Measurements, Models, Systems and Design

531 s.

All-digital self-adaptive PVTA variation aware clock generation system for DFS

An all-digital self-adaptive clock generation system capable of adapt the clock frequency to compensate the effects of PVTA variations on the IC propagation delay and satisfy an externally set propagation length condition is presented. The design uses time-to-digital converters (TDCs) to measure the propagation length and a variable length ring oscillator (VLRO) to synthesize the clock signal. The VLRO naturally adapts its frequency to the PVTA variations suffered by its logic gates while the TDCs are used to track these variations across the chip and modify the VLRO length in order to adapt the clock frequency to them. The system measurements, for a 45nm FPGA, show that it adapts the VLRO length, and therefore the clock frequency, to satisfy the propagation length condition. Measurements also prove the system capabilities to act as a dynamic frequency scaling clock source since the propagation length condition value act as a frequency selection input and a strong linear relation between the input value and the resultant clock period is present.Peer ReviewedPostprint (author’s final draft

Design methodology for smart actuator services for machine tool and machining control and monitoring

This paper presents a methodology to design the services of smart actuators for machine tools. The smart actuators aim at replacing the traditional drives (spindles and feed-drives) and enable to add data processing abilities to implement monitoring and control tasks. Their data processing abilities are also exploited in order to create a new decision level at the machine level. The aim of this decision level is to react to disturbances that the monitoring tasks detect. The cooperation between the computational objects (the smart spindle, the smart feed-drives and the CNC unit) enables to carry out functions for accommodating or adapting to the disturbances. This leads to the extension of the notion of smart actuator with the notion of agent. In order to implement the services of the smart drives, a general design is presented describing the services as well as the behavior of the smart drive according to the object oriented approach. Requirements about the CNC unit are detailed. Eventually, an implementation of the smart drive services that involves a virtual lathe and a virtual turning operation is described. This description is part of the design methodology. Experimental results obtained thanks to the virtual machine are then presented

Architecture of a network-in-the-Loop environment for characterizing AC power system behavior

This paper describes the method by which a large hardware-in-the-loop environment has been realized for three-phase ac power systems. The environment allows an entire laboratory power-network topology (generators, loads, controls, protection devices, and switches) to be placed in the loop of a large power-network simulation. The system is realized by using a realtime power-network simulator, which interacts with the hardware via the indirect control of a large synchronous generator and by measuring currents flowing from its terminals. These measured currents are injected into the simulation via current sources to close the loop. This paper describes the system architecture and, most importantly, the calibration methodologies which have been developed to overcome measurement and loop latencies. In particular, a new "phase advance" calibration removes the requirement to add unwanted components into the simulated network to compensate for loop delay. The results of early commissioning experiments are demonstrated. The present system performance limits under transient conditions (approximately 0.25 Hz/s and 30 V/s to contain peak phase-and voltage-tracking errors within 5. and 1%) are defined mainly by the controllability of the synchronous generator

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Test-Signal Search for Mixed-Signal Cores in a System-on-Chip

The well-known approach towards testing mixed-signal cores is functional testing and basically measuring key parameters of the core. However, especially if performance requirements increase, and embedded cores are considered, functional testing becomes technically and economically less attractive. A more cost-effective approach could be accomplished by a combination of reduced functional tests and added structural tests. In addition, it will also improve the debugging facilities of cores. Basic problem remains the large computational effort for analogue structural testing. In this paper, we introduce the concept of Testability Transfer Function for both analogue as well as digital parts in a mixed-signal core. This opens new possibilities for efficient structural testing of embedded mixed-signal cores, thereby adding to\ud the quality of tests

Efficient DSP and Circuit Architectures for Massive MIMO: State-of-the-Art and Future Directions

Massive MIMO is a compelling wireless access concept that relies on the use of an excess number of base-station antennas, relative to the number of active terminals. This technology is a main component of 5G New Radio (NR) and addresses all important requirements of future wireless standards: a great capacity increase, the support of many simultaneous users, and improvement in energy efficiency. Massive MIMO requires the simultaneous processing of signals from many antenna chains, and computational operations on large matrices. The complexity of the digital processing has been viewed as a fundamental obstacle to the feasibility of Massive MIMO in the past. Recent advances on system-algorithm-hardware co-design have led to extremely energy-efficient implementations. These exploit opportunities in deeply-scaled silicon technologies and perform partly distributed processing to cope with the bottlenecks encountered in the interconnection of many signals. For example, prototype ASIC implementations have demonstrated zero-forcing precoding in real time at a 55 mW power consumption (20 MHz bandwidth, 128 antennas, multiplexing of 8 terminals). Coarse and even error-prone digital processing in the antenna paths permits a reduction of consumption with a factor of 2 to 5. This article summarizes the fundamental technical contributions to efficient digital signal processing for Massive MIMO. The opportunities and constraints on operating on low-complexity RF and analog hardware chains are clarified. It illustrates how terminals can benefit from improved energy efficiency. The status of technology and real-life prototypes discussed. Open challenges and directions for future research are suggested.Comment: submitted to IEEE transactions on signal processin

Time-based, Low-power, Low-offset 5-bit 1 GS/s Flash ADC Design in 65nm CMOS Technology

Low-power, medium resolution, high-speed analog-to-digital converters (ADCs) have always been important block which have abundant applications such as digital signal processors (DSP), imaging sensors, environmental and biomedical monitoring devices. This study presents a low power Flash ADC designed in nanometer complementary metal-oxide semiconductors (CMOS) technology. Time analysis on the output delay of the comparators helps to generate one more bit. The proposed technique reduced the power consumption and chip area substantially in comparison to the previous state-of-the-art work. The proposed ADC was developed in TSMC 65nm CMOS technology. The offset cancellation technique was embedded in the proposed comparator to decrement the static offset of the comparator. Moreover, one more bit was generated without using extra comparators. The proposed ADC achieved 4.1 bits ENOB at input Nyquist frequency. The simulated differential and integral non-linearity static tests were equal to +0.26/-0.17 and +0.22/-0.15, respectively. The ADC consumed 7.7 mW at 1 GHz sampling frequency, achieving 415 fJ/Convstep Figure of Merit (FoM)