CAD Automation Module Based On Cell Moving Algorithm For Incremental Placement Timing Optimization

Engineering Change Order (ECO) is a process to handle logic changes in circuit design. In deep sub-micron era, logic change in design happens inevitably. Design changes are required for numerous reasons. The reasons may be to fix design bugs, meeting design functionality change due to customer’s requirement or optimize design performance such as power consumption. An incremental placement that has the capability to handle design changes efficiently manages to save time and cost. This is why ECO remains one of the most influential steps in Very Large Scale Integration (VLSI) design. This thesis describes timing driven incremental placement that uses standard-cell move technique to improve timing of the layout design

EDA design for Microscale Modular Assembled ASIC (M2A2) circuits

As the semiconductor industry has driven down the minimum feature size to well below 50nm, the mask cost to make devices has skyrocketed. The cost for a full set of masks is estimated to be about $1.5M for 90nm node devices and exceeding$2M for 65nm lithography nodes. According to some estimates, mask writing time goes up as a power of five as feature sizes are decreased below 50nm. In addition, higher complexity of large designs increases the number of design re-spins. The above two factors lead to considerable increase in the nonrecurring engineering cost (NRE) for standard cell ASICs, which has become prohibitively expensive for low to mid volume applications. Field programmable gate array (FPGAs) offer an acceptable solution for fast prototyping and ultra-low volume applications, but are generally not seen as a replacement for ASICs because of their highly inefficient space utilization, lower performance/speed and high power consumption. This is particularly the case as mobility has driven expectations for small form factor and low power consumption. In this work, a new type of ASICs named as Microscale Modular Assembled ASIC (M2A2) is proposed. This technology is a novel application of the high-speed, precision assembly technique for fabrication of ASICs using a limited number of mass-produced feedstock logic circuits. The idea is to share the mask cost for sub-100nm feature sizes across a large number of ASIC designs, decreasing the NRE for individual designs. The concept of constructing ASICs using repeating logic elements is based on previous works where it has been shown that ASICs made of via/metal configured structured elements can achieve space utilization and performance comparable to cell based ASICs. However, in the proposed technique, we provide significantly more choice in the transistor layer, in terms of feedstock types and their configuration. This thesis document deals with the electronic design automation (EDA) design for microscale modular assembled ASIC based circuits. The document discusses the design of feedstock cells, generation of feedstock preplaced design, generation of design collaterals to support M2A2 EDA flow, and front end M2A2 synthesis flow to meet the required functionality of design and achieve optimal quality of results (QoR) metrics in terms of circuit performance/speed, power and areaElectrical and Computer Engineerin

Design Space Exploration and Resource Management of Multi/Many-Core Systems

The increasing demand of processing a higher number of applications and related data on computing platforms has resulted in reliance on multi-/many-core chips as they facilitate parallel processing. However, there is a desire for these platforms to be energy-efficient and reliable, and they need to perform secure computations for the interest of the whole community. This book provides perspectives on the aforementioned aspects from leading researchers in terms of state-of-the-art contributions and upcoming trends

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Design of complex integrated systems based on networks-on-chip: Trading off performance, power and reliability

The steady advancement of microelectronics is associated with an escalating number of challenges for design engineers due to both the tiny dimensions and the enormous complexity of integrated systems. Against this background, this work deals with Network-On-Chip (NOC) as the emerging design paradigm to cope with diverse issues of nanotechnology. The detailed investigations within the chapters focus on the communication-centric aspects of multi-core-systems, whereas performance, power consumption as well as reliability are considered likewise as the essential design criteria

