MICRO-ELECTRO-MECHANICAL SYSTEM OSCILLATING ACCELERAMETERS WITH CMOS READOUT CIRCUITS

Ph.DDOCTOR OF PHILOSOPH

Integrated reference circuits for low-power capacitive sensor interfaces

This thesis consists of nine publications and an overview of the research topic, which also summarizes the work. The research described in this thesis concentrates on the design of low-power sensor interfaces for capacitive 3-axis micro-accelerometers. The primary goal throughout the thesis is to optimize power dissipation. Because the author made the main contribution to the design of the reference and power management circuits required, the overview part is dominated by the following research topics: current, voltage, and temperature references, frequency references, and voltage regulators. After an introduction to capacitive micro-accelerometers, the work describes the typical integrated readout electronics of a capacitive sensor on the functional level. The readout electronics can be divided into four different functional parts, namely the sensor readout itself, signal post-processing, references, and power management. Before the focus is shifted to the references and further to power management, different ways to realize the sensor readout are briefly discussed. Both current and voltage references are required in most analog and mixed-signal systems. A bandgap voltage reference, which inherently uses at least one current reference, is practical for the generation of an accurate reference voltage. Very similar circuit techniques can be exploited when implementing a temperature reference, the need for which in the sensor readout may be justified by the temperature compensation, for example. The work introduces non-linear frequency references, namely ring and relaxation oscillators, which are very suitable for the generation of the relatively low-frequency clock signals typically needed in the sensor interfaces. Such oscillators suffer from poor jitter and phase noise performance, the quantities of which also deserve discussion in this thesis. Finally, the regulation of the supply voltage using linear regulators is considered. In addition to extending the battery life by providing a low quiescent current, the regulator must be able to supply very low load currents and operate without off-chip capacitors

High performance readout circuits and devices for Lorentz force resonant CMOS-MEMS magnetic sensors

