Predictive Dynamic Thermal and Power Management for Heterogeneous Mobile Platforms

abstract: Heterogeneous multiprocessor systems-on-chip (MPSoCs) powering mobile platforms integrate multiple asymmetric CPU cores, a GPU, and many specialized processors. When the MPSoC operates close to its peak performance, power dissipation easily increases the temperature, hence adversely impacts reliability. Since using a fan is not a viable solution for hand-held devices, there is a strong need for dynamic thermal and power management (DTPM) algorithms that can regulate temperature with minimal performance impact. This abstract presents a DTPM algorithm based on a practical temperature prediction methodology using system identification. The DTPM algorithm dynamically computes a power budget using the predicted temperature, and controls the types and number of active processors as well as their frequencies. Experiments on an octa-core big.LITTLE processor and common Android apps demonstrate that the proposed technique predicts temperature within 3% accuracy, while the DTPM algorithm provides around 6x reduction in temperature variance, and as large as 16% reduction in total platform power compared to using a fan.Dissertation/ThesisMasters Thesis Electrical Engineering 201

Online Thermal Control Methods for Multi-Processor Systems

With technological advances, the number of cores integrated on a chip is increasing. This, in turn is leading to thermal constraints and thermal design challenges. Temperature gradients and hot-spots not only affect the performance of the system, but also lead to unreliable circuit operation and affect the life-time of the chip. Meeting temperature constraints and reducing hot-spots are critical for achieving reliable and efficient operation of complex multi-core systems. In this article we analyze the use of four of the most promising families of online control techniques for thermal management of multi-processors system-on-chip (MPSoC). In particular, in our exploration we aim at achieving an online smooth thermal control action that minimizes the performance loss as well as the computational and hardware overhead of embedding a thermal management system inside the MPSoC. The definition of the optimization problem to tackle in this work considers the thermal profile of the system, its evolution over time and current time-varying workload requirements. Thus, this problem is formulated as a finite-horizon optimal control problem and we analyze the control features of different on-line thermal control approaches. In addition, we implemented the policies on an MPSoC hardware simulation platform and performed experiments on a cycle-accurate model of the 8-core Niagara multi-core architecture using benchmarks ranging from web-accessing to playing multimedia. Results show different trade-offs among the analyzed techniques regarding the thermal profile, the frequency setting, the power consumption and the implementation complexity

