Simplified ZrTiOx-based RRAM cell structure with rectifying characteristics by integrating Ni/n + -Si diode

A simplified one-diode one-resistor (1D1R) resistive switching memory cell that uses only four layers of TaN/ZrTiO( x )/Ni/n(+)-Si was proposed to suppress sneak current where TaN/ZrTiO( x )/Ni can be regarded as a resistive-switching random access memory (RRAM) device while Ni/n(+)-Si acts as an Schottky diode. This is the first RRAM cell structure that employs metal/semiconductor Schottky diode for current rectifying. The 1D1R cell exhibits bipolar switching behavior with SET/RESET voltage close to 1 V without requiring a forming process. More importantly, the cell shows tight resistance distribution for different states, significantly rectifying characteristics with forward/reverse current ratio higher than 10(3) and a resistance ratio larger than 10(3) between two states. Furthermore, the cell also displays desirable reliability performance in terms of long data retention time of up to 10(4) s and robust endurance of 10(5) cycles. Based on the promising characteristics, the four-layer 1D1R structure holds the great potential for next-generation nonvolatile memory technology

Influences of the temperature on the electrical properties of HfO2-based resistive switching devices

Producción CientíficaIn the attempt to understand the behavior of HfO2-based resistive switching devices at low temperatures, TiN/Ti/HfO2/W metal–insulator–metal devices were fabricated; the atomic layer deposition technique was used to grow the high-k layer. After performing an electroforming process at room temperature, the device was cooled in a cryostat to carry out 100 current–voltage cycles at several temperatures ranging from the “liquid nitrogen temperature” to 350 K. The measurements showed a semiconducting behavior in high and low resistance states. In the low resistance state, a hopping conduction mechanism was obtained. The set and reset voltages increased when temperature decreased because the thermal energies for oxygen vacancies and ions were reduced. However, the temperature did not influence the power absorbed in the reset transition, indicating the local temperature in the filament controls the transition. The set transition turned from gradual to abrupt when decreasing the temperature, due to a positive feedback between the current increase and the Joule heating at low temperatures.Ministerio de Economía, Industria y Competitividad - Fondo Europeo de Desarrollo Regional (Projects TEC2017-84321-C4-2-R and TEC2017-84321-C4-1-R

PROBING LOCAL VACANCY-DRIVEN RESISTIVE SWITCHING IN METAL OXIDE NANOSTRUCTURES

Novel nonvolatile memory technologies garner intense research interest as conventional ash devices approach their physical limit. Memristors, often comprising an insulating thin film between two metal electrodes to constitute a class of two-terminal devices, enable a variety of important large data storage and data-driven computing applications. In addition to nonvolatile behavior, other features such as high scalability, low power consumption, and sub-nanosecond response times make memristors among the most attractive candidate systems. Their strength in electronic storage relies on the unique properties of the tunable variations in resistance induced from the accumulation of charged defects based on the applied bias history. Metal oxides serve as the most common storage materials, demonstrating advantages including simple fabrication, high reliability, and fast operation speeds. While the basic working concepts and the underlying conduction mechanisms have been established through combined experimental and simulation studies, the role of metal insulator interface, which acts as the crux of coupled electronic-ionic interactions, has not been fully understood. Continuous scaling, for the purpose of high density memories, also requires a detailed understanding of the switching behavior and transport mechanism. Other technical challenges include the development of innovative, low-cost fabrication methods that effectively enable high-performance structures as an alternative to complicated process modules. Stable retention and endurance of the switching characteristics, as well as uniformity of the switching parameters to ensure a valid program/read operation also represent significant challenges. Studies in device and materials optimization remain in the formative stages, and thus motivate this work to drive progress in the most attractive areas, including size dependent behavior and switching performance of memristors. This collection of work aims to correlate resistive switching within metal oxide based memristors with the fundamental physical mechanisms and material properties on a highly localized scale. Chapter 3 relates the device size and the resulting performance matrix of memory cells in the first step towards fully understanding the scaling projection and reliability issues that affect nanoscale architectures. Chapter 4 demonstrates a convective self-assembly, transferable approach that enables the fabrication of highly-controlled nanoribbon comprising solution-processed nanocrystals, providing multiple degrees of freedom for understanding the interfacial memristive behavior of functional oxide nanostructures. As a powerful tool in the study of resistive switching, conductive AFM probes the homogeneity of the charge transport properties, thus offering electrical information by locally applied bias when it is placed in direct contact with desired regime. Finally we also focus on the improving the cycle-to-cycle uniformity by embedding nanostructure into conventional metal-insulator-metal (MIM) geometry in Chapter 5. This improvement is attributed to the concentration of electric field when metal nanoislands are inserted into the oxide film matrix. The details of this work will highlight the tunable and optimizable template-driven method that can be applied on any memristive systems, yielding a superior uniformity of operating voltage and resistance states. In summary, this thesis promotes the development of novel, high-performance metal oxide based memristors enabled by the availability of new, nanostructured materials and innovations in device structure engineering. The switching performance, underlying mechanisms, area/defect concentration effects, development of solution-processed nanocrystals assemblies and chemistries, and highly enhanced uniformity in memristors are addressed by combining systematic deposition approaches with the advanced nanoscopic observation of the conducting filament, leading to the strongest competitor among future nonvolatile memory solution

