Addressing Manufacturing Challenges in NoC-based ULSI Designs

Hernández Luz, C. (2012). Addressing Manufacturing Challenges in NoC-based ULSI Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1669

On Fault Resilient Network-on-Chip for Many Core Systems

Rapid scaling of transistor gate sizes has increased the density of on-chip integration and paved the way for heterogeneous many-core systems-on-chip, significantly improving the speed of on-chip processing. The design of the interconnection network of these complex systems is a challenging one and the network-on-chip (NoC) is now the accepted scalable and bandwidth efficient interconnect for multi-processor systems on-chip (MPSoCs). However, the performance enhancements of technology scaling come at the cost of reliability as on-chip components particularly the network-on-chip become increasingly prone to faults. In this thesis, we focus on approaches to deal with the errors caused by such faults. The results of these approaches are obtained not only via time-consuming cycle-accurate simulations but also by analytical approaches, allowing for faster and accurate evaluations, especially for larger networks. Redundancy is the general approach to deal with faults, the mode of which varies according to the type of fault. For the NoC, there exists a classification of faults into transient, intermittent and permanent faults. Transient faults appear randomly for a few cycles and may be caused by the radiation of particles. Intermittent faults are similar to transient faults, however, differing in the fact that they occur repeatedly at the same location, eventually leading to a permanent fault. Permanent faults by definition are caused by wires and transistors being permanently short or open. Generally, spatial redundancy or the use of redundant components is used for dealing with permanent faults. Temporal redundancy deals with failures by re-execution or by retransmission of data while information redundancy adds redundant information to the data packets allowing for error detection and correction. Temporal and information redundancy methods are useful when dealing with transient and intermittent faults. In this dissertation, we begin with permanent faults in NoC in the form of faulty links and routers. Our approach for spatial redundancy adds redundant links in the diagonal direction to the standard rectangular mesh topology resulting in the hexagonal and octagonal NoCs. In addition to redundant links, adaptive routing must be used to bypass faulty components. We develop novel fault-tolerant deadlock-free adaptive routing algorithms for these topologies based on the turn model without the use of virtual channels. Our results show that the hexagonal and octagonal NoCs can tolerate all 2-router and 3-router faults, respectively, while the mesh has been shown to tolerate all 1-router faults. To simplify the restricted-turn selection process for achieving deadlock freedom, we devised an approach based on the channel dependency matrix instead of the state-of-the-art Duato's method of observing the channel dependency graph for cycles. The approach is general and can be used for the turn selection process for any regular topology. We further use algebraic manipulations of the channel dependency matrix to analytically assess the fault resilience of the adaptive routing algorithms when affected by permanent faults. We present and validate this method for the 2D mesh and hexagonal NoC topologies achieving very high accuracy with a maximum error of 1%. The approach is very general and allows for faster evaluations as compared to the generally used cycle-accurate simulations. In comparison, existing works usually assume a limited number of faults to be able to analytically assess the network reliability. We apply the approach to evaluate the fault resilience of larger NoCs demonstrating the usefulness of the approach especially compared to cycle-accurate simulations. Finally, we concentrate on temporal and information redundancy techniques to deal with transient and intermittent faults in the router resulting in the dropping and hence loss of packets. Temporal redundancy is applied in the form of ARQ and retransmission of lost packets. Information redundancy is applied by the generation and transmission of redundant linear combinations of packets known as random linear network coding. We develop an analytic model for flexible evaluation of these approaches to determine the network performance parameters such as residual error rates and increased network load. The analytic model allows to evaluate larger NoCs and different topologies and to investigate the advantage of network coding compared to uncoded transmissions. We further extend the work with a small insight to the problem of secure communication over the NoC. Assuming large heterogeneous MPSoCs with components from third parties, the communication is subject to active attacks in the form of packet modification and drops in the NoC routers. Devising approaches to resolve these issues, we again formulate analytic models for their flexible and accurate evaluations, with a maximum estimation error of 7%

A Comprehensive Study of the Hardware Trojan and Side-Channel Attacks in Three-Dimensional (3D) Integrated Circuits (ICs)