In the last decades, sensing capabilities of martphones have greatly improved since the early mobile phones of the 90’s. Moreover, wearables and the automotive industry require increasing electronics and sensing sophistication. In such echnological advance, Micro Electro Mechanical Systems (MEMS) have played an important role as accelerometers and gyroscopes were the first sensors based on MEMS technology massively introduced in the market. In contrast, it still does not exist a commercial MEMS-based compass, even though Lorentz force MEMS magnetometers were first proposed in the late 90’s. Currently, Lorentz force MEMS magnetometers have been under the spotlight as they can offer an integrated solution to nowadays sensing power. As a consequence, great advances have been achieved, but various bottlenecks limit the introduction of Lorentz force MEMS compasses in the market. First, current MEMS magnetometers require high current consumption and high biasing voltages to achieve good sensitivities. Moreover, even though devices with excellent performance and sophistication are found in the literature, there is still a lack of research on the readout electronic circuits, specially in the digital signal processing, and closed loop control. Second, most research outcomes rely on custom MEMS fabrication rocesses to manufacture the devices. This is the same approach followed in current commercial MEMS, but it requires different fabrication processes for the electronics and the MEMS. As a consequence, manufacturing cost is high and sensor performance is affected by the MEMS-electronics interface parasitics. This dissertation presents potential solutions to these issues in order to pave the road to the commercialization of Lorentz force MEMS compasses. First, a complete closed loop, digitally controlled readout system is proposed. The readout circuitry, implemented with off-the-shelf commercial components, and the digital control, on an FPGA, are proposed as a proof of concept of the feasibility, and potential benefits, of such architecture. The proposed system has a measured noise of 550 nT / vHz while the MEMS is biased with 300 µA rms and V = 1 V . Second, various CMOS-MEMS magnetometers have been designed using the BEOL part of the TSMC and SMIC 180 nm standard CMOS processes, and wet and vapor etched. The devices measurement and characterisation is used to analyse the benefits and drawbacks of each design as well as releasing process. Doing so, a high volume manufacturing viability can be performed. Yield values as high as 86% have been obtained for one device manufactured in a SMIC 180 nm full wafer run, having a sensitivity of 2.82 fA/µT · mA and quality factor Q = 7.29 at ambient pressure. While a device manufactured in TSMC 180 nm has Q = 634.5 and a sensitivity of 20.26 fA/µT ·mA at 1 mbar and V = 1 V. Finally, an integrated circuit has been designed that contains all the critical blocks to perform the MEMS signal readout. The MEMS and the electronics have been manufactured using the same die area and standard TSMC 180 nm process in order to reduce parasitics and improve noise and current consumption. Simulations show that a resolution of 8.23 µT /mA for V = 1 V and BW = 10 Hz can be achieved with the designed device.En les últimes dècades, tenint en compte els primers telèfons mòbils dels anys 90, les capacitats de sensat dels telèfons intel·ligents han millorat notablement. A més, la indústria automobilística i de wearables necessiten cada cop més sofisticació en el sensat. Els Micro Electro Mechanical Systems (MEMS) han tingut un paper molt important en aquest avenç tecnològic, ja que acceleròmetres i giroscopis varen ser els primers sensors basats en la tecnologia MEMS en ser introduïts massivament al mercat. En canvi, encara no existeix en la indústria una brúixola electrònica basada en la tecnologia MEMS, tot i que els magnetòmetres MEMS varen ser proposats per primera vegada a finals dels anys 90. Actualment, els magnetòmetres MEMS basats en la força de Lorentz són el centre d'atenció donat que poden oferir una solució integrada a les capacitats de sensat actuals. Com a conseqüència, s'han aconseguit grans avenços encara que existeixen diversos colls d'ampolla que encara limiten la introducció al mercat de brúixoles electròniques MEMS basades en la força de Lorentz. Per una banda, els agnetòmetres MEMS actuals necessiten un consum de corrent i un voltatge de polarització elevats per aconseguir una bona sensibilitat. A més, tot i que a la literatura hi podem trobar dispositius amb rendiments i sofisticació excel·lents, encara existeix una manca de recerca en el circuit de condicionament, especialment de processat digital i control del llaç. Per altra banda, moltes publicacions depenen de processos de fabricació de MEMS fets a mida per fabricar els dispositius. Aquesta és la mateixa aproximació que s'utilitza actualment en la indústria dels MEMS, però té l'inconvenient que requereix processos de fabricació diferents pels MEMS i l’electrònica. Per tant, el cost de fabricació és alt i el rendiment del sensor queda afectat pels paràsits en la interfície entre els MEMS i l'electrònica. Aquesta tesi presenta solucions potencials a aquests problemes amb l'objectiu d'aplanar el camí a la comercialització de brúixoles electròniques MEMS basades en la força de Lorentz. En primer lloc, es proposa un circuit de condicionament complet en llaç tancat controlat digitalment. Aquest s'ha implementat amb components comercials, mentre que el control digital del llaç s'ha implementat en una FPGA, tot com una prova de concepte de la viabilitat i beneficis potencials que representa l'arquitectura proposada. El sistema presenta un soroll de 550 nT / vHz quan el MEMS està polaritzat amb 300 µArms i V = 1 V . En segon lloc, s'han dissenyat varis magnetòmetres CMOS-MEMS utilitzant la part BEOL dels processos CMOS estàndard de TSMC i SMIC 180 nm, que després s'han alliberat amb líquid i gas. La mesura i caracterització dels dispositius s’ha utilitzat per analitzar els beneficis i inconvenients de cada disseny i procés d’alliberament. D'aquesta manera, s'ha pogut realitzar un anàlisi de la viabilitat de la seva fabricació en massa. S'han obtingut valors de yield de fins al 86% per un dispositiu fabricat amb SMIC 180 nm en una oblia completa, amb una sensibilitat de 2.82 fA/µT · mA i un factor de qualitat Q = 7.29 a pressió ambient. Per altra banda, el dispositiu fabricat amb TSMC 180 nm presenta una Q = 634.5 i una sensibilitat de 20.26 fA/µT · mA a 1 mbar amb V = 1 V. Finalment, s'ha dissenyat un circuit integrat que conté tots els blocs per a realitzar el condicionament de senyal del MEMS. El MEMS i l'electrònica s'han fabricat en el mateix dau amb el procés estàndard de TSMC 180 nm per tal de reduir paràsits i millorar el soroll i el consum de corrent. Les simulacions mostren una resolució de 8.23 µT /mA amb V = 1 V i BW = 10 Hz pel dispositiu dissenyat

A 3-D micromechanical multi-loop magnetometer driven off-resonance by an on-chip resonator