Characterisation of Novel Resistive Switching Memory Devices

Resistive random access memory (RRAM) is widely considered as a disruptive technology that will revolutionize not only non-volatile data storage, but also potentially digital logic and neuromorphic computing. The resistive switching mechanism is generally conceived as the rupture/restoration of defect-formed conductive filament (CF) or defect profile modulation, for filamentary and non-filamentary devices respectively. However, details of the underlying microscopic behaviour of the resistive switching in RRAM are still largely missing. In this thesis, a defect probing technique based on the random telegraph noise (RTN) is developed for both filamentary and non-filamentary devices, which can reveal the resistive switching mechanism at defect level and can also be used to analyse the device performance issues. HfO2 is one of the most matured metal-oxide materials in semiconductor industry and HfO2 RRAM shows promising potential in practical application. An RTN-based defect extraction technique is developed for the HfO2 devices to detect individual defect movement and provide statistical information of CF modification during normal operations. A critical filament region (CFR) is observed and further verified by defect movement tracking. Both defect movements and CFR modification are correlated with operation conditions, endurance failure and recovery. Non-filamentary devices have areal switching characteristics, and are promising in overcoming the drawbacks of filamentary devices that mainly come from the stochastic nature of the CF. a-VMCO is an outstanding non-filamentary device with a set of unique characteristics, but its resistive switching mechanism has not been clearly understood yet. By utilizing the RTN-based defect profiling technique, defect profile modulation in the switching layer is identified and correlated with digital and analogue switching behaviours, for the first time. State instability is analysed and a stable resistance window of 10 for >106 cycles is restored through combining optimizations of device structure and operation conditions, paving the way for its practical application. TaOx-based RRAM has shown fast switching in the sub-nanosecond regime, good CMOS compatibility and record endurance of more than 1012 cycles. Several inconsistent models have been proposed for the Ta2O5/TaOx bilayered structure, and it is difficult to quantify and optimize the performance, largely due to the lack of microscopic description of resistive switching based on experimental results. An indepth analysis of the TiN/Ta2O5/TaOx/TiN structured RRAM is carried out with the RTN-based defect probing technique, for both bipolar and unipolar switching modes. Significant differences in defect profile have been observed and explanations have been provided

Effect of Annealing Temperature for Ni/AlOx/Pt RRAM Devices Fabricated with Solution-Based Dielectric

