201 research outputs found

    HW-SW Emulation Framework for Temperature-Aware Design in MPSoCs

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    New tendencies envisage Multi-Processor Systems-On-Chip (MPSoCs) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute multiple applications (games, video), while meeting additional design constraints (energy consumption, time-to-market). Moreover, the rise of temperature in the die for MPSoCs can seriously affect their final performance and reliability. In this paper, we present a new hardware-software emulation framework that allows designers a complete exploration of the thermal behavior of final MPSoC designs early in the design flow. The proposed framework uses FPGA emulation as the key element to model the hardware components of the considered MPSoC platform at multi-megahertz speeds. It automatically extracts detailed system statistics that are used as input to our software thermal library running in a host computer. This library calculates at run-time the temperature of on-chip components, based on the collected statistics from the emulated system and the final floorplan of the MPSoC. This enables fast testing of various thermal management techniques. Our results show speed-ups of three orders of magnitude compared to cycle-accurate MPSoC simulator

    Pre-validation of SoC via hardware and software co-simulation

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    Abstract. System-on-chips (SoCs) are complex entities consisting of multiple hardware and software components. This complexity presents challenges in their design, verification, and validation. Traditional verification processes often test hardware models in isolation until late in the development cycle. As a result, cooperation between hardware and software development is also limited, slowing down bug detection and fixing. This thesis aims to develop, implement, and evaluate a co-simulation-based pre-validation methodology to address these challenges. The approach allows for the early integration of hardware and software, serving as a natural intermediate step between traditional hardware model verification and full system validation. The co-simulation employs a QEMU CPU emulator linked to a register-transfer level (RTL) hardware model. This setup enables the execution of software components, such as device drivers, on the target instruction set architecture (ISA) alongside cycle-accurate RTL hardware models. The thesis focuses on two primary applications of co-simulation. Firstly, it allows software unit tests to be run in conjunction with hardware models, facilitating early communication between device drivers, low-level software, and hardware components. Secondly, it offers an environment for using software in functional hardware verification. A significant advantage of this approach is the early detection of integration errors. Software unit tests can be executed at the IP block level with actual hardware models, a task previously only possible with costly system-level prototypes. This enables earlier collaboration between software and hardware development teams and smoothens the transition to traditional system-level validation techniques.Järjestelmäpiirin esivalidointi laitteiston ja ohjelmiston yhteissimulaatiolla. Tiivistelmä. Järjestelmäpiirit (SoC) ovat monimutkaisia kokonaisuuksia, jotka koostuvat useista laitteisto- ja ohjelmistokomponenteista. Tämä monimutkaisuus asettaa haasteita niiden suunnittelulle, varmennukselle ja validoinnille. Perinteiset varmennusprosessit testaavat usein laitteistomalleja eristyksissä kehityssyklin loppuvaiheeseen saakka. Tämän myötä myös yhteistyö laitteisto- ja ohjelmistokehityksen välillä on vähäistä, mikä hidastaa virheiden tunnistamista ja korjausta. Tämän diplomityön tavoitteena on kehittää, toteuttaa ja arvioida laitteisto-ohjelmisto-yhteissimulointiin perustuva esivalidointimenetelmä näiden haasteiden ratkaisemiseksi. Menetelmä mahdollistaa laitteiston ja ohjelmiston varhaisen integroinnin, toimien luonnollisena välietappina perinteisen laitteistomallin varmennuksen ja koko järjestelmän validoinnin välillä. Yhteissimulointi käyttää QEMU suoritinemulaattoria, joka on yhdistetty rekisterinsiirtotason (RTL) laitteistomalliin. Tämä mahdollistaa ohjelmistokomponenttien, kuten laiteajureiden, suorittamisen kohdejärjestelmän käskysarja-arkkitehtuurilla (ISA) yhdessä kellosyklitarkkojen RTL laitteistomallien kanssa. Työ keskittyy kahteen yhteissimulaation pääsovellukseen. Ensinnäkin se mahdollistaa ohjelmiston yksikkötestien suorittamisen laitteistomallien kanssa, varmistaen kommunikaation laiteajurien, matalan tason ohjelmiston ja laitteistokomponenttien välillä. Toiseksi se tarjoaa ympäristön ohjelmiston käyttämiseen toiminnallisessa laitteiston varmennuksessa. Merkittävä etu tästä lähestymistavasta on integraatiovirheiden varhainen havaitseminen. Ohjelmiston yksikkötestejä voidaan suorittaa jo IP-lohkon tasolla oikeilla laitteistomalleilla, mikä on aiemmin ollut mahdollista vain kalliilla järjestelmätason prototyypeillä. Tämä mahdollistaa aikaisemman ohjelmisto- ja laitteistokehitystiimien välisen yhteistyön ja helpottaa siirtymistä perinteisiin järjestelmätason validointimenetelmiin

    Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

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    The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout

    Modeling Power Consumption and Temperature in TLM Models

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    International audienceMany techniques and tools exist to estimate the power consumption and the temperature map of a chip. These tools help the hardware designers develop power efficient chips in the presence of temperature constraints. For this task, the application can be ignored or at least abstracted by some high level scenarios; at this stage, the actual embedded software is generally not available yet. However, after the hardware is defined, the embedded software can still have a significant influence on the power consumption; i.e., two implementations of the same application can consume more or less power. Moreover, the actual software powe

    Systematische Transaction-Level-Kommunikations-Modellierung mit SystemC

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    An emerging approach to embedded system design is to assemble them from a library of hardware and software component models (IP, intellectual property) using a system description language, such as SystemC. SystemC allows describing the communication among IPs in terms of abstract operations (transactions). The promise is that with transaction-level modeling (TLM), future systems-on-chip with one billion transistors and more can be composed out of IPs as simply as playing with LEGO bricks. However, reality is far out. In fact, each IP vendor promotes another proprietary interface standard and the provided design tools lack compatibility, such that heterogeneous IPs cannot be integrated efficiently. A novel generic interconnect fabric for TLM is presented which aims at enabling inter-operation between models of different levels of abstraction (mixed-mode) and models with different interfaces (heterogeneous components), with as little overhead as possible. A generic, protocol independent representation of transactions is developed, among with an abstraction level formalism. This approach is shown to support systematic simulation of state-of-the-art buses and networks-on-chip such as IBM CoreConnect and PCI Express over several levels of TLM abstraction. A layered simulation framework for SystemC, GreenBus, is developed to examine the proposed concepts. The thesis discusses new implementation techniques for communication modeling with SystemC which outperform the existing approaches in terms of flexibility, simulation accuracy, and performance. Based on these techniques, advanced concepts for TLM-based hardware/software co-design and FPGA prototyping are examined. Several experiments and a video processor case study highlight the efficiency of the approach and show its applicability in a TLM design flow.Eingebettete Systeme werden zunehmend auf Basis vorgefertigter Hard- und Softwarebausteine entwickelt, die in Form von Modellen (IP, Intellectual Property) vorliegen. Hierzu werden Systembeschreibungssprachen wie SystemC eingesetzt. SystemC ermöglicht, die Kommunikation zwischen IPs durch abstrakte Operationen, sog. Transaktionen zu beschreiben. Mit dieser Transaction-Level-Modellierung (TLM) sollen auch zukünftige Systeme mit 1 Milliarde Transistoren und mehr effizient entwickelt werden können. Idealerweise sollte das Hantieren mit IPs dabei so einfach sein wie das Spielen mit LEGO-Steinen. In der Realität sind jedoch IPs unterschiedlicher Hersteller nicht ohne weiteres integrierbar, und auch die Entwurfswerkzeuge sind nicht kompatibel. In dieser Doktorarbeit wird ein neuer, generischer Ansatz für die Transaction-Level-Modellierung mit SystemC vorgestellt, der Kommunikation zwischen Modellen auf unterschiedlichen Abstraktionsebenen (Mixed-Mode) und mit unterschiedlichen Schnittstellen (heterogene Komponenten) möglich macht. Der zusätzlich benötigte Simulations- und Code-Aufwand ist minimal. Ein protokollunabhängiges Transaktionsmodell und ein formaler Ansatz zur Beschreibung von Abstraktionsebenen werden vorgestellt, mit denen verschiedenartige Busse und Networks-on-Chip wie IBM CoreConnect und PCI Express auf verschiedenen TLM-Abstraktionsebenen simuliert werden können. Ein modulares Simulationsframework für SystemC wird entwickelt (GreenBus), um die vorgeschlagenen Konzepte zu untersuchen. Anhand von GreenBus werden neue Implementierungstechniken diskutiert, die den existierenden Ansätzen in Flexibilität, Simulationsgenauigkeit und -geschwindigkeit überlegen sind. Die Vor- und Nachteile der entwickelten Techniken werden mit Experimenten belegt, und eine Videoprozessor-Fallstudie demonstriert die Effizienz des Ansatzes in einem TLM-basierten Entwurfsfluss

