Characterization of process variability and robust optimization of analog circuits

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2008.Includes bibliographical references (p. 161-174).Continuous scaling of CMOS technology has enabled dramatic performance enhancement of CMOS devices and has provided speed, power, and density improvement in both digital and analog circuits. CMOS millimeter-wave applications operating at more than 50GHz frequencies has become viable in sub-100nm CMOS technologies, providing advantages in cost and high density integration compared to other heterogeneous technologies such as SiGe and III-V compound semiconductors. However, as the operating frequency of CMOS circuits increases, it becomes more difficult to obtain sufficiently wide operating ranges for robust operation in essential analog building blocks such as voltage-controlled oscillators (VCOs) and frequency dividers. The fluctuations of circuit parameters caused by the random and systematic variations in key manufacturing steps become more significant in nano-scale technologies. The process variation of circuit performance is quickly becoming one of the main concerns in high performance analog design. In this thesis, we show design and analysis of a VCO and frequency divider operating beyond 70GHz in a 65nm SOI CMOS technology. The VCO and frequency divider employ design techniques enlarging frequency operating ranges to improve the robustness of circuit operation. Circuit performance is measured from a number of die samples to identify the statistical properties of performance variation. A back-propagation of variation (BPV) scheme based on sensitivity analysis of circuit performance is proposed to extract critical circuit parameter variation using statistical measurement results of the frequency divider. We analyze functional failure caused by performance variability, and propose dynamic and static optimization methods to improve parametric yield. An external bias control is utilized to dynamically tune the divider operating range and to compensate for performance variation. A novel time delay model of a differential CML buffer is proposed to functionally approximate the maximum operating frequency of the frequency divider, which dramatically reduces computational cost of parametric yield estimation. The functional approximation enables the optimization of the VCO and frequency divider parametric yield with a reasonable amount of simulation time.by Daihyun Lim.Ph.D

RF CMOS Oscillators for Modern Wireless Applications

While mobile phones enjoy the largest production volume ever of any consumer electronics products, the demands they place on radio-frequency (RF) transceivers are particularly aggressive, especially on integration with digital processors, low area, low power consumption, while being robust against process-voltage-temperature variations. Since mobile terminals inherently operate on batteries, their power budget is severely constrained. To keep up with the ever increasing data-rate, an ever-decreasing power per bit is required to maintain the battery lifetime. The RF oscillator is the second most power-hungry block of a wireless radio (after power amplifiers). Consequently, any power reduction in an RF oscillator will greatly benefit the overall power efficiency of the cellular transceiver. Moreover, the RF oscillators' purity limits the transceiver performance. The oscillator's phase noise results in power leakage into adjacent channels in a transmit mode and reciprocal mixing in a receive mode. On the other hand, the multi-standard and multi-band transceivers that are now trending demand wide tuning range oscillators. However, broadening the oscillator’s tuning range is usually at the expense of die area (cost) or phase noise. The main goal of this book is to bring forth the exciting and innovative RF oscillator structures that demonstrate better phase noise performance, lower cost, and higher power efficiency than currently achievable. Technical topics discussed in RF CMOS Oscillators for Modern Wireless Applications include: Design and analysis of low phase-noise class-F oscillators Analyze a technique to reduce 1/f noise up-conversion in the oscillators Design and analysis of low power/low voltage oscillators Wide tuning range oscillators Reliability study of RF oscillators in nanoscale CMO

On the modeling of amplitude-sensitive electron spin resonance (ESR) detection using voltage-controlled oscillator (VCO)-based ESR-on-a-chip detectors

In this paper, we present an in-depth analysis of a voltage-controlled oscillator (VCO)-based sensing method for electron spin resonance (ESR) spectroscopy, which greatly simplifies the experimental setup compared to conventional detection schemes. In contrast to our previous oscillator-based ESR detectors, where the ESR signal was encoded in the oscillation frequency, in the amplitude-sensitive method, the ESR signal is sensed as a change of the oscillation amplitude of the VCO. Therefore, using VCO architecture with a built-in amplitude demodulation scheme, the experimental setup reduces to a single permanent magnet in combination with a few inexpensive electronic components. We present a theoretical analysis of the achievable limit of detection, which uses perturbation-theory-based VCO modeling for the signal and applies a stochastic averaging approach to obtain a closed-form expression for the noise floor. Additionally, the paper also introduces a numerical model suitable for simulating oscillator-based ESR experiments in a conventional circuit simulator environment. This model can be used to optimize sensor performance early on in the design phase. Finally, all presented models are verified against measured results from a prototype VCO operating at 14 GHz inside a 0.5 T magnetic field