Three-dimensional (3D) integration is emerging as promising techniques for high-performance and low-power integrated circuit (IC, a.k.a. chip) design. As 3D chips require more manufacturing phases than conventional planar ICs, more fabrication foundries are involved in the supply chain of 3D ICs. Due to the globalized semiconductor business model, the extended IC supply chain could incur more security challenges on maintaining the integrity, confidentiality, and reliability of integrated circuits and systems. In this work, we analyze the potential security threats induced by the integration techniques for 3D ICs and propose effective attack detection and mitigation methods. More specifically, we first propose a comprehensive characterization for 3D hardware Trojans in the 3D stacking structure. Practical experiment based quantitative analyses have been performed to assess the impact of 3D Trojans on computing systems. Our analysis shows that advanced attackers could exploit the limitation of the most recent 3D IC testing standard IEEE Standard 1838 to bypass the tier-level testing and successfully implement a powerful TSV-Trojan in 3D chips. We propose an enhancement for IEEE Standard 1838 to facilitate the Trojan detection on two neighboring tiers simultaneously. Next, we develop two 3D Trojan detection methods. The proposed frequency-based Trojan-activity identification (FTAI) method can differentiate the frequency changes induced by Trojans from those caused by process variation noise, outperforming the existing time-domain Trojan detection approaches by 38% in Trojan detection rate. Our invariance checking based Trojan detection method leverages the invariance among the 3D communication infrastructure, 3D network-on-chips (NoCs), to tackle the cross-tier 3D hardware Trojans, achieving a Trojan detection rate of over 94%. Furthermore, this work investigates another type of common security threat, side-channel attacks. We first propose to group the supply voltages of different 3D tiers temporally to drive the crypto unit implemented in 3D ICs such that the noise in power distribution network (PDN) can be induced to obfuscate the original power traces and thus mitigates correlation power analysis (CPA) attacks. Furthermore, we study the side-channel attack on the logic locking mechanism in monolithic 3D ICs and propose a logic-cone conjunction (LCC) method and a configuration guideline for the transistor-level logic locking to strengthen its resilience against CPA attacks

Reconfigurable High Performance Secured NoC Design Using Hierarchical Agent-based Monitoring System

With the rapid increase in demand for high performance computing, there is also a significant growth of data communication that leads to leverage the significance of network on chip. This paper proposes a reconfigurable fault tolerant on chip architecture with hierarchical agent based monitoring system for enhancing the performance of network based multiprocessor system on chip against faulty links and nodes. These distributed agents provide healthy status and congestion information of the network. This status information is used for further packet routing in the network with the help of XY routing algorithm. The functionality of Agent is enhanced not only to work as information provider but also to take decision for packet to either pass or stop to the processing element by setting the firewall in order to provide security. Proposed design provides a better performance and area optimization by avoiding deadlock and live lock as compared to existing approaches over network design

Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Exploration and Design of Power-Efficient Networked Many-Core Systems

Multiprocessing is a promising solution to meet the requirements of near future applications. To get full benefit from parallel processing, a manycore system needs efficient, on-chip communication architecture. Networkon- Chip (NoC) is a general purpose communication concept that offers highthroughput, reduced power consumption, and keeps complexity in check by a regular composition of basic building blocks. This thesis presents power efficient communication approaches for networked many-core systems. We address a range of issues being important for designing power-efficient manycore systems at two different levels: the network-level and the router-level. From the network-level point of view, exploiting state-of-the-art concepts such as Globally Asynchronous Locally Synchronous (GALS), Voltage/ Frequency Island (VFI), and 3D Networks-on-Chip approaches may be a solution to the excessive power consumption demanded by today’s and future many-core systems. To this end, a low-cost 3D NoC architecture, based on high-speed GALS-based vertical channels, is proposed to mitigate high peak temperatures, power densities, and area footprints of vertical interconnects in 3D ICs. To further exploit the beneficial feature of a negligible inter-layer distance of 3D ICs, we propose a novel hybridization scheme for inter-layer communication. In addition, an efficient adaptive routing algorithm is presented which enables congestion-aware and reliable communication for the hybridized NoC architecture. An integrated monitoring and management platform on top of this architecture is also developed in order to implement more scalable power optimization techniques. From the router-level perspective, four design styles for implementing power-efficient reconfigurable interfaces in VFI-based NoC systems are proposed. To enhance the utilization of virtual channel buffers and to manage their power consumption, a partial virtual channel sharing method for NoC routers is devised and implemented. Extensive experiments with synthetic and real benchmarks show significant power savings and mitigated hotspots with similar performance compared to latest NoC architectures. The thesis concludes that careful codesigned elements from different network levels enable considerable power savings for many-core systems.Siirretty Doriast

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

Hardware/Software Co-design for Multicore Architectures

Siirretty Doriast

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects