ALU Built-In Self Test

Práce se zabývá různými poruchami, které mohou nastat při výrobě a provozu ALU. Nastiňuje vícero dělení poruch a jejich modely. Jsou rozebrány přístupy k zajištění bezpečnosti systému zejména po hardwarové stránce. Následuje shrnutí softwarových metod pro testování ALU. Poslední kapitola rozebírá návrh knihovny pro testy mikrokontroléru MSP430.This work deals with faults, errors and failures, which can occur during manufacturing and long term operation. Work describes the various failures and fault models. There are some approaches to get fault tolerant systems, mainly in hardware. The thesis continues with a summary of methods for ALU software testing. The last chapter is about tests generation for microcontroller MSP430.

Built-In Self-Test Methodology for A/D Converters

A (partial) Built-in Self-Test (BIST) methodology is proposed for analog to digital (A/D) converters. In this methodology the number of bits of the A/D converter that needs to be monitored externally in a test is reduced. This reduction depends, among other things, on the frequency of the applied test signal. At low test signal frequencies only the least significant bit (LSB) needs to be monitored and a "full" BIST becomes feasible. An analysis is made of the trade-off between the size of the on-chip test circuitry and the accuracy of this BIST techniqu

Reconfiguration based built-in self-test for analogue front-end circuits

Previous work has shown that it is feasible to implement a fully digital test evaluation function to realise partial self-test on an automatic gain control circuit (AGC). This paper extends the technique to INL, DNL, offset & gain error testing of analogue to digital converters (ADC's). It also shows how the same function can be used to test an AGC / ADC pair. An extension to full self-test is also proposed by the on-chip generation of input stimuli through reconfiguration of existing functions

Built-in self test of RF subsystems

textWith the rapid development of wireless and wireline communications, a variety of new standards and applications are emerging in the marketplace. In order to achieve higher levels of integration, RF circuits are frequently embedded into System on Chip (SoC) or System in Package (SiP) products. These developments, however, lead to new challenges in manufacturing test time and cost. Use of traditional RF test techniques requires expensive high frequency test instruments and long test time, which makes test one of the bottlenecks for reducing IC costs. This research is in the area of built-in self test technique for RF subsystems. In the test approach followed in this research, on-chip detectors are used to calculate circuits specifications, and data converters are used to collect the data for analysis by an on-chip processor. A novel on-chip amplitude detector has been designed and optimized for RF circuit specification test. By using on-chip detectors, both the system performance and specifications of the individual components can be accurately measured. On-chip measurement results need to be collected by Analog to Digital Converters (ADCs). A novel time domain, low power ADC has been designed for this purpose. The ADC architecture is based on a linear voltage controlled delay line. Using this structure results in a linear transfer function for the input dependent delay. The time delay difference is then compared to a reference to generate a digital code. Two prototype test chips were fabricated in commercial CMOS processes. One is for the RF transceiver front end with on-chip detectors; the other is for the test ADC. The 940MHz RF transceiver front-end was implemented with on-chip detectors in a 0.18 [micrometer] CMOS technology. The chips were mounted onto RF Printed Circuit Boards (PCBs), with tunable power supply and biasing knobs. The detector was characterized with measurements which show that the detector keeps linear performance over a wide input amplitude range of 500mV. Preliminary simulation and measurements show accurate transceiver performance prediction under process variations. A 300MS/s 6 bit ADC was designed using the novel time domain architecture in a 0.13 [micrometer] standard digital CMOS process. The simulation results show 36.6dB Signal to Noise Ratio (SNR), 34.1dB Signal to Noise and Distortion Ratio (SNDR) for 99MHz input, Differential Non-Linearity (DNL)<0.2 Least Significant Bit (LSB), and Integral Non-Linearity (INL)<0.5LSB. Overall chip power is 2.7mW with a 1.2V power supply. The built-in detector RF test was extended to a full transceiver RF front end test with a loop-back setup, so that measurements can be made to verify the benefits of the technique. The application of the approach to testing gain, linearity and noise figure was investigated. New detector types are also evaluated. In addition, the low-power delay-line based ADC was characterized and improved to facilitate gathering of data from the detector. Several improved ADC structures at the system level are also analyzed. The built-in detector based RF test technique enables the cost-efficient test for SoCs.Electrical and Computer Engineerin

Immunotronics - novel finite-state-machine architectures with built-in self-test using self-nonself differentiation

A novel approach to hardware fault tolerance is demonstrated that takes inspiration from the human immune system as a method of fault detection. The human immune system is a remarkable system of interacting cells and organs that protect the body from invasion and maintains reliable operation even in the presence of invading bacteria or viruses. This paper seeks to address the field of electronic hardware fault tolerance from an immunological perspective with the aim of showing how novel methods based upon the operation of the immune system can both complement and create new approaches to the development of fault detection mechanisms for reliable hardware systems. In particular, it is shown that by use of partial matching, as prevalent in biological systems, high fault coverage can be achieved with the added advantage of reducing memory requirements. The development of a generic finite-state-machine immunization procedure is discussed that allows any system that can be represented in such a manner to be "immunized" against the occurrence of faulty operation. This is demonstrated by the creation of an immunized decade counter that can detect the presence of faults in real tim