RF CMOS Oscillators for Modern Wireless Applications

While mobile phones enjoy the largest production volume ever of any consumer electronics products, the demands they place on radio-frequency (RF) transceivers are particularly aggressive, especially on integration with digital processors, low area, low power consumption, while being robust against process-voltage-temperature variations. Since mobile terminals inherently operate on batteries, their power budget is severely constrained. To keep up with the ever increasing data-rate, an ever-decreasing power per bit is required to maintain the battery lifetime. The RF oscillator is the second most power-hungry block of a wireless radio (after power amplifiers). Consequently, any power reduction in an RF oscillator will greatly benefit the overall power efficiency of the cellular transceiver. Moreover, the RF oscillators' purity limits the transceiver performance. The oscillator's phase noise results in power leakage into adjacent channels in a transmit mode and reciprocal mixing in a receive mode. On the other hand, the multi-standard and multi-band transceivers that are now trending demand wide tuning range oscillators. However, broadening the oscillator’s tuning range is usually at the expense of die area (cost) or phase noise. The main goal of this book is to bring forth the exciting and innovative RF oscillator structures that demonstrate better phase noise performance, lower cost, and higher power efficiency than currently achievable. Technical topics discussed in RF CMOS Oscillators for Modern Wireless Applications include: Design and analysis of low phase-noise class-F oscillators Analyze a technique to reduce 1/f noise up-conversion in the oscillators Design and analysis of low power/low voltage oscillators Wide tuning range oscillators Reliability study of RF oscillators in nanoscale CMO

Applications in Electronics Pervading Industry, Environment and Society

This book features the manuscripts accepted for the Special Issue “Applications in Electronics Pervading Industry, Environment and Society—Sensing Systems and Pervasive Intelligence” of the MDPI journal Sensors. Most of the papers come from a selection of the best papers of the 2019 edition of the “Applications in Electronics Pervading Industry, Environment and Society” (APPLEPIES) Conference, which was held in November 2019. All these papers have been significantly enhanced with novel experimental results. The papers give an overview of the trends in research and development activities concerning the pervasive application of electronics in industry, the environment, and society. The focus of these papers is on cyber physical systems (CPS), with research proposals for new sensor acquisition and ADC (analog to digital converter) methods, high-speed communication systems, cybersecurity, big data management, and data processing including emerging machine learning techniques. Physical implementation aspects are discussed as well as the trade-off found between functional performance and hardware/system costs