    Cross-Layer Rapid Prototyping and Synthesis of Application-Specific and Reconfigurable Many-accelerator Platforms

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    Technological advances of recent years laid the foundation consolidation of informatisationof society, impacting on economic, political, cultural and socialdimensions. At the peak of this realization, today, more and more everydaydevices are connected to the web, giving the term ”Internet of Things”. The futureholds the full connection and interaction of IT and communications systemsto the natural world, delimiting the transition to natural cyber systems and offeringmeta-services in the physical world, such as personalized medical care, autonomoustransportation, smart energy cities etc. . Outlining the necessities of this dynamicallyevolving market, computer engineers are required to implement computingplatforms that incorporate both increased systemic complexity and also cover awide range of meta-characteristics, such as the cost and design time, reliabilityand reuse, which are prescribed by a conflicting set of functional, technical andconstruction constraints. This thesis aims to address these design challenges bydeveloping methodologies and hardware/software co-design tools that enable therapid implementation and efficient synthesis of architectural solutions, which specifyoperating meta-features required by the modern market. Specifically, this thesispresents a) methodologies to accelerate the design flow for both reconfigurableand application-specific architectures, b) coarse-grain heterogeneous architecturaltemplates for processing and communication acceleration and c) efficient multiobjectivesynthesis techniques both at high abstraction level of programming andphysical silicon level.Regarding to the acceleration of the design flow, the proposed methodologyemploys virtual platforms in order to hide architectural details and drastically reducesimulation time. An extension of this framework introduces the systemicco-simulation using reconfigurable acceleration platforms as co-emulation intermediateplatforms. Thus, the development cycle of a hardware/software productis accelerated by moving from a vertical serial flow to a circular interactive loop.Moreover the simulation capabilities are enriched with efficient detection and correctiontechniques of design errors, as well as control methods of performancemetrics of the system according to the desired specifications, during all phasesof the system development. In orthogonal correlation with the aforementionedmethodological framework, a new architectural template is proposed, aiming atbridging the gap between design complexity and technological productivity usingspecialized hardware accelerators in heterogeneous systems-on-chip and networkon-chip platforms. It is presented a novel co-design methodology for the hardwareaccelerators and their respective programming software, including the tasks allocationto the available resources of the system/network. The introduced frameworkprovides implementation techniques for the accelerators, using either conventionalprogramming flows with hardware