This paper presents the principle and complete characterization of a single-chip unit formed by microelectromechanical system magnetometers to sense the 3-D magnetic field vector and a Tang resonator. The three sensors, nominally with the same resonance frequency, are operated 200-Hz off-resonance through an ac current whose reference frequency is provided by the resonator embedded in an oscillating circuit. The sensors gain is increased by adopting a current recirculation strategy using metal strips directly deposited on the structural polysilicon. At a driving value of 100 μArms flowing in series through the three devices, the magnetometers show a sub-185 nT/Hz Hz resolution with a selectable bandwidth up to 50 Hz. Over a ±5-mT full-scale range, the sensitivity curves show linearity errors lower than 0.2%, with high cross-axis rejection and immunity to external accelerations. Under temperature changes, the stability of the 200-Hz difference between the magnetometers and the resonator frequency is within 55 ppm/K. Offset is trimmed down to the microtesla range, with an overall measured Allan stability of about 100 nT at 20-s observation time. [2016-0030

Solid State Circuits Technologies

The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book

Design, fabrication, characterization and reliability study of CMOS-MEMS Lorentz-Force magnetometers

Tesi en modalitat de compendi de publicacionsToday, the most common form of mass-production semiconductor device fabrication is Complementary Metal-Oxide Semiconductor (CMOS) technology. The dedicated Integrated Circuit (IC) interfaces of commercial sensors are manufactured using this technology. The sensing elements are generally implemented using Micro-Electro-Mechanical-Systems (MEMS), which need to be manufactured using specialized micro-machining processes. Finally, the CMOS circuitry and the MEMS should ideally be combined in a single package. For some applications, integration of CMOS electronics and MEMS devices on a single chip (CMOS-MEMS) has the potential of reducing fabrication costs, size, parasitics and power consumption, compared to other integration approaches. Remarkably, a CMOS-MEMS device may be built with the back-end-of-line (BEOL) layers of the CMOS process. But, despite its advantages, this particular approach has proven to be very challenging given the current lack of commercial products in the market. The main objective of this Thesis is to prove that a high-performance MEMS, sealed and packaged in a standard package, may be accurately modeled and manufactured using the BEOL layers of a CMOS process in a reliable way. To attain this, the first highly reliable novel CMOS-MEMS Lorentz Force Magnetometer (LFM) was successfully designed, modeled, manufactured, characterized and subjected to several reliability tests, obtaining a comparable or superior performance to the typical solid-state magnetometers used in current smartphones. A novel technique to avoid magnetic offsets, the main drawback of LFMs, was presented and its performance confirmed experimentally. Initially, the issues encountered in the manufacturing process of MEMS using the BEOL layers of the CMOS process were discouraging. Vapor HF release of MEMS structures using the BEOL of CMOS wafers resulted in undesirable damaging effects that may lead to the conclusion that this manufacturing approach is not feasible. However, design techniques and workarounds for dealing with the observed issues were devised, tested and implemented in the design of the LFM presented in this Thesis, showing a clear path to successfully fabricate different MEMS devices using the BEOL.Hoy en día, la forma más común de producción en masa es una tecnología llamada Complementary Metal-Oxide Semiconductor (CMOS). La interfaz de los circuitos integrados (IC) de sensores comerciales se fabrica usando, precisamente, esta tecnología. Actualmente es común que los sensores se implementen usando Sistemas Micro-Electro-Mecánicos (MEMS), que necesitan ser fabricados usando procesos especiales de micro-mecanizado. En un último paso, la circuitería CMOS y el MEMS se combinan en un único elemento, llamado package. En algunas aplicaciones, la integración de la electrónica CMOS y los dispositivos MEMS en un único chip (CMOS-MEMS) alberga el potencial de reducir los costes de fabricación, el tamaño, los parásitos y el consumo, al compararla con otras formas de integración. Resulta notable que un dispositivo CMOS-MEMS pueda ser construido con las capas del back-end-of-line (BEOL) de un proceso CMOS. Pero, a pesar de sus ventajas, este enfoque ha demostrado ser un gran desafío como demuestra la falta de productos comerciales en el mercado. El objetivo principal de esta Tesis es probar que un MEMS de altas prestaciones, sellado y empaquetado en un encapsulado estándar, puede ser correctamente modelado y fabricado de una manera fiable usando las capas del BEOL de un proceso CMOS. Para probar esto mismo, el primer magnetómetro CMOS-MEMS de fuerza de Lorentz (LFM) fue exitosamente diseñado, modelado, fabricado, caracterizado y sometido a varias pruebas de fiabilidad, obteniendo un rendimiento comparable o superior al de los típicos magnetómetros de estado sólido, los cuales son usados en móviles actuales. Cabe destacar que en esta Tesis se presenta una novedosa técnica con la que se evitan offsets magnéticos, el mayor inconveniente de los magnetómetros de fuerza Lorentz. Su efectividad fue confirmada experimentalmente. En los inicios, los problemas asociados al proceso de fabricación de MEMS usando las capas BEOL de obleas CMOS resultaba desalentador. Liberar estructuras MEMS hechas con obleas CMOS con vapor de HF producía efectos no deseados que bien podrían llevar a la conclusión de que este enfoque de fabricación no es viable. Sin embargo, se idearon y probaron técnicas de diseño especiales y soluciones ad-hoc para contrarrestar estos efectos no deseados. Se implementaron en el diseño del magnetómetro de Lorentz presentado en esta Tesis, arrojando excelentes resultados, lo cual despeja el camino hacia la fabricación de diferentes dispositivos MEMS usando las capas BEOL.Postprint (published version

Low Power Cmos Circuit Design And Reliability Analysis For Wireless Me

A sensor node \u27AccuMicroMotion\u27 is proposed that has the ability to detect motion in 6 degrees of freedom for the application of physiological activity monitoring. It is expected to be light weight, low power, small and cheap. The sensor node may collect and transmit 3 axes of acceleration and 3 axes of angular rotation signals from MEMS transducers wirelessly to a nearby base station while attached to or implanted in human body. This dissertation proposes a wireless electronic system-on-a-single-chip to implement the sensor in a traditional CMOS process. The system is low power and may operate 50 hours from a single coin cell battery. A CMOS readout circuit, an analog to digital converter and a wireless transmitter is designed to implement the proposed system. In the architecture of the \u27AccuMicroMotion\u27 system, the readout circuit uses chopper stabilization technique and can resolve DC to 1 KHz and 200 nV signals from MEMS transducers. The base band signal is digitized using a 10-bit successive approximation register analog to digital converter. Digitized outputs from up to nine transducers can be combined in a parallel to serial converter for transmission by a 900 MHz RF transmitter that operates in amplitude shift keying modulation technique. The transmitter delivers a 2.2 mW power to a 50 Ù antenna. The system consumes an average current of 4.8 mA from a 3V supply when 6 sensors are in operation and provides an overall 60 dB dynamic range. Furthermore, in this dissertation, a methodology is developed that applies accelerated electrical stress on MOS devices to extract BSIM3 models and RF parameters through measurements to perform comprehensive study, analysis and modeling of several analog and RF circuits under hot carrier and breakdown degradation