Above-IC RF MEMS devices for communication applications

Wireless communications are showing an explosive growth in emerging consumer and military applications of radiofrequency (RF), microwave, and millimeter-wave circuits and systems. Applications include wireless personal connectivity (Bluetooth), wireless local area networks (WLAN), mobile communication systems (GSM, GPRS, UMTS, CDMA), satellite communications and automotive electronics. Future cell phones and ground communication systems as well as communication satellites will require more and more sophisticated technologies. The increasing demand for size and weight reduction, cost savings, low power consumption, increased frequency and higher functionality and reconfigurability as part of multiband and multistandard operation is necessitating the use of highly integrated RF front-end circuits. Chip scaling has made a major contribution to this goal, but today a situation has been reached where the presence of numerous off-chip passive RF components imposes a critical bottleneck to further integration and miniaturization of wireless transceivers. Microelectromechanical systems (MEMS) technology is a rapidly emerging enabling technology that is intended to replace the discrete passives by their integrated counterparts. In this thesis, an original metal surface micromachining process, which is compatible with CMOS post-processing, for above-IC integration of RF MEMS tunable capacitors and suspended inductors is presented. A detailed study on SF6 inductively coupled plasma (ICP) releasing has been performed in order to ascertain the optimal process parameters. This study has emphasized the fact that temperature plays an important role in this process by limiting silicon dioxide etching. Moreover, the optimized recipe has been found to be independent of the sacrificial layer used (amorphous or polycrystalline silicon) and its thickness. Using this recipe, 15.6 µm/min Si underetch rate with high Si: SiO2 selectivity (> 20000: 1) has been obtained. Single-air-gap and double-air-gap parallel-plate MEMS tunable capacitors have been designed, fabricated and characterized in the pF range, from 1 MHz to 13.5 GHz. It has been shown that an optimized design of the suspended membrane and direct symmetrical current feed at both ports can significantly improve the quality factor and increase the self-resonant frequency, pushing it to 12 GHz and beyond. The maximum capacitance tuning range obtained for a single-air-gap capacitor is 29% for a bias voltage of 20 V. The maximum capacitance tuning range obtained for a double-air-gap capacitor is 207% for a bias voltage of 70 V. The post-processing of X-FAB BiCMOS wafers has been successfully demonstrated to fabricate monolithically integrated VCOs with above-IC MEMS LC tank. Comparing a suspended inductor and the X-FAB inductor with the same design, it has been shown that increasing the thickness of the spiral from 2.3 to 4 µm and having the spiral suspended 3 µm above the passivation layers lead to an improvement factor of 2 for the peak quality factor and a shift of the self-resonant frequency beyond 15 GHz. No significant variation on bipolar and MOS transistors characteristics due to the post-processing has been observed and we conclude that the variation due to post-processing is in the same range as the wafer-to-wafer variation. Based on our metal surface micromachining process, coplanar waveguide (CPW) MEMS shunt capacitive switches and variable true-time delay lines (V-TTDLs) have been designed, fabricated and characterized in the 1 - 20 GHz range. A novel MEMS device architecture: the SG-MOSFET, which combines a solid-state MOS transistor and a metal suspended gate has been proposed as DC current switch. The corresponding fabrication process using polysilicon as a sacrificial layer has been developed to release metal gate suspended over gate oxide by SF6 plasma. Very abrupt current switches have been demonstrated with subthreshold slope better than 10 mV/decade (better than the theoretical solid-state bulk or SOI MOSFET limit of 60 mV/decade) and ultra-low gate leakage (less than 0.001 pA/µm2) due to the air-gap

Radiation Tolerant Electronics, Volume II

Research on radiation tolerant electronics has increased rapidly over the last few years, resulting in many interesting approaches to model radiation effects and design radiation hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation hardened electronics for space applications, high-energy physics experiments such as those on the large hadron collider at CERN, and many terrestrial nuclear applications, including nuclear energy and safety management. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their ionizing radiation susceptibility has raised many exciting challenges, which are expected to drive research in the coming decade.After the success of the first Special Issue on Radiation Tolerant Electronics, the current Special Issue features thirteen articles highlighting recent breakthroughs in radiation tolerant integrated circuit design, fault tolerance in FPGAs, radiation effects in semiconductor materials and advanced IC technologies and modelling of radiation effects

Advanced CMOS Integrated Circuit Design and Application

The recent development of various application systems and platforms, such as 5G, B5G, 6G, and IoT, is based on the advancement of CMOS integrated circuit (IC) technology that enables them to implement high-performance chipsets. In addition to development in the traditional fields of analog and digital integrated circuits, the development of CMOS IC design and application in high-power and high-frequency operations, which was previously thought to be possible only with compound semiconductor technology, is a core technology that drives rapid industrial development. This book aims to highlight advances in all aspects of CMOS integrated circuit design and applications without discriminating between different operating frequencies, output powers, and the analog/digital domains. Specific topics in the book include: Next-generation CMOS circuit design and application; CMOS RF/microwave/millimeter-wave/terahertz-wave integrated circuits and systems; CMOS integrated circuits specially used for wireless or wired systems and applications such as converters, sensors, interfaces, frequency synthesizers/generators/rectifiers, and so on; Algorithm and signal-processing methods to improve the performance of CMOS circuits and systems

On the design of ultra low voltage CMOS oscillators.