description language or abstract programmingmodel flows, using techniques from high-level synthesis. In any case, it is providedthe option of systemic measures optimization, such as the processing speed,the throughput, the reliability, the power consumption and the design silicon area.Finally, on addressing the increased complexity in design tools of reconfigurablesystems, there are proposed novel multi-objective optimization evolutionary algo-rithms which exploit the modern multicore processors and the coarse-grain natureof multithreaded programming environments (e.g. OpenMP) in order to reduce theplacement time, while by simultaneously grouping the applications based on theirintrinsic characteristics, the effectively explore the design space effectively.The efficiency of the proposed architectural templates, design tools and methodologyflows is evaluated in relation to the existing edge solutions with applicationsfrom typical computing domains, such as digital signal processing, multimedia andarithmetic complexity, as well as from systemic heterogeneous environments, suchas a computer vision system for autonomous robotic space navigation and manyacceleratorsystems for HPC and workstations/datacenters. The results strengthenthe belief of the author, that this thesis provides competitive expertise to addresscomplex modern - and projected future - design challenges.Οι τεχνολογικές εξελίξεις των τελευταίων ετών έθεσαν τα θεμέλια εδραίωσης της πληροφοριοποίησης της κοινωνίας, επιδρώντας σε οικονομικές,πολιτικές, πολιτιστικές και κοινωνικές διαστάσεις. Στο απόγειο αυτής τη ςπραγμάτωσης, σήμερα, ολοένα και περισσότερες καθημερινές συσκευές συνδέονται στο παγκόσμιο ιστό, αποδίδοντας τον όρο «Ίντερνετ των πραγμάτων».Το μέλλον επιφυλάσσει την πλήρη σύνδεση και αλληλεπίδραση των συστημάτων πληροφορικής και επικοινωνιών με τον φυσικό κόσμο, οριοθετώντας τη μετάβαση στα συστήματα φυσικού κυβερνοχώρου και προσφέροντας μεταυπηρεσίες στον φυσικό κόσμο όπως προσωποποιημένη ιατρική περίθαλψη, αυτόνομες μετακινήσεις, έξυπνες ενεργειακά πόλεις κ.α. . Σκιαγραφώντας τις ανάγκες αυτής της δυναμικά εξελισσόμενης αγοράς, οι μηχανικοί υπολογιστών καλούνται να υλοποιήσουν υπολογιστικές πλατφόρμες που αφενός ενσωματώνουν αυξημένη συστημική πολυπλοκότητα και αφετέρου καλύπτουν ένα ευρύ φάσμα μεταχαρακτηριστικών, όπως λ.χ. το κόστος σχεδιασμού, ο χρόνος σχεδιασμού, η αξιοπιστία και η επαναχρησιμοποίηση, τα οποία προδιαγράφονται από ένα αντικρουόμενο σύνολο λειτουργικών, τεχνολογικών και κατασκευαστικών περιορισμών. Η παρούσα διατριβή στοχεύει στην αντιμετώπιση των παραπάνω σχεδιαστικών προκλήσεων, μέσω της ανάπτυξης μεθοδολογιών και εργαλείων συνσχεδίασης υλικού/λογισμικού που επιτρέπουν την ταχεία υλοποίηση καθώς και την αποδοτική σύνθεση αρχιτεκτονικών λύσεων, οι οποίες προδιαγράφουν τα μετα-χαρακτηριστικά λειτουργίας που απαιτεί η σύγχρονη αγορά. Συγκεκριμένα, στα πλαίσια αυτής της διατριβής, παρουσιάζονται α) μεθοδολογίες επιτάχυνσης της ροής σχεδιασμού τόσο για επαναδιαμορφούμενες όσο και για εξειδικευμένες αρχιτεκτονικές, β) ετερογενή αδρομερή αρχιτεκτονικά πρότυπα επιτάχυνσης επεξεργασίας και επικοινωνίας και γ) αποδοτικές τεχνικές πολυκριτηριακής σύνθεσης τόσο σε υψηλό αφαιρετικό επίπεδο προγραμματισμού,όσο και σε φυσικό επίπεδο πυριτίου.