High Performance Tunable Active Inductors For Microwave Circuits

Tez (Doktora) -- İstanbul Teknik Üniversitesi, Fen Bilimleri Enstitüsü, 2016Thesis (PhD) -- İstanbul Technical University, Institute of Science and Technology, 2016RF uygulamalarında enduktif karakteristiğe önemli ölçüde ihtiyaç duyulmaktadır; bunlar, özellikle filtreler, düşük gürültülü yükselteçler (LNA, low noise amplifiers), gerilim kontrollü osilatörler (VCO, voltage controlled oscillators), pek çok farklı türde yükselteç için band genişliği iyileştirilmesi, faz kaydırıcılar, güç bölücüler ve eşleştirme (matching) devreleri vb. uygulamalardır. Pasif sarmal çip-içi CMOS endüktansların eksik yönleri ayrıntılı olarak literatürde tartışılmıştır. Bu tür endüktanslar düşük değer katsayısı (quality factor), düşük öz-rezonans frekansı (SRF, self-resonance frequency), sabit ve düşük değerli endüktans ve geniş bir silikon (silicon) alanı gerektirmeleri gibi istenmeyen özelliklere sahiptirler. Diğer yandan, MOS transistorlar kullanılarak sentezlenen CMOS aktif endüktansların, pasif sarmal eşdeğer yapıları ile karşılaştırıldığında pek çok çekici karakteristik özellik sunabildikleri gösterilmiştir. Bunlar; geniş bir bölgede ayarlanabilir öz-rezonans frekansı başarımı, geniş bir bölgede ayarlanabilir endüktans başarımı, geniş bir bölgede ayarlanabilir değer katsayısı başarımı, CMOS teknolojileri ile tümüyle gerçeklenebilme ve az alan kaplama gibi karakteristik özellikleri olarak ortaya konulmaktadır. Literatürde jiratör-C (GC) prensibi, topolojisi, karakterizasyonu ve uygulamaları ayrıntılı olarak ele alınmaktadır. İşlemsel geçiş-iletkenliği kuvvetlendiricisi (OTA, operational transconductance amplifier) ile gerçeklenen GC devreleri, RF uygulamaları için oldukça uygundur. Bu özellik, GC yapılarının söz konusu yapı kullanılarak en az sayıda aktif eleman ile gerçeklenebilmesinden kaynaklanmaktadır. Gerek topraklı (grounded) gerekse yüzen (floating) aktif endüktansların GC devreleri ile gerçeklenebildiği gösterilmiştir. Aktif endüktansların başarımlarının nicel olarak ölçülmesi amacıyla, çok sayıda ölçüt ortaya konulmuştur. Bu ölçütler frekans çalışma aralığı, endüktans ayarlanabilirliği, değer katsayısı, gürültü ve güç tüketimi gibi temel özellikleri içerirler. CMOS transistorların parazitik bileşenlerinden dolayı tasarlanan aktif endüktanslar belirli bir frekans bölgesinde endüktif davranış gösterirler. Alt frekans sınırı, GC devrelerinin sıfır frekansı ile belirlenirken; üst frekans sınırı ise öz-rezonans frekansı ile belirlenir. Aktif endüktansların pasif sarmal eşdeğer yapılarına göre en önemli üstünlüklerinden biri de; endüktanslarının geniş bir değer aralığıunda ayarlanabilir olmasıdır. GC aktif endüktansların endüktans değeri, transistorların geçiş-iletkenliklerinin ya da MOS varaktörlerle gerçeklenen yük kapasitanslarının değiştirilmesi ile ayarlanabilir. Literatürde, GC topolojisine dayalı pek çok CMOS AI (active inductor) devresi bildirilmiştir. Bunların tümü, farklı teknikler kullanılarak yüksek başarımlı AI yapıları oluşturmayı amaçlamışlardır. Bu tezde, bunlardan güncel olan bazı GAI (grounded AI) ve FAI (floating AI) yapıları gözden geçirilmiştir. Bunlardan bazıları, değer katsayısını (QF) iyileştirmek amacıyla, AI kaybını telafi etmek için negatif direnç kullanmışlardır. GC yapıları RF uygulamaları için tasarlandıklarında en az sayıda transistor kullanımı çok kritiktir. Çünkü bu durum AI öz-rezonans frekansının artmasına yardımcı olur. AI’ler, kazanç artırma amacıyla LNA’lerde geniş kullanım alanı bulabilmektedirler. Diğer taraftan, AI yapılarının en önemli dezvantajlarından biri gürültü başarımının pasif endüktanslara nispeten yüksek olmasıdır. Literatürde bu dezavantajı gidermek amacıyla teklif edilen yaklaşımlardan biri dejenerasyon direncinin bulunduğu bir geribesleme katı kullanılarak girişe gelen gürültü katkısını azaltmayı amaçlamıştır. Literatürde teklif edilen tekniklerin amacı, parazitik bileşenlerin etkisini azaltmak ya da tümüyle ortadan kaldırmaktır. Bu tezde, ileri devre teknikleri kullanılarak, yeni topraklı (grounded) ve yüzen (floting) AI yapıları tasarlanmıştır. AI giriş ve çıkış düğümlerine ait iletkenlikleri azaltmak için çoklu-düzenlenmiş kaskod (multi-regulated cascode, MRC) katları QF değerini iyileştirme amacıyla kullanılmaktadır. MRC katı PMOS transistorlarıyla oluşturulmuştur. PMOS transistor kullanımı, • ikinci kat kutuplamasını ayarlayabilmek amacıyla, giriş transistor boyutunun mümkün olduğunca azaltılmasını, • ana AC işaret yolundaki transistor sayısının azaltılmasını, sağlamaktadır. Tezde sunulan teorik analiz ve serim sonrası benzetim sonuçları, MRC katı kullanımının AI özelliklerine yaptığı etkiyi göstermektedir. Elde edilen sonuçlar bu katların AI tasarımında yüksek QF elde edilmesini imkan tanıdığını ortaya koynaktadır. Literatürde, iki ana AI başarım karakteristiği olan SRF ve QF başarımlarının iyileştirmesi için çok sayıda çalışma bulunmaktadır. Bu tezde, birbirlerini etkilemeksizin SRF ve QF başarımlarının ayarlanabilmesi özelliğine sahip bir AI’ın tasarımı ve benzetgimi yapılmıştır. Kaskod ve RC geribesleme yapıları yeni AI tasarımında kullanılmıştır. Daha önce de tartışıldığı üzere, AI karakterizasyonu açısından giriş transistoru çok önemlidir. Girişi transistorunun kaskodlanması, ilk jiratörün geçiş-iletkenliğinin ve giriş