Wireless sensor nodes require very tight power budgets to operate from either asmall battery, some energy harvesting mechanism or both. In many cases, thermalor electrochemical harvesting devices provide very low voltages of the order of100 mV or even lower. Time-keeping functionality is required in IoT systems andthe time-keeping module must be on at all times. Crystal oscillators have provento be useful for low power time-keeping applications, and in this context supplyvoltage lowering is a convenient strategy. Therefore, 32 kHz crystal oscillatorsoperating with only 60 mV supply are presented. Two implementations based ona Schmitt trigger circuit for two different crystals were designed and experimentallycharacterized.These crystal oscillators are based on the application of a Schmitt trigger asan amplifier. Guidelines for designing this block to be the amplifier of a crystaloscillator are provided. Furthermore, a dynamic model of the Schmitt trigger isproposed and the model results are compared against simulations. The amplifierswere experimentally characterized, providing a gain of 2.48 V/V with a 60 mVpower supply. As it was intended in the design stage, for voltages above 100 mVhysteresis appears and the Schmitt trigger starts operating as a comparator.The Schmitt triggers to operate as amplifiers of the crystal oscillators aredesigned in a 130 nm CMOS process, requiring an area of 45μm x 74μm and78μm x 83μm, respectively. The power consumptions of the crystal oscillators are2.26 nW and 15 nW and the temperature stabilities attained are 62 ppm (25-62°C)and 50 ppm (5-62°C), respectively. The dependence on the supply voltage of thecurrent consumption, fractional frequency, start-up time and oscillation amplitudewere measured. The Allan deviation is 30 ppb for both oscillators.On the other hand, an LC voltage controlled oscillator (VCO) is designed in28 nm FD-SOI for RF applications. The possibility of modeling the transistors inthe 28 nm FD-SOI technology by means of the all inversion region long channelbulk transistor model used for the Schmitt trigger circuits, is studied. A cross-coupled nMOS architecture is used to build the VCO. The theoretical limit for theminimum supply voltage that enables oscillation is studied. The transistors wereoptimally sized to aim the minimum power consumption through a low-voltageapproach and the performance of the VCO was obtained through simulations. Los nodos sensores inalámbricos tienen fuertes requerimientos de bajo consumo demanera de operar con baterías pequeñas o algún mecanismo de cosecha de energía, o ambos. En muchos casos, la cosecha de energía térmica o electroquímica provee tensiones muy bajas del orden de 100 mV o incluso menos. Los sistemas de internet de las cosas incluyen un módulo de reloj que debe estar siempre encendido a efectos de contar el tiempo. Los osciladores a cristal son probadamente ́utiles como relojes de bajo consumo, y en este contexto la reducción de la tensión es una estrategia conveniente. Por lo tanto, presentamos osciladores a cristal de 32 kHz operando con sólo 60 mV de tensión de alimentación. Dos implementaciones, basadas en el circuito Schmitt trigger para dos cristales diferentes, se diseñan y caracterizan experimentalmente.Estos osciladores a cristal están basados en la aplicación del Schmitt trigger como amplificador. Se provee una guía para el diseño de este bloque para funcionar como el amplificador de un oscilador a cristal. Adicionalmente se propone un modelo dinámico del Schmitt trigger y los resultados del modelo son comparados con resultados de simulación. Los amplificadores son caracterizados experimentalmente, proveyendo una ganancia de 2.48 V/V con 60 mV de tensión de alimentación. Tal como se pretende en la etapa de diseño, para tensiones mayores a 100 mV aparece el fenómeno de histéresis y el Schmitt trigger comienza a operarcomo un comparador.Los Schmitt trigger para operar como amplificadores de los osciladores a cristal son diseñados en un proceso CMOS de 130 nm y ocupan un área de 45μm x 74μmy 78μm x 83μm, respectivamente. El consumo de potencia de sendos osciladores es2.26 nW y 15 nW y la estabilidad en temperatura obtenida es de 62 ppm (25-62°C)y 50 ppm (5-62°C), respectivamente. Se midieron la dependencia del consumo de corriente con respecto a la tensión de alimentación, la frequencia de oscilación, eltiempo de arranque y la amplitud de oscilación. La desviación de Allan es 30 ppben ambos osciladores.Por otra parte, un oscilador LC controlado por voltaje es diseñado en un proceso CMOS de silicio sobre aislante en deplexión total de 28 nm, para aplicaciones de radiofrecuencia. Se estudia la posibilidad de utilizar en este caso el mismo modelo utilizado para el diseño del Schmitt trigger. Dicho modelo es válido en todas las regiones de inversión y está desarrollado para transistores de tipo sustrato y de canal largo. La arquitectura de transistores nMOS entrelazados es la utilizada para este oscilador. Se estudia el límite teórico para la mínima tensión de alimentación. Los transistores son dimensionados de manera óptima para obtener el mínimo consumo de potencia posible, utilizando un enfoque de baja tensión y el desempeño del oscilador se obtuvo mediante simulaciones