Design of energy-efficient high-speed wireline transceiver

Energy efficiency has become the most important performance metric of integrated circuits used in many applications ranging from mobile devices to high-performance processors. The power problem permeates both computing and communication systems alike. Especially in the era of Big Data, continuously growing demand for higher communication bandwidth is driving the need for energy-efficient high-speed I/O serial links. However, the rate at which the energy efficiency of serial links is improving is much slower than the rate at which the required data transfer bandwidth is increasing. This dissertation explores two design approaches for energy-efficient communication systems. The first design approach maximizes the energy efficiency of a transceiver without any performance loss, and as a prototype, a source-synchronous multi-Gb/s transceiver that achieves excellent energy efficiency lower than 0.3pJ/bit is presented. To this end, the proposed transceiver employs aggressive supply voltage scaling, and multiplexed transmitter and receiver synchronized by low-rate multi-phase clocks are adopted to achieve high data rate even at a supply voltage close to the device threshold voltage. Phase spacing errors resulting from device mismatches are corrected using a self-calibration scheme. The proposed phase calibration method uses a single digital delay-locked loop (DLL) for calibrating all the phases, which makes the calibration process insensitive to the supply voltage level. Thanks to this technique, the proposed multi-Gb/s transceiver operates robustly and energy-efficiently at a very low supply voltage. Fabricated in a 65nm CMOS process, the energy efficiency and data rate of the prototype transceiver vary from 0.29pJ/bit to 0.58pJ/bit and 1Gb/s to 6Gb/s, respectively, as the supply voltage is varied from 0.45V to 0.7V. In the second approach, observing that the data traffic in a real system is bursty, a full-rate burst-mode transceiver that achieves rapid on/off operation needed for energy-proportional systems is presented. By injecting input data edges into the oscillator embedded in a classical type-II digital clock and data recovery (CDR) circuit, the proposed receiver achieves instantaneous phase-locking and input jitter filtering simultaneously. In other words, the proposed CDR combines the advantages of conventional feed-forward and feedback architectures to achieve energy-proportional operation. By controlling the number of data edges injected into the oscillator, both the jitter transfer bandwidth and the jitter tolerance corner are accurately controlled. The feedback loop also corrects for any frequency error and helps improve the CDR's immunity to oscillator frequency drift during the power-on and -off states. This also improves the CDR's tolerance to consecutive identical digits present in the input data. Fabricated in a 90nm CMOS process, the prototype receiver instantaneously locks onto the very first data edge and consumes 6.1mW at 2.2Gb/s. Owing to its short power-on time, the overall transceiver's energy efficiency varies only from 5.4pJ/bit to 10.7pJ/bit when the effective data rate is varied from 2.2Gb/s to 0.22Gb/s