Built-in-self-test of RF front-end circuitry

Fuelled by the ever increasing demand for wireless products and the advent of deep submicron CMOS, RF ICs have become fairly commonplace in the semiconductor market. This has given rise to a new breed of Systems-On-Chip (SOCs) with RF front-ends tightly integrated along with digital, analog and mixed signal circuitry. However, the reliability of the integrated RF front-end continues to be a matter of significant concern and considerable research. A major challenge to the reliability of RF ICs is the fact that their performance is also severely degraded by wide tolerances in on-chip passives and package parasitics, in addition to process related faults. Due to the absence of contact based testing solutions in embedded RF SOCs (because the very act of probing may affect the performance of the RF circuit), coupled with the presence of very few test access nodes, a Built In Self Test approach (BiST) may prove to be the most efficient test scheme. However due to the associated challenges, a comprehensive and low-overhead BiST methodology for on-chip testing of RF ICs has not yet been reported in literature. In the current work, an approach to RF self-test that has hitherto been unexplored both in literature and in the commercial arena is proposed. A sensitive current monitor has been used to extract variations in the supply current drawn by the circuit-under-test (CUT). These variations are then processed in time and frequency domain to develop signatures. The acquired signatures can then be mapped to specific behavioral anomalies and the locations of these anomalies. The CUT is first excited by simple test inputs that can be generated on-chip. The current monitor extracts the corresponding variations in the supply current of the CUT, thereby creating signatures that map to various performance metrics of the circuit. These signatures can then be post-processed by low overhead on-chip circuitry and converted into an accessible form. To be successful in the RF domain any BIST architecture must be minimally invasive, reliable, offer good fault coverage and present low real estate and power overheads. The current-based self-test approach successfully addresses all these concerns. The technique has been applied to RF Low Noise Amplifiers, Mixers and Voltage Controlled Oscillators. The circuitry and post-processing techniques have also been demonstrated in silicon (using the IBM 0.25 micron RF CMOS process). The entire self-test of the RF front-end can be accomplished with a total test time of approximately 30µs, which is several orders of magnitude better than existing commercial test schemes

Built-in-self-test and foreground calibration of SAR ADCs

This thesis explores the scope of ‘Built-in-Self-Test’(BIST) schemes to reduce the time cost complexity associated with the production tests for static linearity errors in Successive Approximation (SAR) ADCs. In this regard, an on-chip implementation of the ‘Stimulus Based Error Identification and Removal’ (SEIR) method [1] is sought to be pursued. As an extension, it is proposed that the estimated ADC non-linearities may then be suitably calibrated to achieve higher resolution. A brief review of the testing and calibration algorithm is undertaken. Further, this work elaborates on the design of a prototype front-end test generator and a buffer interface to calibrate a 10MHz 14 bit redundant SAR ADC in the TSMC 180nm process. Simulation results validating the circuit implementation of the integrated front-end system have been presented.Electrical and Computer Engineerin

Online and Offline BIST in IP-Core Design

This article presents an online and offline built-in self-test architecture implemented as an SRAM intellectual-property core for telecommunication applications. The architecture combines fault-latency reduction, code-based fault detection, and architecture-based fault avoidance to meet reliability constraint

Low-Overhead Built-In Self-Test for Advanced RF Transceiver Architectures

abstract: Due to high level of integration in RF System on Chip (SOC), the test access points are limited to the baseband and RF inputs/outputs of the system. This limited access poses a big challenge particularly for advanced RF architectures where calibration of internal parameters is necessary and ensure proper operation. Therefore low-overhead built-in Self-Test (BIST) solution for advanced RF transceiver is proposed. In this dissertation. Firstly, comprehensive BIST solution for RF polar transceivers using on-chip resources is presented. In the receiver, phase and gain mismatches degrade sensitivity and error vector magnitude (EVM). In the transmitter, delay skew between the envelope and phase signals and the finite envelope bandwidth can create intermodulation distortion (IMD) that leads to violation of spectral mask requirements. Characterization and calibration of these parameters with analytical model would reduce the test time and cost considerably. Hence, a technique to measure and calibrate impairments of the polar transceiver in the loop-back mode is proposed. Secondly, robust amplitude measurement technique for RF BIST application and BIST circuits for loop-back connection are discussed. Test techniques using analytical model are explained and BIST circuits are introduced. Next, a self-compensating built-in self-test solution for RF Phased Array Mismatch is proposed. In the proposed method, a sinusoidal test signal with unknown amplitude is applied to the inputs of two adjacent phased array elements and measure the baseband output signal after down-conversion. Mathematical modeling of the circuit impairments and phased array behavior indicates that by using two distinct input amplitudes, both of which can remain unknown, it is possible to measure the important parameters of the phased array, such as gain and phase mismatch. In addition, proposed BIST system is designed and fabricated using IBM 180nm process and a prototype four-element phased-array PCB is also designed and fabricated for verifying the proposed method. Finally, process independent gain measurement via BIST/DUT co-design is explained. Design methodology how to reduce performance impact significantly is discussed. Simulation and hardware measurements results for the proposed techniques show that the proposed technique can characterize the targeted impairments accurately.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201