4H-SiC Integrated circuits for high temperature and harsh environment applications

Silicon Carbide (SiC) has received a special attention in the last decades thanks to its superior electrical, mechanical and chemical proprieties. SiC is mostly used for applications where Silicon is limited, becoming a proper material for both unipolar and bipolar power device able to work under high power, high frequency and high temperature conditions. Aside from the outstanding theoretical and practical advantages still to be proved in SiC devices, the need for more accurate models for the design and optimization of these devices, along with the development of integrated circuits (ICs) on SiC is indispensable for the further success of modern power electronics. The design and development of SiC ICs has become a necessity since the high temperature operation of ICs is expected to enable important improvements in aerospace, automotive, energy production and other industrial systems. Due to the last impressive progresses in the manufacturing of high quality SiC substrates, the possibility of developing ICs applications is now feasible. SiC unipolar transistors, such as JFETs and MESFETs show a promising potential for digital ICs operating at high temperature and in harsh environments. The reported ICs on SiC have been realized so far with either a small number of elements, or with a low integration density. Therefore, this work demonstrates that by means of our SiC MESFET technology, multi-stage digital ICs fabrication containing a large number of 4H-SiC devices is feasible, accomplishing some of the most important ICs requirements. The ultimate objective is the development of SiC digital building blocks by transferring the Si CMOS topologies, hence demonstrating that the ICs SiC technology can be an important competitor of the Si ICs technology especially in application fields in which high temperature, high switching speed and harsh environment operations are required. The study starts with the current normally-on SiC MESFET CNM complete analysis of an already fabricated MESFET. It continues with the modeling and fabrication of a new planar-MESFET structure together with new epitaxial resistors specially suited for high temperature and high integration density. A novel device isolation technique never used on SiC before is approached. A fabrication process flow with three metal levels fully compatible with the CMOS technology is defined. An exhaustive experimental characterization at room and high temperature (300ºC) and Spice parameter extractions for both structures are performed. In order to design digital ICs on SiC with the previously developed devices, the current available topologies for normally-on transistors are discussed. The circuits design using Spice modeling, the process technology, the fabrication and the testing of the 4H-SiC MESFET elementary logic gates library at high temperature and high frequencies are performed. The MESFET logic gates behavior up to 300ºC is analyzed. Finally, this library has allowed us implementing complex multi-stage logic circuits with three metal levels and a process flow fully compatible with a CMOS technology. This study demonstrates that the development of important SiC digital blocks by transferring CMOS topologies (such as Master Slave Data Flip-Flop and Data-Reset Flip-Flop) is successfully achieved. Hence, demonstrating that our 4H-SiC MESFET technology enables the fabrication of mixed signal ICs capable to operate at high temperature (300ºC) and high frequencies (300kHz). We consider this study an important step ahead regarding the future ICs developments on SiC. Finally, experimental irradiations were performed on W-Schotthy diodes and mesa-MESFET devices (with the same Schottky gate than the planar SiC MESFET) in order to study their radiation hardness stability. The good radiation endurance of SiC Schottky-gate devices is proven. It is expected that the new developed devices with the same W-Schottky gate, to have a similar behavior in radiation rich environments.Postprint (published version

Two- and Three-dimensional High Performance, Patterned Overlay Multi-chip Module Technology

A two- and three-dimensional multi-chip module technology was developed in response to the continuum in demand for increased performance in electronic systems, as well as the desire to reduce the size, weight, and power of space systems. Though developed to satisfy the needs of military programs, such as the Strategic Defense Initiative Organization, the technology, referred to as High Density Interconnect, can also be advantageously exploited for a wide variety of commercial applications, ranging from computer workstations to instrumentation and microwave telecommunications. The robustness of the technology, as well as its high performance, make this generality in application possible. More encouraging is the possibility of this technology for achieving low cost through high volume usage

On-Line Dependability Enhancement of Multiprocessor SoCs by Resource Management

This paper describes a new approach towards dependable design of homogeneous multi-processor SoCs in an example satellite-navigation application. First, the NoC dependability is functionally verified via embedded software. Then the Xentium processor tiles are periodically verified via on-line self-testing techniques, by using a new IIP Dependability Manager. Based on the Dependability Manager results, faulty tiles are electronically excluded and replaced by fault-free spare tiles via on-line resource management. This integrated approach enables fast electronic fault detection/diagnosis and repair, and hence a high system availability. The dependability application runs in parallel with the actual application, resulting in a very dependable system. All parts have been verified by simulation