Αναφορικά προς την επιτάχυνση της ροής σχεδιασμού, προτείνεται μια μεθοδολογία που χρησιμοποιεί εικονικές πλατφόρμες, οι οποίες αφαιρώντας τις αρχιτεκτονικές λεπτομέρειες καταφέρνουν να μειώσουν σημαντικά το χρόνο εξομοίωσης. Παράλληλα, εισηγείται η συστημική συν-εξομοίωση με τη χρήση επαναδιαμορφούμενων πλατφορμών, ως μέσων επιτάχυνσης. Με αυτόν τον τρόπο, ο κύκλος ανάπτυξης ενός προϊόντος υλικού, μετατεθειμένος από την κάθετη σειριακή ροή σε έναν κυκλικό αλληλεπιδραστικό βρόγχο, καθίσταται ταχύτερος, ενώ οι δυνατότητες προσομοίωσης εμπλουτίζονται με αποδοτικότερες μεθόδους εντοπισμού και διόρθωσης σχεδιαστικών σφαλμάτων, καθώς και μεθόδους ελέγχου των μετρικών απόδοσης του συστήματος σε σχέση με τις επιθυμητές προδιαγραφές, σε όλες τις φάσεις ανάπτυξης του συστήματος. Σε ορθογώνια συνάφεια με το προαναφερθέν μεθοδολογικό πλαίσιο, προτείνονται νέα αρχιτεκτονικά πρότυπα που στοχεύουν στη γεφύρωση του χάσματος μεταξύ της σχεδιαστικής πολυπλοκότητας και της τεχνολογικής παραγωγικότητας, με τη χρήση συστημάτων εξειδικευμένων επιταχυντών υλικού σε ετερογενή συστήματα-σε-ψηφίδα καθώς και δίκτυα-σε-ψηφίδα. Παρουσιάζεται κατάλληλη μεθοδολογία συν-σχεδίασης των επιταχυντών υλικού και του λογισμικού προκειμένου να αποφασισθεί η κατανομή των εργασιών στους διαθέσιμους πόρους του συστήματος/δικτύου. Το μεθοδολογικό πλαίσιο προβλέπει την υλοποίηση των επιταχυντών είτε με συμβατικές μεθόδους προγραμματισμού σε γλώσσα περιγραφής υλικού είτε με αφαιρετικό προγραμματιστικό μοντέλο με τη χρήση τεχνικών υψηλού επιπέδου σύνθεσης. Σε κάθε περίπτωση, δίδεται η δυνατότητα στο σχεδιαστή για βελτιστοποίηση συστημικών μετρικών, όπως η ταχύτητα επεξεργασίας, η ρυθμαπόδοση, η αξιοπιστία, η κατανάλωση ενέργειας και η επιφάνεια πυριτίου του σχεδιασμού. Τέλος, προκειμένου να αντιμετωπισθεί η αυξημένη πολυπλοκότητα στα σχεδιαστικά εργαλεία επαναδιαμορφούμενων συστημάτων, προτείνονται νέοι εξελικτικοί αλγόριθμοι πολυκριτηριακής βελτιστοποίησης, οι οποίοι εκμεταλλευόμενοι τους σύγχρονους πολυπύρηνους επεξεργαστές και την αδρομερή φύση των πολυνηματικών περιβαλλόντων προγραμματισμού (π.χ. OpenMP), μειώνουν το χρόνο επίλυσης του προβλήματος της τοποθέτησης των λογικών πόρων σε φυσικούς,ενώ ταυτόχρονα, ομαδοποιώντας τις εφαρμογές βάση των εγγενών χαρακτηριστικών τους, διερευνούν αποτελεσματικότερα το χώρο σχεδίασης.Η αποδοτικότητά των προτεινόμενων αρχιτεκτονικών προτύπων και μεθοδολογιών επαληθεύτηκε σε σχέση με τις υφιστάμενες λύσεις αιχμής τόσο σε αυτοτελής εφαρμογές, όπως η ψηφιακή επεξεργασία σήματος, τα πολυμέσα και τα προβλήματα αριθμητικής πολυπλοκότητας, καθώς και σε συστημικά ετερογενή περιβάλλοντα, όπως ένα σύστημα όρασης υπολογιστών για αυτόνομα διαστημικά ρομποτικά οχήματα και ένα σύστημα πολλαπλών επιταχυντών υλικού για σταθμούς εργασίας και κέντρα δεδομένων, στοχεύοντας εφαρμογές υψηλής υπολογιστικής απόδοσης (HPC). Τα αποτελέσματα ενισχύουν την πεποίθηση του γράφοντα, ότι η παρούσα διατριβή παρέχει ανταγωνιστική τεχνογνωσία για την αντιμετώπιση των πολύπλοκων σύγχρονων και προβλεπόμενα μελλοντικών σχεδιαστικών προκλήσεων