Resistive random access memory (RRAM) devices with Ni/AlOx/Pt-structure were manufactured by deposition of a solution-based aluminum oxide (AlOx) dielectric layer which was subsequently annealed at temperatures from 200 °C to 300 °C, in increments of 25 °C. The devices displayed typical bipolar resistive switching characteristics. Investigations were carried out on the effect of different annealing temperatures for associated RRAM devices to show that performance was correlated with changes of hydroxyl group concentration in the AlOx thin films. The annealing temperature of 250 °C was found to be optimal for the dielectric layer, exhibiting superior performance of the RRAM devices with the lowest operation voltage (104), the narrowest resistance distribution, the longest retention time (>104 s) and the most endurance cycles (>150)

Defect Induced Aging and Breakdown in High-k Dielectrics

abstract: High-k dielectrics have been employed in the metal-oxide semiconductor field effect transistors (MOSFETs) since 45 nm technology node. In this MOSFET industry, Moore’s law projects the feature size of MOSFET scales half within every 18 months. Such scaling down theory has not only led to the physical limit of manufacturing but also raised the reliability issues in MOSFETs. After the incorporation of HfO2 based high-k dielectrics, the stacked oxides based gate insulator is facing rather challenging reliability issues due to the vulnerable HfO2 layer, ultra-thin interfacial SiO2 layer, and even messy interface between SiO2 and HfO2. Bias temperature instabilities (BTI), hot channel electrons injections (HCI), stress-induced leakage current (SILC), and time dependent dielectric breakdown (TDDB) are the four most prominent reliability challenges impacting the lifetime of the chips under use. In order to fully understand the origins that could potentially challenge the reliability of the MOSFETs the defects induced aging and breakdown of the high-k dielectrics have been profoundly investigated here. BTI aging has been investigated to be related to charging effects from the bulk oxide traps and generations of Si-H bonds related interface traps. CVS and RVS induced dielectric breakdown studies have been performed and investigated. The breakdown process is regarded to be related to oxygen vacancies generations triggered by hot hole injections from anode. Post breakdown conduction study in the RRAM devices have shown irreversible characteristics of the dielectrics, although the resistance could be switched into high resistance state.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Status and Prospects of ZnO-Based Resistive Switching Memory Devices

In the advancement of the semiconductor device technology, ZnO could be a prospective alternative than the other metal oxides for its versatility and huge applications in different aspects. In this review, a thorough overview on ZnO for the application of resistive switching memory (RRAM) devices has been conducted. Various efforts that have been made to investigate and modulate the switching characteristics of ZnO-based switching memory devices are discussed. The use of ZnO layer in different structure, the different types of filament formation, and the different types of switching including complementary switching are reported. By considering the huge interest of transparent devices, this review gives the concrete overview of the present status and prospects of transparent RRAM devices based on ZnO. ZnO-based RRAM can be used for flexible memory devices, which is also covered here. Another challenge in ZnO-based RRAM is that the realization of ultra-thin and low power devices. Nevertheless, ZnO not only offers decent memory properties but also has a unique potential to be used as multifunctional nonvolatile memory devices. The impact of electrode materials, metal doping, stack structures, transparency, and flexibility on resistive switching properties and switching parameters of ZnO-based resistive switching memory devices are briefly compared. This review also covers the different nanostructured-based emerging resistive switching memory devices for low power scalable devices. It may give a valuable insight on developing ZnO-based RRAM and also should encourage researchers to overcome the challenges

Effect of Surface Variations on Resistive Switching

In this chapter, we study factors that dominate the interfacial resistive switching (RS) in memristive devices. We have also given the basic understanding of different type of RS devices which are predominantly interfacial in nature. In case of resistive random access memory (RRAM), the effect of surface properties on the bulk cannot be neglected as thickness of the film is generally below 100 nm. Surface properties are effected by redox reactions, interfacial layer formation, and presence of tunneling barrier. Surface morphology affects the band structure in the vicinity of interface, which in turn effects the movements of charge carriers. The effect of grain boundaries (GBs) and grain surfaces (GSs) on RS have also been discussed. The concentration of vacancies (Ov)/traps/defects is comparatively higher at GBs which leads to leakage current flow through the GBs predominantly. Such huge presence of charge carriers causes current flow through grain boundaries

Nanoscale Memristive Devices for Memory and Logic Applications.