MULTI-SCALE SCHEDULING TECHNIQUES FOR SIGNAL PROCESSING SYSTEMS

A variety of hardware platforms for signal processing has emerged, from distributed systems such as Wireless Sensor Networks (WSNs) to parallel systems such as Multicore Programmable Digital Signal Processors (PDSPs), Multicore General Purpose Processors (GPPs), and Graphics Processing Units (GPUs) to heterogeneous combinations of parallel and distributed devices. When a signal processing application is implemented on one of those platforms, the performance critically depends on the scheduling techniques, which in general allocate computation and communication resources for competing processing tasks in the application to optimize performance metrics such as power consumption, throughput, latency, and accuracy. Signal processing systems implemented on such platforms typically involve multiple levels of processing and communication hierarchy, such as network-level, chip-level, and processor-level in a structural context, and application-level, subsystem-level, component-level, and operation- or instruction-level in a behavioral context. In this thesis, we target scheduling issues that carefully address and integrate scheduling considerations at different levels of these structural and behavioral hierarchies. The core contributions of the thesis include the following. Considering both the network-level and chip-level, we have proposed an adaptive scheduling algorithm for wireless sensor networks (WSNs) designed for event detection. Our algorithm exploits discrepancies among the detection accuracy of individual sensors, which are derived from a collaborative training process, to allow each sensor to operate in a more energy efficient manner while the network satisfies given constraints on overall detection accuracy. Considering the chip-level and processor-level, we incorporated both temperature and process variations to develop new scheduling methods for throughput maximization on multicore processors. In particular, we studied how to process a large number of threads with high speed and without violating a given maximum temperature constraint. We targeted our methods to multicore processors in which the cores may operate at different frequencies and different levels of leakage. We develop speed selection and thread assignment schedulers based on the notion of a core's steady state temperature. Considering the application-level, component-level and operation-level, we developed a new dataflow based design flow within the targeted dataflow interchange format (TDIF) design tool. Our new multiprocessor system-on-chip (MPSoC)-oriented design flow, called TDIF-PPG, is geared towards analysis and mapping of embedded DSP applications on MPSoCs. An important feature of TDIF-PPG is its capability to integrate graph level parallelism and actor level parallelism into the application mapping process. Here, graph level parallelism is exposed by the dataflow graph application representation in TDIF, and actor level parallelism is modeled by a novel model for multiprocessor dataflow graph implementation that we call the Parallel Processing Group (PPG) model. Building on the contribution above, we formulated a new type of parallel task scheduling problem called Parallel Actor Scheduling (PAS) for chip-level MPSoC mapping of DSP systems that are represented as synchronous dataflow (SDF) graphs. In contrast to traditional SDF-based scheduling techniques, which focus on exploiting graph level (inter-actor) parallelism, the PAS problem targets the integrated exploitation of both intra- and inter-actor parallelism for platforms in which individual actors can be parallelized across multiple processing units. We address a special case of the PAS problem in which all of the actors in the DSP application or subsystem being optimized can be parallelized. For this special case, we develop and experimentally evaluate a two-phase scheduling framework with three work flows --- particle swarm optimization with a mixed integer programming formulation, particle swarm optimization with a simulated annealing engine, and particle swarm optimization with a fast heuristic based on list scheduling. Then, we extend our scheduling framework to support general PAS problem which considers the actors cannot be parallelized

Improving processor efficiency through thermal modeling and runtime management of hybrid cooling strategies

One of the main challenges in building future high performance systems is the ability to maintain safe on-chip temperatures in presence of high power densities. Handling such high power densities necessitates novel cooling solutions that are significantly more efficient than their existing counterparts. A number of advanced cooling methods have been proposed to address the temperature problem in processors. However, tradeoffs exist between performance, cost, and efficiency of those cooling methods, and these tradeoffs depend on the target system properties. Hence, a single cooling solution satisfying optimum conditions for any arbitrary system does not exist. This thesis claims that in order to reach exascale computing, a dramatic improvement in energy efficiency is needed, and achieving this improvement requires a temperature-centric co-design of the cooling and computing subsystems. Such co-design requires detailed system-level thermal modeling, design-time optimization, and runtime management techniques that are aware of the underlying processor architecture and application requirements. To this end, this thesis first proposes compact thermal modeling methods to characterize the complex thermal behavior of cutting-edge cooling solutions, mainly Phase Change Material (PCM)-based cooling, liquid cooling, and thermoelectric cooling (TEC), as well as hybrid designs involving a combination of these. The proposed models are modular and they enable fast and accurate exploration of a large design space. Comparisons against multi-physics simulations and measurements on testbeds validate the accuracy of our models (resulting in less than 1C error on average) and demonstrate significant reductions in simulation time (up to four orders of magnitude shorter simulation times). This thesis then introduces temperature-aware optimization techniques to maximize energy efficiency of a given system as a whole (including computing and cooling energy). The proposed optimization techniques approach the temperature problem from various angles, tackling major sources of inefficiency. One important angle is to understand the application power and performance characteristics and to design management techniques to match them. For workloads that require short bursts of intense parallel computation, we propose using PCM-based cooling in cooperation with a novel Adaptive Sprinting technique. By tracking the PCM state and incorporating this information during runtime decisions, Adaptive Sprinting utilizes the PCM heat storage capability more efficiently, achieving 29\% performance improvement compared to existing sprinting policies. In addition to the application characteristics, high heterogeneity in on-chip heat distribution is an important factor affecting efficiency. Hot spots occur on different locations of the chip with varying intensities; thus, designing a uniform cooling solution to handle worst-case hot spots significantly reduces the cooling efficiency. The hybrid cooling techniques proposed as part of this thesis address this issue by combining the strengths of different cooling methods and localizing the cooling effort over hot spots. Specifically, the thesis introduces LoCool, a cooling system optimizer that minimizes cooling power under temperature constraints for hybrid-cooled systems using TECs and liquid cooling. Finally, the scope of this work is not limited to existing advanced cooling solutions, but it also extends to emerging technologies and their potential benefits and tradeoffs. One such technology is integrated flow cell array, where fuel cells are pumped through microchannels, providing both cooling and on-chip power generation. This thesis explores a broad range of design parameters including maximum chip temperature, leakage power, and generated power for flow cell arrays in order to maximize the benefits of integrating this technology with computing systems. Through thermal modeling and runtime management techniques, and by exploring the design space of emerging cooling solutions, this thesis provides significant improvements in processor energy efficiency.2018-07-09T00:00:00