    SoCRocket - A flexible and extensible Virtual Platform for the development of robust Embedded Systems

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    Der Schwerpunkt dieser Arbeit liegt in der Erhöhung des Abstraktionsniveaus im Entwurfsprozess, speziell dem Entwurf von Systemen auf Basis von Virtuellen Plattformen (VPs), Transaction-Level-Modellierung (TLM) und SystemC. Es wird eine ganzheitliche Methode vorgestellt, mit der komplexe eingebettete Systeme effizient modelliert werden können. Ergebnis ist eine der RTL-Synthese nahezu gleichgestellte Genauigkeit bei wesentlich höherer Flexibilität und Simulationsgeschwindigkeit. Das SoCRocket-System orientiert sich dazu an existierenden Standards und stellt Methoden zu deren effizientem Einsatz zur Verbesserung von Simulationsgeschwindigkeit und Simulationsgenauigkeit vor. So wird unter anderem gezeigt, wie moderne Multi-Kanal-Protokolle mit Split-Transfers durch Ausgleich des Intertransaktions-Timings ohne die Einführung zusätzlicher Protokollphasen zeitlich genau modelliert werden können. Standardisierungslücken in den Bereichen Speichermodellierung und Systemkonfiguration werden durch standardoffene Lösungen geschlossen. Darüber hinaus wird neue Infrastruktur zur Modellierung von Signalkommunikation auf Transaktionsebene, der Verifikation von Komponenten und der Modellierung des Energieverbrauchs vorgestellt. Zur Demonstration wurden die Kernkomponenten einer im europäischen Raumfahrtsektor maßgeblichen Hardwarebibliothek modelliert. Alle Komponenten wurden zunächst in Unit-Tests verifiziert und anschließend in einem Systemprototypen integriert. Zur Verifikation der Funktion, sowie Bestimmung von Simulationsgeschwindigkeit und zeitlicher Genauigkeit, wurde dieser für unterschiedliche Abstraktionsstufen konfiguriert und mit einem in VHDL beschriebenen RISC-Referenzentwurf (LEON3MP) verglichen. Das System mit losem Timing (LT) und blockierender Kommunikation ist im Durchschnitt 561-mal schneller als die RTL-Referenz und weist eine durchschnittliche Timing-Abweichung von 7,04% auf. Das System mit näherungsweise akkuratem Timing (AT) und nicht-blockierender Kommunikation ist 335-mal schneller. Die durchschnittliche Timing-Abweichung beträgt hier nur noch 3,03%, was einer Standardabweichung von 0.033 und damit einer sehr hohen statistischen Sicherheit entspricht. Die verschiedenen Abstraktionsniveaus können zur Realisierung mehrstufiger Architekturexplorationen eingesetzt werden. Dies wird am Beispiel einer hyperspektralen Bildkompression verdeutlicht.The focus of this work is raising the abstraction level in the development process, especially for the design of systems based on Virtual Platforms (VPs), Transaction Level Modeling (TLM), and SystemC. A holistic method for efficient modeling of complex embedded systems is presented. Results are accuracies close to RTL synthesis but at much higher flexibility, and simulation performance. The SoCRocket system integrates existing standards and introduces new methods for improvement of simulation performance and accuracy. It is shown, amongst others, how modern multi-channel protocols with split transfers can be accurately modeled by compensating inter-transaction timing without introducing additional protocol phases. Standardization gaps in the area of memory modeling and system configuration are closed by standard-open solutions. Furthermore, new infrastructure for modeling signal communication on transaction level, verification of components, and estimating power consumption are presented. All components have been verified in unit tests and were subsequently integrated in a system prototype. For functional verification, as well as measurement of simulation performance and accuracy, the prototype was configured for different abstractions and compared to a VHDL-based RISC reference design (LEON3MP). The loosely-timed platform prototype with blocking communication (LT) is in average 561 times faster than the RTL reference and shows an average timing deviation of 7,04%. The approximately-timed system (AT) with non-blocking communication is 335 times faster. Here, the timing deviation is only 3,03 %, corresponding to a standard deviation of 0.033, proving a very high statistic certainty. The system’s various abstraction levels can be exploited by a multi-stage architecture exploration. This is demonstrated by the example of a hyperspectral image compression

