances of benefits, namely life-time increase and online testing. We discuss how dark silicon can be exploited to guarantee the system lifetime to be above a certain target value and, furthermore, how dark silicon can be exploited to apply low cost non-intrusive online testing on the cores. After the demonstration of power and reliability awareness while having dark silicon, two approaches will be discussed as the case study where the power and reliability awareness are combined together. The first approach demonstrates how chip reliability can be used as a supplementary metric for power-reliability management. While the second approach provides a trade-off between workload performance and system reliability by simultaneously honoring the given power budget and target reliability

A survey of system level power management schemes in the dark-silicon era for many-core architectures

Power consumption in Complementary Metal Oxide Semiconductor (CMOS) technology has escalated to a point that only a fractional part of many-core chips can be powered-on at a time. Fortunately, this fraction can be increased at the expense of performance through the dark-silicon solution. However, with many-core integration set to be heading towards its thousands, power consumption and temperature increases per time, meaning the number of active nodes must be reduced drastically. Therefore, optimized techniques are demanded for continuous advancement in technology. Existing efforts try to overcome this challenge by activating nodes from different parts of the chip at the expense of communication latency. Other efforts on the other hand employ run-time power management techniques to manage the power performance of the cores trading-off performance for power. We found out that, for a significant amount of power to saved and high temperature to be avoided, focus should be on reducing the power consumption of all the on-chip components. Especially, the memory hierarchy and the interconnect. Power consumption can be minimized by, reducing the size of high leakage power dissipating elements, turning-off idle resources and integrating power saving materials

Aggressive undervolting of FPGAs : power & reliability trade-offs

In this work, we evaluate aggressive undervolting, i.e., voltage underscaling below the nominal level to reduce the energy consumption of Field Programmable Gate Arrays (FPGAs). Usually, voltage guardbands are added by chip vendors to ensure the worst-case process and environmental scenarios. Through experimenting on several FPGA architectures, we con¿rm a large voltage guardband for several FPGA components, which in turn, delivers signi¿cant power savings. However, further undervolting below the voltage guardband may cause reliability issues as the result of the circuit delay increase, and faults might start to appear. We extensively characterize the behavior of these faults in terms of the rate, location, type, as well as sensitivity to environmental temperature, primarily focusing on FPGA on-chip memories, or Block RAMs (BRAMs). Understanding this behavior can allow to deploy ef¿cient mitigation techniques, and in turn, FPGA-based designs can be improved for better energy, reliability, and performance trade-offs. Finally, as a case study, we evaluate a typical FPGA-based Neural Network (NN) accelerator when the FPGA voltage is underscaled. In consequence, the substantial NN energy savings come with the cost of NN accuracy loss. To attain power savings without NN accuracy loss below the voltage guardband gap, we proposed an application-aware technique and we also, evaluated the built-in Error-Correcting Code (ECC) mechanism. Hence, First, we developed an application-dependent BRAMs placement technique that relies on the deterministic behavior of undervolting faults, and mitigates these faults by mapping the most reliability sensitive NN parameters to BRAM blocks that are relatively more resistant to undervolting faults. Second, as a more general technique, we applied the built-in ECC of BRAMs and observed a signi¿cant fault coverage capability thanks to the behavior of undervolting faults, with a negligible power consumption overhead.En este trabajo, evaluamos el reducir el voltaje en forma agresiva, es decir, bajar la tensión por debajo del nivel nominal para reducir el consumo de energía en Field Programmable Gate Arrays (FPGA). Por lo general, los vendedores de chips establecen margen de seguridad al voltaje para garantizar el funcionamiento de los mismos en el peor de los casos y en los peores escenarios ambientales. Mediante la experimentación en varias arquitecturas FPGA, confirmamos que hay un margen de seguridad de voltaje grande en varios de los componentes de la FPGA, que a su vez, nos ofrece ahorros de energía significativos. Sin embargo, un trabajar a un voltaje por debajo del margen de seguridad del voltaje puede causar problemas de confiabilidad a medida ya que aumenta el retardo del circuito y pueden comenzar a aparecer fallos. Caracterizamos ampliamente el comportamiento de estos fallos en términos de velocidad, ubicación, tipo, así como la sensibilidad a la temperatura ambiental, centrándonos principalmente en memorias internas de la FPGA, o Block RAM (BRAM). Comprender este comportamiento puede permitir el desarrollo de técnicas eficientes de mitigación y, a su vez, mejorar los diseños basados en FPGA para obtener ahorros en energía, una mayor confiabilidad y un mayor rendimiento. Finalmente, como caso de estudio, evaluamos un acelerador típico de Redes Neuronales basado en FPGA cuando el voltaje de la FPGA esta por debajo del nivel mínimo de seguridad. En consecuencia, los considerables ahorros de energía de la red neuronal vienen asociados con la pérdida de precisión de la red neuronal. Para obtener ahorros de energía sin una pérdida de precisión en la red neuronal por debajo del margen de seguridad del voltaje, proponemos una técnica que tiene en cuenta la aplicación, asi mismo, evaluamos el mecanismo integrado en las BRAMs de Error Correction Code (ECC). Por lo tanto, en primer lugar, desarrollamos una técnica de colocación de BRAM dependiente de la aplicación que se basa en el comportamiento determinista de las fallos cuando la FPGA funciona por debajo del margen de seguridad, y se mitigan estos fallos asignando los parámetros de la red neuronal más sensibles a producir fallos a los bloques BRAM que son relativamente más resistentes a los fallos. En segundo lugar, como técnica más general, aplicamos el ECC incorporado de los BRAM y observamos una capacidad de cobertura de fallos significativo gracias a las características de comportamiento de fallos, con una sobrecoste de consumo de energía insignificantePostprint (published version