저전력, 저면적 유선 송수신기 설계를 위한 회로 기술

학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2016. 8. 정덕균.In this thesis, novel circuit techniques for low-power and area-efficient wireline transceiver, including a phase-locked loop (PLL) based on a two-stage ring oscillator, a scalable voltage-mode transmitter, and a forwarded-clock (FC) receiver based on a delay-locked-loop (DLL) based per-pin deskew, are proposed. At first, a two-stage ring PLL that provides a four-phase, high-speed clock for a quarter-rate TX in order to minimize power consumption is presented. Several analyses and verification techniques, ranging from the clocking architectures for a high-speed TX to oscillation failures in a two-stage ring oscillator, are addressed in this thesis. A tri-state-inverter–based frequency-divider and an AC-coupled clock-buffer are used for high-speed operations with minimal power and area overheads. The proposed PLL fabricated in the 65-nm CMOS technology occupies an active area of 0.009 mm2 with an integrated-RMS-jitter of 414 fs from 10 kHz to 100 MHz while consuming 7.6 mW from a 1.2-V supply at 10 GHz. The resulting figure-of-merit is -238.8 dB, which surpasses that of the state-of-the-art ring-PLLs by 4 dB. Secondly, a voltage-mode (VM) transmitter which offers a wide operation range of 6 to 32 Gb/s, controllable pre-emphasis equalization and output voltage swing without altering output impedance, and a power supply scalability is presented. A quarter-rate clocking architecture is employed in order to maximize the scalability and energy efficiency across the variety of operating conditions. A P-over-N VM driver is used for CMOS compatibility and wide voltage-swing range required for various I/O standards. Two supply regulators calibrate the output impedance of the VM driver across the wide swing and pre-emphasis range. A single phase-locked loop is used to provide a wide frequency range of 1.5-to-8 GHz. The prototype chip is fabricated in 65-nm CMOS technology and occupies active area of 0.48x0.36 mm2. The proposed transmitter achieves 250-to-600-mV single-ended swing and exhibits the energy efficiency of 2.10-to-2.93 pJ/bit across the data rate of 6-to-32 Gb/s. And last, this thesis describes a power and area-efficient FC receiver and includes an analysis of the jitter tolerance of the FC receiver. In the proposed design, jitter tolerance is maximized according to the analysis by employing a DLL-based de-skewing. A sample-swapping bang-bang phase-detector (SS-BBPD) eliminates the stuck locking caused by the finite delay range of the voltage-controlled delay line (VCDL), and also reduces the required delay range of the VCDL by half. The proposed FC receiver is fabricated in 65-nm CMOS technology and occupies an active area of 0.025 mm2. At a data rate of 12.5 Gb/s, the proposed FC receiver exhibits an energy efficiency of 0.36 pJ/bit, and tolerates 1.4-UIpp sinusoidal jitter of 300 MHz.Chapter 1. Introduction 1 1.1. Motivation 1 1.2. Thesis organization 5 Chapter 2. Phase-Locked Loop Based on Two-Stage Ring Oscillator 7 2.1. Overivew 7 2.2. Background and Analysis of a Two-stage Ring Oscillator 11 2.3. Circuit Implementation of The Proposed PLL 25 2.4. Measurement Results 33 Chapter 3. A Scalable Voltage-Mode Transmitter 37 3.1. Overview 37 3.2. Design Considerations on a Scalable Serial Link Transmitter 40 3.3. Circuit Implementation 46 3.4. Measurement Results 56 Chapter 4. Delay-Locked Loop Based Forwarded-Clock Receiver 62 4.1. Overview 62 4.2. Timing and Data Recovery in a Serial Link 65 4.3. DLL-Based Forwarded-Clock Receiver Characteristics 70 4.4. Circuit Implementation 79 4.5. Measurement Results 89 Chapter 5. Conclusion 94 Appendix 96 Appendix A. Design flow to optimize a high-speed ring oscillator 96 Appendix B. Reflection Issues in N-over-N Voltage-Mode Driver 99 Appendix C. Analysis on output swing and power consumption of the P-over-N voltage-mode driver 107 Appendix D. Loop Dynamics of DLL 112 Bibliography 121 Abstract 128Docto