    Comparison of multi-layer bus interconnection and a network on chip solution

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    Abstract. This thesis explains the basic subjects that are required to take in consideration when designing a network on chip solutions in the semiconductor world. For example, general topologies such as mesh, torus, octagon and fat tree are explained. In addition, discussion related to network interfaces, switches, arbitration, flow control, routing, error avoidance and error handling are provided. Furthermore, there is discussion related to design flow, a computer aided designing tools and a few comprehensive researches. However, several networks are designed for the minimum latency, although there are also versions which trade performance for decreased bus widths. These designed networks are compared with a corresponding multi-layer bus interconnection and both synthesis and register transfer level simulations are run. For example, results from throughput, latency, logic area and power consumptions are gathered and compared. It was discovered that overall throughput was well balanced with the network on chip solutions, although its maximum throughput was limited by protocol conversions. For example, the multi-layer bus interconnection was capable of providing a few times smaller latencies and higher throughputs when only a single interface was injected at the time. However, with parallel traffic and high-performance requirements a network on chip solution provided better results, even though the difference decreased when performance requirements were lower. Furthermore, it was discovered that the network on chip solutions required approximately 3–4 times higher total cell area than the multi-layer bus interconnection and that resources were mainly located at network interfaces and switches. In addition, power consumption was approximately 2–3 times higher and was mostly caused by dynamic consumption.Monitasoisen väyläarkkitehtuurin ja tietokoneverkkomaisen ratkaisun vertailua. Tiivistelmä. Tutkielmassa käsitellään tärkeimpiä aihealueita, jotka tulee huomioida suunniteltaessa tietokoneverkkomaisia väyläratkaisuja puolijohdemaailmassa. Esimerkiksi yleiset rakenteet, kuten verkko-, torus-, kahdeksankulmio- ja puutopologiat käsitellään lyhyesti. Lisäksi alustetaan verkon liitäntäkohdat, kytkimet, vuorottelu, vuon hallinta, reititys, virheiden välttely ja -käsittely. Lopuksi kerrotaan suunnitteluvuon oleellisimmat välivaiheet ja niihin soveltuvia kaupallisia työkaluja, sekä käsitellään lyhyesti muutaman aiemman julkaisun tuloksia. Tutkielmassa käytetään suunnittelutyökalua muutaman tietokoneverkkomaisen ratkaisun toteutukseen ja tavoitteena on saavuttaa pienin mahdollinen latenssi. Toisaalta myös hieman suuremman latenssin versioita suunnitellaan, mutta pienemmillä väylänleveyksillä. Lisäksi suunniteltuja tietokoneverkkomaisia ratkaisuja vertaillaan perinteisempään monitasoiseen väyläarkkitehtuuriin. Esimerkiksi synteesi- ja simulaatiotuloksia, kuten logiikan vaatimaa pinta-alaa, tehonkulutusta, latenssia ja suorituskykyä, vertaillaan keskenään. Tutkielmassa selvisi, että suunnittelutyökalulla toteutetut tietokoneverkkomaiset ratkaisut mahdollistivat tasaisemman suorituskyvyn, joskin niiden suurin saavutettu suorituskyky ja pienin latenssi määräytyivät protokollan käännöksen aiheuttamasta viiveestä. Tutkielmassa havaittiin, että perinteisemmillä menetelmillä saavutettiin noin kaksi kertaa suurempi suorituskyky ja pienempi latenssi, kun verkossa ei ollut muuta liikennettä. Rinnakkaisen liikenteen lisääntyessä tietokoneverkkomainen ratkaisu tarjosi keskimäärin paremman suorituskyvyn, kun sille asetetut tehokkuusvaateet olivat suuret, mutta suorituskykyvaatimuksien laskiessa erot kapenivat. Lisäksi huomattiin, että tietokoneverkkomaisten ratkaisujen käyttämä pinta-ala oli noin 3–4 kertaa suurempi kuin monitasoisella väyläarkkitehtuurilla ja että resurssit sijaitsivat enimmäkseen verkon liittymäkohdissa ja kytkimissä. Lisäksi tehonkulutuksen huomattiin olevan noin 2–3 kertaa suurempi, joskin sen havaittiin koostuvan pääosin dynaamisesta kulutuksesta