parazitik kapasitansının birbirinden bağımsız olarak ayarlanması gibi önemli ve kullanışlı bir özelliği beraberinde getirir. Bunun yanısıra, endüktansın değeri diğer transistorun iletkenliği ile ayarlanabilir. AI parazitik seri-rezistansını yok etmek amacıyla kullanılan RC geribeslemesi, QF iyileştirmesini sağlayabilmektedir. Kaskod transistorların kutuplama koşulu bir diyot-bağlı transistor ile sağlandığından; önerilen yapı proses, gerilim ve sıcaklık değişimleri açısından kararlı ve yüksek başarımlıdır. AI yapılarında karşılaşılan düşük gürültü başarımı, AI’ların LNA gibi RF uygulamalarda kullanımını sınırlamaktadır. Bir AI’ın ana gürültü kaynağı giriş transistorudur. Düşük gürültülü AI elde etmek için, giriş transistoru yeterince büyük boyutlu olarak tasarlanmalıdır. Ne var ki, büyük boyutlu böyle bir transistor, düşük bir SRF ve dolayısıyla sınırlı bir endüktif bandı beraberinde getirir. Bu tezde, düşük gürültülü ve az kayıplı uygun bir AI, düşük gürültü gerektiren RF uygulamaları için sunulmuştur. Teklif edilen AI devresindeki tüm transistorların ortak-kaynak (common-source, CS) yapısında kullanılması, düşük iletkenliğe sahip düğümlerin dolayısıyla yüksek QF değerine sahip bir AI’ın elde edilmesine olanak sağlamaktadır. AI gürültüsünü azaltmak için, sırasıyla P-tipi MOS transistorlar ve ileri-besleme yolu yapısı (feed-forward path, FFP) kullanılmaktadır. Bilindiği gibi, sensörler çok çeşitli fiziksel büyüklüklerin eletrik mühendisiliği alanına taşınmasını sağlamaktadır. Çok geniş kullanım alanı bulan sensör tiplerinden biri kapasitif mikro algılıyıcılardır. Kapasitif mikro algılayıcılar mekanik hareketleri küçük kapasitans değişimlerine çevirirler. Micro algılayıcıdaki kapasitans değişimi femto-Farad mertebesinde olup algılamayı zorlaştırmaktadır. Diğer yandan, küçük bir kapasitans değişimini yüksek bir empedans değişimine çevirebilmeleri dolayısıyla, GC topolojilerinin kapasitif algılayıcılarda kullanılabileceğini söylemek mümkündür. Bu tezde, bu düşünceden yola çıkılarak, kesit duyarlılığını yok etme yeteneğine sahip yeni bir 3-eksen ivme-ölçer tasarlanmıştır. Yapının, her eksendeki ivmeyi bağımsız olarak algılayabilmesi için, algılayıcı elektrodları uygun olarak yerleştirilmiştir. Daha sonra, bir kapasitif algılayıcıdaki çok küçük kapasitans değişimlerini algılayabilmek için yeni bir GC yapısı teklif edilmiştir. Önerilen yapıda, çalışma frekansı aralığı ve ölçekleme çarpanı, kutuplama akımlarının ayarlanması suretiyle birbirini etkilemeksizin ayarlanabilmektedir. Ayrıca, önerilen yapıda, parazitik bileşenlerin etkisini yok etmek için RC geribesleme ve kaskod yapılar kullanılmaktadır. Son olarak, bu tezde sunulan AI’ların çok amaçlı özellikte olduğunu göstermek amacıyla, 3 ve 6. dereceden geniş bantlı mikrodalga filtrelerde kullanılmaları ele alınmıştır. İlki 3. dereceden bir Chebyshev alçak geçiren filtredir. Basitleştirilmiş gerçel frekans tekniği (SRFT, simplified real frequency technique) ile tasarlanan ikincisi ise, 6. dereceden bir Chebyshev band geçiren filtredir. Filtrelerin benzetimle elde edilmiş frekans yanıtları, bu tezde sunulan AI’ların literatürdeki yapılara güçlü birer alternatif olduklarını ortaya koymaktadır.There is critical need for inductive characteristics in RF applications, especially in filters, LNA, VCO, bandwidth-enhancement in many kinds of amplifiers, phase shifters, power divider and matching networks. The drawbacks of using passive and spiral inductors in CMOS process are discussed in the literature. It is shown that these kind of inductors suffer from a low quality factor, a low self-resonant frequency, a low and fixed inductance value and the need for a large silicon area. Furthermore, it is shown in the literature that CMOS Active Inductors (AIs), which are synthesized using MOS transistors, offer a number of attractive characteristics as compared with their spiral counterparts. These characteristics include a low silicon consumption, a large and tunable self-resonant frequency, a large and tunable inductance, a large and tunable quality factor, and fully realizable in digital CMOS technologies. Then principles, topologies, characterizations and implementation of the Gyrator-C (GC) network is discussed in-depth. The GC networks, which are implemented by operational transconductance amplifier, are suitable for RF application. This property arises from their minimum usage of active elements. It is shown that both grounded and floating active inductors can be implemented by GC networks. To provide a quantitative measure of the performance of AIs, a number of figure-of-merits have been introduced in the thesis. These figure-of-merits include frequency range, inductance tunability, quality factor, noise and power consumption. Due to parasitic components of CMOS transistors, designed AIs have inductive behavior in a specified frequency range. The low frequency bound is set by the frequency of the zero of the gyrator-C networks while the upper frequency bound is set by Self-Resonance Frequency (SRF). One of the key advantages of active inductors over their spiral counterparts is the large tunability of their inductance. The inductance of GC AIs can be tuned by varying either the transconductances of the transconductors or the load capacitance, which is implemented by MOS varactor. Based on GC topology, there