Sincronização em sistemas integrados a alta velocidade

Doutoramento em Engenharia ElectrotécnicaA distribui ção de um sinal relógio, com elevada precisão espacial (baixo skew) e temporal (baixo jitter ), em sistemas sí ncronos de alta velocidade tem-se revelado uma tarefa cada vez mais demorada e complexa devido ao escalonamento da tecnologia. Com a diminuição das dimensões dos dispositivos e a integração crescente de mais funcionalidades nos Circuitos Integrados (CIs), a precisão associada as transições do sinal de relógio tem sido cada vez mais afectada por varia ções de processo, tensão e temperatura. Esta tese aborda o problema da incerteza de rel ogio em CIs de alta velocidade, com o objetivo de determinar os limites do paradigma de desenho sí ncrono. Na prossecu ção deste objectivo principal, esta tese propõe quatro novos modelos de incerteza com âmbitos de aplicação diferentes. O primeiro modelo permite estimar a incerteza introduzida por um inversor est atico CMOS, com base em parâmetros simples e su cientemente gen éricos para que possa ser usado na previsão das limitações temporais de circuitos mais complexos, mesmo na fase inicial do projeto. O segundo modelo, permite estimar a incerteza em repetidores com liga ções RC e assim otimizar o dimensionamento da rede de distribui ção de relógio, com baixo esfor ço computacional. O terceiro modelo permite estimar a acumula ção de incerteza em cascatas de repetidores. Uma vez que este modelo tem em considera ção a correla ção entre fontes de ruí do, e especialmente util para promover t ecnicas de distribui ção de rel ogio e de alimentação que possam minimizar a acumulação de incerteza. O quarto modelo permite estimar a incerteza temporal em sistemas com m ultiplos dom ínios de sincronismo. Este modelo pode ser facilmente incorporado numa ferramenta autom atica para determinar a melhor topologia para uma determinada aplicação ou para avaliar a tolerância do sistema ao ru ído de alimentação. Finalmente, usando os modelos propostos, são discutidas as tendências da precisão de rel ogio. Conclui-se que os limites da precisão do rel ogio são, em ultima an alise, impostos por fontes de varia ção dinâmica que se preveem crescentes na actual l ogica de escalonamento dos dispositivos. Assim sendo, esta tese defende a procura de solu ções em outros ní veis de abstração, que não apenas o ní vel f sico, que possam contribuir para o aumento de desempenho dos CIs e que tenham um menor impacto nos pressupostos do paradigma de desenho sí ncrono.Distributing a the clock simultaneously everywhere (low skew) and periodically everywhere (low jitter) in high-performance Integrated Circuits (ICs) has become an increasingly di cult and time-consuming task, due to technology scaling. As transistor dimensions shrink and more functionality is packed into an IC, clock precision becomes increasingly a ected by Process, Voltage and Temperature (PVT) variations. This thesis addresses the problem of clock uncertainty in high-performance ICs, in order to determine the limits of the synchronous design paradigm. In pursuit of this main goal, this thesis proposes four new uncertainty models, with di erent underlying principles and scopes. The rst model targets uncertainty in static CMOS inverters. The main advantage of this model is that it depends only on parameters that can easily be obtained. Thus, it can provide information on upcoming constraints very early in the design stage. The second model addresses uncertainty in repeaters with RC interconnects, allowing the designer to optimise the repeater's size and spacing, for a given uncertainty budget, with low computational e ort. The third model, can be used to predict jitter accumulation in cascaded repeaters, like clock trees or delay lines. Because it takes into consideration correlations among variability sources, it can also be useful to promote oorplan-based power and clock distribution design in order to minimise jitter accumulation. A fourth model is proposed to analyse uncertainty in systems with multiple synchronous domains. It can be easily incorporated in an automatic tool to determine the best topology for a given application or to evaluate the system's tolerance to power-supply noise. Finally, using the proposed models, this thesis discusses clock precision trends. Results show that limits in clock precision are ultimately imposed by dynamic uncertainty, which is expected to continue increasing with technology scaling. Therefore, it advocates the search for solutions at other abstraction levels, and not only at the physical level, that may increase system performance with a smaller impact on the assumptions behind the synchronous design paradigm