COBE's search for structure in the Big Bang

The launch of Cosmic Background Explorer (COBE) and the definition of Earth Observing System (EOS) are two of the major events at NASA-Goddard. The three experiments contained in COBE (Differential Microwave Radiometer (DMR), Far Infrared Absolute Spectrophotometer (FIRAS), and Diffuse Infrared Background Experiment (DIRBE)) are very important in measuring the big bang. DMR measures the isotropy of the cosmic background (direction of the radiation). FIRAS looks at the spectrum over the whole sky, searching for deviations, and DIRBE operates in the infrared part of the spectrum gathering evidence of the earliest galaxy formation. By special techniques, the radiation coming from the solar system will be distinguished from that of extragalactic origin. Unique graphics will be used to represent the temperature of the emitting material. A cosmic event will be modeled of such importance that it will affect cosmological theory for generations to come. EOS will monitor changes in the Earth's geophysics during a whole solar color cycle

Sustainable Industrial Engineering along Product-Service Life Cycle/Supply Chain

Sustainable industrial engineering addresses the sustainability issue from economic, environmental, and social points of view. Its application fields are the whole value chain and lifecycle of products/services, from the development to the end-of-life stages. This book aims to address many of the challenges faced by industrial organizations and supply chains to become more sustainable through reinventing their processes and practices, by continuously incorporating sustainability guidelines and practices in their decisions, such as circular economy, collaboration with suppliers and customers, using information technologies and systems, tracking their products’ life-cycle, using optimization methods to reduce resource use, and to apply new management paradigms to help mitigate many of the wastes that exist across organizations and supply chains. This book will be of interest to the fast-growing body of academics studying and researching sustainability, as well as to industry managers involved in sustainability management