are many reported CMOS AI circuits in literature. All of them have tried to invent high performance AI by using different techniques. Some of recent proposed Grounded AI (GAI) and Floating AI (FAI) circuits are reviewed in the thesis. Some of them use negative resistor to compensate the loss of AI for QF enhancement. Some others try to use minimum number of transistors in order to increase the self-resonance frequency of AI for RF applications. In some applications, AIs are used in LNA circuits for gain boosting purpose. In that applications, designers have tried to cancel the noise of AI by using a feedback stage with a degeneration resistor to reduce the noise contribution to the input. The main aim of all the techniques is to cancel or reduce the effects of parasitic components. In the thesis, four new grounded and floating AIs are designed by using advanced circuit techniques. The first one, Multi Regulated Cascode (MRC) stages are employed for lowering conductance in input and output nodes of AI. Thus, Q performance is improved. Since these stages are used only for increasing impedance of input/output nodes, they are made up of PMOS transistors in order to: • minimize the input transistor as small as possible in order to adjust second stage biasing, • decrease the number of transistors in main path of AC signal Theoretical analysis and post-layout simulation results shows the effectiveness of using MRC stages usage in properties of AI. High Q symmetric floating version of low loss inductor is also designed by utilizing MRC stages. Designers do their best to improve SRF and QF, two main characteristics in term of AI performance. An AI with ability to adjust its SRF and QF without affecting each other is designed and simulated as a third. The cascoding and RC feedback structures are used in the new design of AI. As it discussed before, input transistor is very important regarding to AI characterizations. Cascoding input transistor gives the ability to adjust the first gyrator’s transconductance and input parasitic capacitance independently which it results in adjusting the self-resonance frequency and quality factor separately. Due to our best knowledge from literature reviewing, it is first time that the properties of an inductor can be adjusted independently. Furthermore, the inductance value can be adjusted by other transistor’s transconductances. Also, the RC feedback is utilized to cancel the parasitic series-resistance of AI which results in QF enhancement. Since, bias condition of cascoding transistors is provided by a diode-connected transistor, the proposed structure is robust in terms of performance over variation in process, voltage and temperature. The Noise of designed AIs has limited the use of them in RF applications such as LNAs. The main noise source of an AI is its input transistor. In order to have low noise AI, the input transistor should be designed large enough. But it leads to low SRF which limited the inductive frequency band. As a fourth active inductor design, a low-noise and low-loss AI is presented suitable for RF low noise applications. Utilizing all transistors in Common Sourse (CS) configuration on the AI circuit leads to low conductance nodes which causes the AI to have high Q. P-type MOS transistors and Feed-Forward Path (FFP) are employed to decrease noise of the AI, respectively. The GC topologies can convert a low capacitance variation to high impedance changing which makes it a good choice for capacitive sensors. The capacitive based micro sensors convert mechanical signals to small capacitance variation. The capacitance variation in micro sensor is in the range of femto-Farads which makes it difficult to sense. Thus, the GC topologies can be used in capacitive sensors in order to sense small capacitive variations. In the thesis, this technique is used in a new accelerometer sensor. It is first time that a gyrator-C network is employed as an interface circuit for capacitive change detection in micro sensors. The new accelerometer structure is designed by using with ability to cancel cross section sensitivity. The sensor’s electrodes are located in such a way that enables the structure to detect acceleration in 3-axis independently. Embedding all 3-axis detecting electrodes in a single proof mass and ability to detect acceleration orientation are salient features of the proposed sensor. Consequently, a new GC configuration for sensing very small capacitance changes in a capacitive sensor is presented in the thesis. In the proposed configuration, the operating frequency range and scaling factor can be adjusted without affecting each other by tuning the bias currents of utilized gyrators. In addition, the proposed configuration employs RC feedback together with the cascoding technique to cancel the effect of the parasitic components in order to get accurate scaling from gyrator-C network. Finally, in order to show versatility of designed AIs, they are used in designed third and sixth order broadband microwave filters. The first one is a third order Chebyshev low pass filter. The second one, which is designed by using simplified real frequency technique is a sixth order Chebyshev band pass filter. The simulated frequency response of filters prove the workability of the designed AIs.DoktoraPh

