Modeling of CMOS devices and circuits on flexible ultrathin chips

The field of flexible electronics is rapidly evolving. The ultrathin chips are being used to address the high-performance requirements of many applications. However, simulation and prediction of changes in response of device/circuit due to bending induced stress remains a challenge as of lack of suitable compact models. This makes circuit designing for bendable electronics a difficult task. This paper presents advances in this direction, through compressive and tensile stress studies on transistors and simple circuits such as inverters with different channel lengths and orientations of transistors on ultrathin chips. Different designs of devices and circuits in a standard CMOS 0.18-μm technology were fabricated in two separated chips. The two fabricated chips were thinned down to 20 μm using standard dicing-before-grinding technique steps followed by post-CMOS processing to obtain sufficient bendability (20-mm bending radius, or 0.05% nominal strain). Electrical characterization was performed by packaging the thinned chip on a flexible substrate. Experimental results show change of carrier mobilities in respective transistors, and switching threshold voltage of the inverters during different bending conditions (maximum percentage change of 2% for compressive and 4% for tensile stress). To simulate these changes, a compact model, which is a combination of mathematical equations and extracted parameters from BSIM4, has been developed in Verilog-A and compiled into Cadence Virtuoso environment. The proposed model predicts the mobility variations and threshold voltage in compressive and tensile bending stress conditions and orientations, and shows an agreement with the experimental measurements (1% for compressive and 0.6% for tensile stress mismatch)

Modified Level Restorers Using Current Sink and Current Source Inverter Structures for BBL-PT Full Adder

Full adder is an essential component for the design and development of all types of processors like digital signal processors (DSP), microprocessors etc. In most of these systems adder lies in the critical path that affects the overall speed of the system. So enhancing the performance of the 1-bit full adder cell is a significant goal. In this paper, we proposed two modified level restorers using current sink and current source inverter structures for branch-based logic and pass-transistor (BBL-PT) full adder [1]. In BBL-PT full adder, there lies a drawback i.e. voltage step existence that could be eliminated in the proposed logics by using the current sink inverter and current source inverter structures. The proposed full adders are compared with the two standard and well-known logic styles, i.e. conventional static CMOS logic and Complementary Pass transistor Logic (CPL), demonstrated the good delay performance. The implementation of 8-bit ripple carry adder based on proposed full adders are finally demonstrated. The CPL 8-bit RCA and as well as the proposed ones is having better delay performance than the static CMOS and BBL-PT 8-bit RCA. The performance of the proposed BBL-PT cell with current sink & current source inverter structures are examined using PSPICE and the model parameters of a 0.13 µm CMOS process

Inertial and Degradation Delay Model for CMOS Logic Gates

The authors present the Inertial and Degradation Delay Model (IDDM) for CMOS digital simulation. The model combines the Degradation Delay Model presented in previous papers with a new algorithm to handle the inertial effect, and is able to take account of the propagation and filtering of arbitrarily narrow pulses (glitches, etc.). The model clearly overcomes the limitations of conventional approaches

Design issues in cross-coupled inverter sense amplifier

This paper presents an analytical approach to the design of CMOS cross-coupled inverter sense amplifiers. The effects of the equilibrating transistors and the tail current source on the speed of the sense amplifier are analyzed. An analysis of the offset due to mismatch in various parameters is performed, showing that a complete offset analysis has to account for the cell and bitline structure. A new figure of merit for the offset in the sense amplifier and several new design insights are introduced

Offset-calibration with Time-Domain Comparators Using Inversion-mode Varactors

This paper presents a differential time-domain comparator formed by two voltage controlled delay lines, one per input terminal, and a binary phase detector for comparison solving. The propagation delay through the respective lines can be adjusted with a set of digitally-controlled inversion-mode varactors. These varactors provide tuning capabilities to the comparator; feature which can be exploited for offset calibration. This is demonstrated with the implementation of a differential 10-bit SAR-ADC. The design, fabricated in a 0.18μm CMOS process, includes an automatic mechanism for adjusting the capacitance of the varactors in order to calibrate the offset of the whole converter. Correct functionality was measured in all samples.Ministerio de Economía y Competitividad TEC2016-80923-POffice of Naval Research (USA) N0001414135

Oscillator phase noise: a tutorial

Linear time-invariant (LTI) phase noise theories provide important qualitative design insights but are limited in their quantitative predictive power. Part of the difficulty is that device noise undergoes multiple frequency translations to become oscillator phase noise. A quantitative understanding of this process requires abandoning the principle of time invariance assumed in most older theories of phase noise. Fortunately, the noise-to-phase transfer function of oscillators is still linear, despite the existence of the nonlinearities necessary for amplitude stabilization. In addition to providing a quantitative reconciliation between theory and measurement, the time-varying phase noise model presented in this tutorial identifies the importance of symmetry in suppressing the upconversion of 1/f noise into close-in phase noise, and provides an explicit appreciation of cyclostationary effects and AM-PM conversion. These insights allow a reinterpretation of why the Colpitts oscillator exhibits good performance, and suggest new oscillator topologies. Tuned LC and ring oscillator circuit examples are presented to reinforce the theoretical considerations developed. Simulation issues and the accommodation of amplitude noise are considered in appendixes

End-of-fabrication CMOS process monitor

A set of test 'modules' for verifying the quality of a complementary metal oxide semiconductor (CMOS) process at the end of the wafer fabrication is documented. By electrical testing of specific structures, over thirty parameters are collected characterizing interconnects, dielectrics, contacts, transistors, and inverters. Each test module contains a specification of its purpose, the layout of the test structure, the test procedures, the data reduction algorithms, and exemplary results obtained from 3-, 2-, or 1.6-micrometer CMOS/bulk processes. The document is intended to establish standard process qualification procedures for Application Specific Integrated Circuits (ASIC's)