    Communication centric platforms for future high data intensive applications

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    The notion of platform based design is considered as a viable solution to boost the design productivity by favouring reuse design methodology. With the scaling down of device feature size and scaling up of design complexity, throughput limitations, signal integrity and signal latency are becoming a bottleneck in future communication centric System-on-Chip (SoC) design. This has given birth to communication centric platform based designs. Development of heterogeneous multi-core architectures has caused the on-chip communication medium tailored for a specific application domain to deal with multidomain traffic patterns. This makes the current application specific communication centric platforms unsuitable for future SoC architectures. The work presented in this thesis, endeavours to explore the current communication media to establish the expectations from future on-chip interconnects. A novel communication centric platform based design flow is proposed, which consists of four communication centric platforms that are based on shared global bus, hierarchical bus, crossbars and a novel hybrid communication medium. Developed with a smart platform controller, the platforms support Open Core Protocol (OCP) socket standard, allowing cores to integrate in a plug and play fashion without the need to reprogram the pre-verified platforms. This drastically reduces the design time of SoC architectures. Each communication centric platform has different throughput, area and power characteristics, thus, depending on the design constraints, processing cores can be integrated to the most appropriate communication platform to realise the desired SoC architecture. A novel hybrid communication medium is also developed in this thesis, which combines the advantages of two different types of communication media in a single SoC architecture. The hybrid communication medium consists of crossbar matrix and shared bus medium . Simulation results and implementation of WiMAX receiver as a real-life example shows a 65% increase in data throughput than shared bus based communication medium, 13% decrease in area and 11% decrease in power than crossbar based communication medium. In order to automate the generation of SoC architectures with optimised communication architectures, a tool called SOCCAD (SoC Communication architecture development) is developed. Components needed for the realisation of the given application can be selected from the tool’s in-built library. Offering an optimised communication centric placement, the tool generates the complete SystemC code for the system with different interconnect architectures, along with its power and area characteristics. The generated SystemC code can be used for quick simulation and coupled with efficient test benches can be used for quick verification. Network-on-Chip (NoC) is considered as a solution to the communication bottleneck in future SoC architectures with data throughput requirements of over 10GB/s. It aims to provide low power, efficient link utilisation, reduced data contention and reduced area on silicon. Current on-chip networks, developed with fixed architectural parameters, do not utilise the available resources efficiently. To increase this efficiency, a novel dynamically reconfigurable NoC (drNoC) is developed in this thesis. The proposed drNoC reconfigures itself in terms of switching, routing and packet size with the changing communication requirements of the system at run time, thus utilising the maximum available channel bandwidth. In order to increase the applicability of drNoC, the network interface is designed to support OCP socket standard. This makes drNoC a highly reuseable communication framework, qualifying it as a communication centric platform for high data intensive SoC architectures. Simulation results show a 32% increase in data throughput and 22-35% decrease in network delay when compared with a traditional NoC with fixed parameters
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