Random Modulo: A new processor cache design for real-time critical systems

Cache memories have a huge impact on software's worst-case execution time (WCET). While enabling the seamless use of caches is key to provide the increasing levels of (guaranteed) performance required by automotive software, caches complicate timing analysis. In the context of Measurement-Based Probabilistic Timing Analysis (MBPTA) - a promising technique to ease timing analyis of complex hardware - we propose Random Modulo (RM), a new cache design that provides the probabilistic behavior required by MBPTA and with the following advantages over existing MBPTA-compliant cache designs: (i) an outstanding reduction in WCET estimates, (ii) lower latency and area overhead, and (iii) competitive average performance w.r.t conventional caches.Peer ReviewedPostprint (author's final draft

Validating foundry technologies for extended mission profiles

This paper presents a process qualification and characterization strategy that can extend the foundry process reliability potential to meet specific automotive mission profile requirements. In this case study, data and analyses are provided that lead to sufficient confidence for pushing the allowed mission profile envelope of a process towards more aggressive (automotive) applications.\ud \u

Mixed signal approach for rapid prototyping of a compact smart pebble for sediment transport monitoring in river beds

Low-cost accelerometers and gyro ICs were used to develop a smart sediment particle to study the sediment transport in rivers. With strap-down MEMS, battery, a processing subsystem and memory, this self contained unit captures semiprocessed data for durations up to 15 minutes. In a mixed-mode design, analog multiplier ICs with limited digital circuits transform the body frame data to a reference frame using Euler angles, with adequate accuracy despite cumulative errors. For 3D motion, up to nine sensor inputs from three orthogonal modules are coupled to a multiplexed analog processing module, and processed by a digital module for data conversion and storage. Despite the simplified mathematics used, experimental data from the proof-of-concept system provided adequate accuracy. Subsequent processing of the raw sensor data using an external PC program with smart algorithms allowed the comparison of accuracy of the mixed mode approach. The adopted mixed signal design approach helps the packaging requirements due to the specific nature of the problem with short recording durations

Developing a distributed electronic health-record store for India

The DIGHT project is addressing the problem of building a scalable and highly available information store for the Electronic Health Records (EHRs) of the over one billion citizens of India

Analog and mixed-signal design and test techniques for improved reliability

The relentless evolution of semiconductor technology has led to a pervasive reliance on integrated circuits (ICs) across an array of applications, from consumer electronics to safety-critical systems in automotive and medical devices. Ensuring the reliability and robustness of these ICs has become paramount. This dissertation addresses the growing need for defect-oriented testing in analog and mixed-signal (AMS) circuits, introducing a novel digital-like methodology. It emphasizes breaking down complex AMS circuits into smaller, manageable subcircuits, which are rigorously examined using purely digital monitors and injectors. The methodology is resource-efficient, optimizing existing circuit resources to minimize area overhead and power consumption. A significant achievement lies in the development of a Built-In Self-Test (BIST) for a 12-bit Successive Approximation Register (SAR) Analog-to-Digital Converter (ADC), showcasing the approach's effectiveness and flexibility. Additionally, this dissertation pioneers a smart sensor design approach that reduces dependence on intricate device models, thereby ensuring high performance across a broad range of operating conditions. A case study on a temperature-to-digital converter (TDC) design demonstrates its capability to function reliably over an extensive temperature range. The methodology optimizes parameters, allowing energy-efficient sensor designs that meet industry standards while minimizing silicon area and power consumption. These works signify a dedicated commitment to advancing the reliability and functional safety of analog and mixed-signal circuits, contributing to the evolving landscape of IC design

Small Satellite Industrial Base Study: Foundational Findings

This report documents findings from a Small Satellite (SmallSat) Industrial Base Study conducted by The Aerospace Corporation between November 2018 and September 2019. The primary objectives of this study were a) to gain a better understanding of the SmallSat communitys technical practices, engineering approaches, requirements flow-downs, and common processes and b) identify insights and recommendations for how the government can further capitalize on the strengths and capabilities of SmallSat offerings. In the context of this study, SmallSats are understood to weigh no more than 500 kg, as described in State of the Art Small Spacecraft Technology, NASA/TP-2018- 220027, December 2018. CubeSats were excluded from this study to avoid overlap and duplication of recently completed work or other studies already under way. The team also touched on differences between traditional space-grade and the emerging mid-grade and other non-space, alternate-grade EEEE (electrical, electronic, electromechanical, electro-optical) piece part categories. Finally, the participants sought to understand the potential effects of increased use of alternate-grade parts on the traditional space-grade industrial base. The study team was keenly aware that there are missions for which non-space grade parts currently are infeasible for the foreseeable future. National security, long-duration and high-reliability missions intolerant of risk are a few examples. The team sought to identify benefits of alternative parts and approaches that can be harnessed by the government to achieve greater efficiencies and capabilities without impacting mission success