Design of Thermal Management Control Policies for Multiprocessors Systems on Chip

The contribution of this thesis is a thorough study of thermal aware policy design for MPSoCs. The study includes the modelling of their thermal behavior as well as the improvement and the definition of new thermal management and balancing policies. The work is structured on three main specific disciplines. The areas of contributions are: modeling, algorithms and system design. This thesis extends the field of modeling by proposing new techniques to represent the thermal behavior of MPSoCs using a mathematical formalization. Heat transfer and modelling of physical properties of MPSoCs have been extensively studied. Special emphasis is given to the way the system cools down (i.e. micro-cooling, natural heat dissipation etc.) and the heat propagates inside the MPSoC. The second contribution of this work is related to policies, which manage MPSoC working frequencies and micro-cooling pumps to satisfy user requirements in the most effective possible way, while consuming the lowest possible amount of resources. Several families of thermal policies algorithms have been studied and analyzed in this work for both 2D and 3D MPSoCs including liquid cooling technologies. The discipline of system design has also been extended during the development of this thesis. Thermal management policies have been implemented in real emulation platforms and contributions in this area are related to the design and implementation of proposed innovations in real MPSoC platforms

A design concept for radiation hardened RADFET readout system for space applications

Instruments for measuring the absorbed dose and dose rate under radiation exposure, known as radiation dosimeters, are indispensable in space missions. They are composed of radiation sensors that generate current or voltage response when exposed to ionizing radiation, and processing electronics for computing the absorbed dose and dose rate. Among a wide range of existing radiation sensors, the Radiation Sensitive Field Effect Transistors (RADFETs) have unique advantages for absorbed dose measurement, and a proven record of successful exploitation in space missions. It has been shown that the RADFETs may be also used for the dose rate monitoring. In that regard, we propose a unique design concept that supports the simultaneous operation of a single RADFET as absorbed dose and dose rate monitor. This enables to reduce the cost of implementation, since the need for other types of radiation sensors can be minimized or eliminated. For processing the RADFET's response we propose a readout system composed of analog signal conditioner (ASC) and a self-adaptive multiprocessing system-on-chip (MPSoC). The soft error rate of MPSoC is monitored in real time with embedded sensors, allowing the autonomous switching between three operating modes (high-performance, de-stress and fault-tolerant), according to the application requirements and radiation conditions

Temperature-Aware Design and Management for 3D Multi-Core Architectures

Vertically-integrated 3D multiprocessors systems-on-chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime performance. However, 3D MPSoCs incur amplified thermal challenges that undermine the corresponding reliability. To address these issues, several advanced cooling technologies, alongside temperature-aware design-time optimizations and run-time management schemes have been proposed. In this monograph, we provide an overall survey on the recent advances in temperature-aware 3D MPSoC considerations. We explore the recent advanced cooling strategies, thermal modeling frameworks, design-time optimizations and run-time thermal management schemes that are primarily targeted for 3D MPSoCs. Our aim of proposing this survey is to provide a global perspective, highlighting the advancements and drawbacks on the recent state-of-the-ar

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

Addressing Manufacturing Challenges in NoC-based ULSI Designs

Hernández Luz, C. (2012). Addressing Manufacturing Challenges in NoC-based ULSI Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1669