Integrated interface electronics for capacitive MEMS inertial sensors

This thesis is composed of 13 publications and an overview of the research topic, which also summarizes the work. The research presented in this thesis concentrates on integrated circuits for the realization of interface electronics for capacitive MEMS (micro-electro-mechanical system) inertial sensors, i.e. accelerometers and gyroscopes. The research focuses on circuit techniques for capacitive detection and actuation and on high-voltage and clock generation within the sensor interface. Characteristics of capacitive accelerometers and gyroscopes and the electronic circuits for accessing the capacitive information in open- and closed-loop configurations are introduced in the thesis. One part of the experimental work, an accelerometer, is realized as a continuous-time closed-loop sensor, and is capable of achieving sub-micro-g resolution. The interface electronics is implemented in a 0.7-µm high-voltage technology. It consists of a force feedback loop, clock generation circuits, and a digitizer. Another part of the experimental work, an analog 2-axis gyroscope, is optimized not only for noise, but predominantly for low power consumption and a small chip area. The implementation includes a pseudo-continuous-time sense readout, analog continuous-time drive loop, phase-locked loop (PLL) for clock generation, and high-voltage circuits for electrostatic excitation and high-voltage detection. The interface is implemented in a 0.35-µm high-voltage technology within an active area of 2.5 mm². The gyroscope achieves a spot noise of 0.015 °/s/√H̅z̅ for the x-axis and 0.041 °/s/√H̅z̅ for the y-axis. Coherent demodulation and discrete-time signal processing are often an important part of the sensors and also typical examples that require clock signals. Thus, clock generation within the sensor interfaces is also reviewed. The related experimental work includes two integrated charge pump PLLs, which are optimized for compact realization but also considered with regard to their noise performance. Finally, this thesis discusses fully integrated high-voltage generation, which allows a higher electrostatic force and signal current in capacitive sensors. Open- and closed-loop Dickson charge pumps and high-voltage amplifiers have been realized fully on-chip, with the focus being on optimizing the chip area and on generating precise spurious free high-voltage signals up to 27 V