As the building block of semiconductor electronics, field effect transistor (FET), approaches the sub 100 nm regime, a number of fundamental and practical issues start to emerge such as short channel effects that prevent the FET from operating properly and sub-threshold slope non-scaling that leads to increased power dissipation. In terms of nonvolatile memory, it is generally believed that transistor based Flash memory will approach the end of scaling within about a decade. As a result, novel, non-FET based devices and architectures will likely be needed to satisfy the growing demands for high performance memory and logic electronics applications. In this thesis, we present studies on nanoscale resistance switching devices (memristive devices). The device shows excellent resistance switching properties such as fast switching time ( 10^6), good data retention (> 6 years) and programming endurance (> 10^5). The studies suggest that the nonvolatile resistance switching in a nanoscale a-Si resistive switch is caused by the formation of a single conductive filament within 10 nm range near the bottom electrode. New functionalities, such as multi-bit switching with partially formed filaments, can be obtained by controlling the resistance switching process through current programming. As digital memory devices, the devices are ideally suited in the crossbar architecture which offers ultra-high density and intrinsic defect tolerance capability. As an example, a high-density (2 Gbits/cm^2) 1kb crossbar memory was demonstrated with excellent uniformity, high yield (> 92%) and ON/OFF ratio (> 10^3), proving its promising aspects for memory and reconfigurable logic applications. Furthermore, we demonstrated that properly designed devices can exhibit controlled analog switching behavior and function as flux controlled memristor devices. The analog memristors can be used in biology-inspired neuromorphic circuits in which signal processing efficiency orders of magnitude higher than conventional digital computer systems can be reached. As a prototype illustration, we showed Spike Timing Dependent Plasticity (STDP), one of the key learning rules in biological system, can be realized by CMOS neurons and nanoscale memristor synapses.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/75835/1/josung_1.pd

Leakage current and resistive switching mechanisms in SrTiO3

PhD ThesisResistive switching random access memory devices have attracted considerable attention due to exhibiting fast programming, non-destructive readout, low power-consumption, high-density integration, and low fabrication-cost. Resistive switching has been observed in a wide range of materials but the underpinning mechanisms still have not been understood completely. This thesis presents a study of the leakage current and resistive switching mechanisms of SrTiO3 metal-insulator-metal devices fabricated using atomic layer deposition and pulse laser deposition techniques. First, the conduction mechanisms in SrTiO3 are investigated. The leakage current characteristics are highly sensitive to the polarity and magnitude of applied voltage bias, punctuated by sharp increases at high field. The characteristics are also asymmetric with bias and the negative to positive current crossover point always occurs at a negative voltage bias. A model comprising thermionic field emission and tunnelling phenomena is proposed to explain ii the dependence of leakage current upon the device parameters quantitatively. SrTiO3 also demonstrates bipolar switching behaviour where the current-density versus voltage (J-V) characteristics show asymmetry at all temperatures examined, with resistive switching behaviour observed at elevated temperatures. The asymmetry is explained by the relative lack of electron traps at one electrode, which is determined from the symmetric J-V curve obtained at room temperature due to the redistribution of the dominant electrical defects in the film. Evidence is presented for a model of resistive switching that originates from defect diffusion (possibly oxygen vacancies) at high temperatures. Finally, a peculiar resistive switching behaviour was observed in pulse laser deposited SrTiO3. This switching depends on both the amplitude and polarity of the applied voltage, and cannot be described as either bipolar or unipolar resistive switching. This behaviour is termed antipolar due to the opposite polarity of the set voltage relative to the previous reset voltage. The proposed model based on electron injection by tunnelling at interfaces and a Poole-Frenkel mechanism through the bulk is extended to explain the antipolar resistive switching behaviour. This model is quantified by use of a simple mathematical equation to simulate the experimental results