Asynchronous techniques for new generation variation-tolerant FPGA

PhD ThesisThis thesis presents a practical scenario for asynchronous logic implementation that would benefit the modern Field-Programmable Gate Arrays (FPGAs) technology in improving reliability. A method based on Asynchronously-Assisted Logic (AAL) blocks is proposed here in order to provide the right degree of variation tolerance, preserve as much of the traditional FPGAs structure as possible, and make use of asynchrony only when necessary or beneficial for functionality. The newly proposed AAL introduces extra underlying hard-blocks that support asynchronous interaction only when needed and at minimum overhead. This has the potential to avoid the obstacles to the progress of asynchronous designs, particularly in terms of area and power overheads. The proposed approach provides a solution that is complementary to existing variation tolerance techniques such as the late-binding technique, but improves the reliability of the system as well as reducing the design’s margin headroom when implemented on programmable logic devices (PLDs) or FPGAs. The proposed method suggests the deployment of configurable AAL blocks to reinforce only the variation-critical paths (VCPs) with the help of variation maps, rather than re-mapping and re-routing. The layout level results for this method's worst case increase in the CLB’s overall size only of 6.3%. The proposed strategy retains the structure of the global interconnect resources that occupy the lion’s share of the modern FPGA’s soft fabric, and yet permits the dual-rail iv completion-detection (DR-CD) protocol without the need to globally double the interconnect resources. Simulation results of global and interconnect voltage variations demonstrate the robustness of the method

Radiation Hardened by Design Methodologies for Soft-Error Mitigated Digital Architectures

abstract: Digital architectures for data encryption, processing, clock synthesis, data transfer, etc. are susceptible to radiation induced soft errors due to charge collection in complementary metal oxide semiconductor (CMOS) integrated circuits (ICs). Radiation hardening by design (RHBD) techniques such as double modular redundancy (DMR) and triple modular redundancy (TMR) are used for error detection and correction respectively in such architectures. Multiple node charge collection (MNCC) causes domain crossing errors (DCE) which can render the redundancy ineffectual. This dissertation describes techniques to ensure DCE mitigation with statistical confidence for various designs. Both sequential and combinatorial logic are separated using these custom and computer aided design (CAD) methodologies. Radiation vulnerability and design overhead are studied on VLSI sub-systems including an advanced encryption standard (AES) which is DCE mitigated using module level coarse separation on a 90-nm process with 99.999% DCE mitigation. A radiation hardened microprocessor (HERMES2) is implemented in both 90-nm and 55-nm technologies with an interleaved separation methodology with 99.99% DCE mitigation while achieving 4.9% increased cell density, 28.5 % reduced routing and 5.6% reduced power dissipation over the module fences implementation. A DMR register-file (RF) is implemented in 55 nm process and used in the HERMES2 microprocessor. The RF array custom design and the decoders APR designed are explored with a focus on design cycle time. Quality of results (QOR) is studied from power, performance, area and reliability (PPAR) perspective to ascertain the improvement over other design techniques. A radiation hardened all-digital multiplying pulsed digital delay line (DDL) is designed for double data rate (DDR2/3) applications for data eye centering during high speed off-chip data transfer. The effect of noise, radiation particle strikes and statistical variation on the designed DDL are studied in detail. The design achieves the best in class 22.4 ps peak-to-peak jitter, 100-850 MHz range at 14 pJ/cycle energy consumption. Vulnerability of the non-hardened design is characterized and portions of the redundant DDL are separated in custom and auto-place and route (APR). Thus, a range of designs for mission critical applications are implemented using methodologies proposed in this work and their potential PPAR benefits explored in detail.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Within-Die Delay Variation Measurement And Analysis For Emerging Technologies Using An Embedded Test Structure

