Parametric Macromodels of Drivers for SSN Simulations

This paper addresses the modeling of output and power supply ports of digital drivers for accurate and efficient SSN simulations. The proposed macromodels are defined by parametric relations, whose parameters are estimated from measured or simulated port transient responses, and are implemented as SPICE subcircuits. The modeling technique is applied to commercial high-speed devices and a realistic simulation example is shown

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

The 1980 land cover for the Puget Sound region

Both LANDSAT imagery and the video information communications and retrieval software were used to develop a land cover classifiction of the Puget Sound of Washington. Planning agencies within the region were provided with a highly accurate land cover map registered to the 1980 census tracts which could subsequently be incorporated as one data layer in a multi-layer data base. Many historical activities related to previous land cover mapping studies conducted in the Puget Sound region are summarized. Valuable insight into conducting a project with a large community of users and in establishing user confidence in a multi-purpose land cover map derived from LANDSAT is provided

Parametric Macromodels of Drivers for SSN Simulations

This paper addresses the modeling of output and power supply ports of digital drivers for accurate and efficient SSN simulations. The proposed macromodels are defined by parametric relations, whose parameters are estimated from measured or simulated port transient responses, and are implemented as SPICE subcircuits. The modeling technique is applied to commercial high-speed devices and a realistic simulation example is shown

TVS transient behavior modeling method, and system-level effective ESD design for USB3.x interface

This research proposal presents a methodology whereby a protection device can be modeled in SPICE compatible platforms with respect to the transient behaviors during Electrostatic Discharge (ESD) events. This methodology uses an exclusively black-box approach to characterize the parameters of the protection device, thereby allowing it to be implemented without intimate knowledge of the DUT. Results of this methodology can be used to predict the transient response (conductivity modulation and snapback delay) of the ESD protection devices, and thereby predicts how much current could flow into the device (typically a digital IO pin) under protection. The transient behavior modeling methodology for the ESD protection device is developed for the purpose of system level ESD design, and it is part of the study of System-level Effective ESD Design (SEED) methodology. During the work, the transient behavior modeling method and the SEED methodology have been applied to a high-speed USB3.x repeater IC circuit design. This article introduces a PCB test board working as USB3.x repeater, which allows to place various on-board protection devices and to measure the residual voltage and current at the IO pin accurately. In Section 2, the transient behavior modeling framework and the characterization method will be introduced. The validation results of three different types of protection devices are shown in the end of the section. In Section 3, the implementation of SEED methodology to a USB3.x system design will be introduced. The measurement setup is described in detail. Finally, the validation results for different scenarios will be shown --Abstract, page iii

Use of collateral information to improve LANDSAT classification accuracies

There are no author-identified significant results in this report

Analysis and modeling of power supply induced jitter for high speed driver and low dropout voltage regulator

”With the scaling of power supply voltage levels and improving trans-conductance of drivers, the sensitivity of drivers to power supply induced delays has increased. The power supply induced jitter (PSIJ) has become one of the major concerns for high-speed system. In this work, the PSIJ analysis and modeling method are proposed for high speed drivers and the system with on-die low dropout (LDO) voltage regulator. In addition, a jitter-aware target impedance concept is proposed for power distribution network (PDN) design to correlate the PSIJ with PDN parasitic. The proposed PSIJ analysis model is based on the driver power supply rejection ratio (PSRR) response, transition edge slope and the propagation delay. It is demonstrated that the proposed model can be generalized for different type of drivers. Following the proposed PSIJ model, a method for improving the PSIJ simulation accuracy in the input/output buffer information (IBIS) model is also proposed. A PSIJ analysis method is also proposed for system with on-die LDO. The approach relies on separate analysis of the LDO block PSRR response and the buffer block PSIJ sensitivity. This procedure allows designer to evaluate the system PSIJ with fewer and faster simulations. For the jitter-aware target impedance, a systematic procedure to develop the target impedance curves is formulated and developed for common CMOS buffer circuits. Given the transient IC switching current and the jitter specification, multiple target impedance curves can be defined for a specific circuit. The proposed design procedure can largely relieve over-constrain in the PDN designed based on the original target impedance definition”--Abstract, page iv