Low-cost and efficient fault detection and diagnosis schemes for modern cores

Continuous improvements in transistor scaling together with microarchitectural advances have made possible the widespread adoption of high-performance processors across all market segments. However, the growing reliability threats induced by technology scaling and by the complexity of designs are challenging the production of cheap yet robust systems. Soft error trends are haunting, especially for combinational logic, and parity and ECC codes are therefore becoming insufficient as combinational logic turns into the dominant source of soft errors. Furthermore, experts are warning about the need to also address intermittent and permanent faults during processor runtime, as increasing temperatures and device variations will accelerate inherent aging phenomena. These challenges specially threaten the commodity segments, which impose requirements that existing fault tolerance mechanisms cannot offer. Current techniques based on redundant execution were devised in a time when high penalties were assumed for the sake of high reliability levels. Novel light-weight techniques are therefore needed to enable fault protection in the mass market segments. The complexity of designs is making post-silicon validation extremely expensive. Validation costs exceed design costs, and the number of discovered bugs is growing, both during validation and once products hit the market. Fault localization and diagnosis are the biggest bottlenecks, magnified by huge detection latencies, limited internal observability, and costly server farms to generate test outputs. This thesis explores two directions to address some of the critical challenges introduced by unreliable technologies and by the limitations of current validation approaches. We first explore mechanisms for comprehensively detecting multiple sources of failures in modern processors during their lifetime (including transient, intermittent, permanent and also design bugs). Our solutions embrace a paradigm where fault tolerance is built based on exploiting high-level microarchitectural invariants that are reusable across designs, rather than relying on re-execution or ad-hoc block-level protection. To do so, we decompose the basic functionalities of processors into high-level tasks and propose three novel runtime verification solutions that combined enable global error detection: a computation/register dataflow checker, a memory dataflow checker, and a control flow checker. The techniques use the concept of end-to-end signatures and allow designers to adjust the fault coverage to their needs, by trading-off area, power and performance. Our fault injection studies reveal that our methods provide high coverage levels while causing significantly lower performance, power and area costs than existing techniques. Then, this thesis extends the applicability of the proposed error detection schemes to the validation phases. We present a fault localization and diagnosis solution for the memory dataflow by combining our error detection mechanism, a new low-cost logging mechanism and a diagnosis program. Selected internal activity is continuously traced and kept in a memory-resident log whose capacity can be expanded to suite validation needs. The solution can catch undiscovered bugs, reducing the dependence on simulation farms that compute golden outputs. Upon error detection, the diagnosis algorithm analyzes the log to automatically locate the bug, and also to determine its root cause. Our evaluations show that very high localization coverage and diagnosis accuracy can be obtained at very low performance and area costs. The net result is a simplification of current debugging practices, which are extremely manual, time consuming and cumbersome. Altogether, the integrated solutions proposed in this thesis capacitate the industry to deliver more reliable and correct processors as technology evolves into more complex designs and more vulnerable transistors.El continuo escalado de los transistores junto con los avances microarquitectónicos han posibilitado la presencia de potentes procesadores en todos los segmentos de mercado. Sin embargo, varios problemas de fiabilidad están desafiando la producción de sistemas robustos. Las predicciones de "soft errors" son inquietantes, especialmente para la lógica combinacional: soluciones como ECC o paridad se están volviendo insuficientes a medida que dicha lógica se convierte en la fuente predominante de soft errors. Además, los expertos están alertando acerca de la necesidad de detectar otras fuentes de fallos (causantes de errores permanentes e intermitentes) durante el tiempo de vida de los procesadores. Los segmentos "commodity" son los más vulnerables, ya que imponen unos requisitos que las técnicas actuales de fiabilidad no ofrecen. Estas soluciones (generalmente basadas en re-ejecución) fueron ideadas en un tiempo en el que con tal de alcanzar altos nivel de fiabilidad se asumían grandes costes. Son por tanto necesarias nuevas técnicas que permitan la protección contra fallos en los segmentos más populares. La complejidad de los diseños está encareciendo la validación "post-silicon". Su coste excede el de diseño, y el número de errores descubiertos está aumentando durante la validación y ya en manos de los clientes. La localización y el diagnóstico de errores son los mayores problemas, empeorados por las altas latencias en la manifestación de errores, por la poca observabilidad interna y por el coste de generar las señales esperadas. Esta tesis explora dos direcciones para tratar algunos de los retos causados por la creciente vulnerabilidad hardware y por las limitaciones de los enfoques de validación. Primero exploramos mecanismos para detectar múltiples fuentes de fallos durante el tiempo de vida de los procesadores (errores transitorios, intermitentes, permanentes y de diseño). Nuestras soluciones son de un paradigma donde la fiabilidad se construye explotando invariantes microarquitectónicos genéricos, en lugar de basarse en re-ejecución o en protección ad-hoc. Para ello descomponemos las funcionalidades básicas de un procesador y proponemos tres soluciones de `runtime verification' que combinadas permiten una detección de errores a nivel global. Estas tres soluciones son: un verificador de flujo de datos de registro y de computación, un verificador de flujo de datos de memoria y un verificador de flujo de control. Nuestras técnicas usan el concepto de firmas y permiten a los diseñadores ajustar los niveles de protección a sus necesidades, mediante compensaciones en área, consumo energético y rendimiento. Nuestros estudios de inyección de errores revelan que los métodos propuestos obtienen altos niveles de protección, a la vez que causan menos costes que las soluciones existentes. A continuación, esta tesis explora la aplicabilidad de estos esquemas a las fases de validación. Proponemos una solución de localización y diagnóstico de errores para el flujo de datos de memoria que combina nuestro mecanismo de detección de errores, junto con un mecanismo de logging de bajo coste y un programa de diagnóstico. Cierta actividad interna es continuamente registrada en una zona de memoria cuya capacidad puede ser expandida para satisfacer las necesidades de validación. La solución permite descubrir bugs, reduciendo la necesidad de calcular los resultados esperados. Al detectar un error, el algoritmo de diagnóstico analiza el registro para automáticamente localizar el bug y determinar su causa. Nuestros estudios muestran un alto grado de localización y de precisión de diagnóstico a un coste muy bajo de rendimiento y área. El resultado es una simplificación de las prácticas actuales de depuración, que son enormemente manuales, incómodas y largas. En conjunto, las soluciones de esta tesis capacitan a la industria a producir procesadores más fiables, a medida que la tecnología evoluciona hacia diseños más complejos y más vulnerables