Macromodel Extraction for Drivers in High-Speed Communications Channels

Proyecto de Graduación (Licenciatura en Ingeniería Electrónica) Instituto Tecnológico de Costa Rica, Escuela de Ingeniería Electrónica, 2015.This thesis describes the process performed for extracting a descriptive macromodel for a generic transmitter block at IC level for high-speed channels applications. The work has been focused on a first approach to establish at methodology to extract a macromodel considering both the signal and power domains. Macromodels are required to perform accurate and numerically efficient simulations, in order to verify and validate behavior performances of communication links without having to consider the full driver model and potential IP sensitive information related to it. In this work, different approaches for macromodeling generation are reviewed and a methodology based on the IBIS specification is explored. A driver specific topology had been chosen in order to exercise the methodology for macromodel generation. An important feature of the methodology is the possibility to include the effects concerning signal integrity and power integrity simultaneously, which was carried out by including controlled sources on the output of the driver

Otimização e melhoria da modulação comportamental para os interfaces de E/S analógica e de sinal misto de alta velocidade

Doutoramento em Engenharia ElectrotécnicaA integridade do sinal em sistemas digitais interligados de alta velocidade, e avaliada através da simulação de modelos físicos (de nível de transístor) é custosa de ponto vista computacional (por exemplo, em tempo de execução de CPU e armazenamento de memória), e exige a disponibilização de detalhes físicos da estrutura interna do dispositivo. Esse cenário aumenta o interesse pela alternativa de modelação comportamental que descreve as características de operação do equipamento a partir da observação dos sinais eléctrico de entrada/saída (E/S). Os interfaces de E/S em chips de memória, que mais contribuem em carga computacional, desempenham funções complexas e incluem, por isso, um elevado número de pinos. Particularmente, os buffers de saída são obrigados a distorcer os sinais devido à sua dinâmica e não linearidade. Portanto, constituem o ponto crítico nos de circuitos integrados (CI) para a garantia da transmissão confiável em comunicações digitais de alta velocidade. Neste trabalho de doutoramento, os efeitos dinâmicos não-lineares anteriormente negligenciados do buffer de saída são estudados e modulados de forma eficiente para reduzir a complexidade da modelação do tipo caixa-negra paramétrica, melhorando assim o modelo standard IBIS. Isto é conseguido seguindo a abordagem semi-física que combina as características de formulação do modelo caixa-negra, a análise dos sinais eléctricos observados na E/S e propriedades na estrutura física do buffer em condições de operação práticas. Esta abordagem leva a um processo de construção do modelo comportamental fisicamente inspirado que supera os problemas das abordagens anteriores, optimizando os recursos utilizados em diferentes etapas de geração do modelo (ou seja, caracterização, formulação, extracção e implementação) para simular o comportamento dinâmico não-linear do buffer. Em consequência, contributo mais significativo desta tese é o desenvolvimento de um novo modelo comportamental analógico de duas portas adequado à simulação em overclocking que reveste de um particular interesse nas mais recentes usos de interfaces de E/S para memória de elevadas taxas de transmissão. A eficácia e a precisão dos modelos comportamentais desenvolvidos e implementados são qualitativa e quantitativamente avaliados comparando os resultados numéricos de extracção das suas funções e de simulação transitória com o correspondente modelo de referência do estado-da-arte, IBIS.Signal integrity (SI) simulation of high-speed digital interconnected system via transistor level models is computational expensive (e.g. CPU time and memory storage), and requires the availability of physical details information of device’s internal structure. This scenario raises the interest for a behavioral modeling alternative which describes the device’s operation characteristics based on the observed input/output (I/O) electrical signal. I/O buffers that interface memory’s interconnects have major share in the computational load containing a very active complex functional part and high numbers of pins. Particularly, output buffers/drivers are forced to distort the I/O signals due to their nonlinear dynamics. In this concern, they constitute the integrated circuit (IC) bottleneck of ensuring reliable data transmission in the high-speed digital communication link. In this PhD work, the previously neglected driver’s nonlinear dynamic effects are efficiently captured to significantly reduce the state of the art black-box parametric modeling complexities and enhance the input/output buffers information specifications (IBIS). This is achieved by following the gray-box approach that merges the features of the black-box model’s formulation, the analysis of the observed I/O electrical signals and the buffer’s physical structure properties under practical operation conditions. This approach leads to physically inspired behavioral model’s construction procedure that overcomes the issues of the previous modeling approaches by optimizing the resources used at different model’s generation steps (i.e. characterization, formulation, extraction, and implementation) to mimic the driver’s nonlinear dynamic behavior. Moreover, the most important achievement is the development of a new two-port analog behavioral model for overclocking simulation that copes with the recent trends in I/O memory interfaces characterized by higher data rate transmission. The effectiveness and the accuracy of the developed and implemented behavioral models are qualitatively and quantitatively assessed by comparing the numerical results of their functions extraction and transient simulation to the ones simulated and extracted with transistor level models and the state of the art IBIS in order to validate their predictive and the generalization capabilities