Both random and systematic within-die process variations (PV) are growing more severe with shrinking geometries and increasing die size. Escalation in the variations in delay and power with reductions in feature size places higher demands on the accuracy of variation models. Their availability can be used to improve yield, and the corresponding profitability and product quality of the fabricated integrated circuits (ICs). Sources of within-die variations include optical source limitations, and layout-based systematic effects (pitch, line-width variability, and microscopic etch loading). Unfortunately, accurate models of within-die PVs are becoming more difficult to derive because of their increasingly sensitivity to design-context. Embedded test structures (ETS) continue to play an important role in the development of models of PVs and as a mechanism to improve correlations between hardware and models. Variations in path delays are increasing with scaling, and are increasingly affected by neighborhood\u27 interactions. In order to fully characterize within-die variations, delays must be measured in the context of actual core-logic macros. Doing so requires the use of an embedded test structure, as opposed to traditional scribe line test structures such as ring oscillators (RO). Accurate measurements of within-die variations can be used, e.g., to better tune models to actual hardware (model-to-hardware correlations). In this research project, I propose an embedded test structure called REBEL (Regional dELay BEhavior) that is designed to measure path delays in a minimally invasive fashion; and its architecture measures the path delays more accurately. Design for manufacture-ability (DFM) analysis is done on the on 90 nm ASIC chips and 28nm Zynq 7000 series FPGA boards. I present ASIC results on within-die path delay variations in a floating-point unit (FPU) fabricated in IBM\u27s 90 nm technology, with 5 pipeline stages, used as a test vehicle in chip experiments carried out at nine different temperature/voltage (TV) corners. Also experimental data has been analyzed for path delay variations in short vs long paths. FPGA results on within-die variation and die-to-die variations on Advanced Encryption System (AES) using single pipelined stage are also presented. Other analysis that have been performed on the calibrated path delays are Flip Flop propagation delays for both rising and falling edge (tpHL and tpLH), uncertainty analysis, path distribution analysis, short versus long path variations and mid-length path within-die variation. I also analyze the impact on delay when the chips are subjected to industrial-level temperature and voltage variations. From the experimental results, it has been established that the proposed REBEL provides capabilities similar to an off-chip logic analyzer, i.e., it is able to capture the temporal behavior of the signal over time, including any static and dynamic hazards that may occur on the tested path. The ASIC results further show that path delays are correlated to the launch-capture (LC) interval used to time them. Therefore, calibration as proposed in this work must be carried out in order to obtain an accurate analysis of within-die variations. Results on ASIC chips show that short paths can vary up to 35% on average, while long paths vary up to 20% at nominal temperature and voltage. A similar trend occurs for within-die variations of mid-length paths where magnitudes reduced to 20% and 5%, respectively. The magnitude of delay variations in both these analyses increase as temperature and voltage are changed to increase performance. The high level of within-die delay variations are undesirable from a design perspective, but they represent a rich source of entropy for applications that make use of \u27secrets\u27 such as authentication, hardware metering and encryption. Physical unclonable functions (PUFs) are a class of primitives that leverage within-die-variations as a means of generating random bit strings for these types of applications, including hardware security and trust. Zynq FPGAs Die-to-Die and within-die variation study shows that on average there is 5% of within-Die variation and the range of die-to-Die variation can go upto 3ns. The die-to-Die variations can be explored in much further detail to study the variations spatial dependance. Additionally, I also carried out research in the area data mining to cater for big data by focusing the work on decision tree classification (DTC) to speed-up the classification step in hardware implementation. For this purpose, I devised a pipelined architecture for the implementation of axis parallel binary decision tree classification for meeting up with the requirements of execution time and minimal resource usage in terms of area. The motivation for this work is that analyzing larger data-sets have created abundant opportunities for algorithmic and architectural developments, and data-mining innovations, thus creating a great demand for faster execution of these algorithms, leading towards improving execution time and resource utilization. Decision trees (DT) have since been implemented in software programs. Though, the software implementation of DTC is highly accurate, the execution times and the resource utilization still require improvement to meet the computational demands in the ever growing industry. On the other hand, hardware implementation of DT has not been thoroughly investigated or reported in detail. Therefore, I propose a hardware acceleration of pipelined architecture that incorporates the parallel approach in acquiring the data by having parallel engines working on different partitions of data independently. Also, each engine is processing the data in a pipelined fashion to utilize the resources more efficiently and reduce the time for processing all the data records/tuples. Experimental results show that our proposed hardware acceleration of classification algorithms has increased throughput, by reducing the number of clock cycles required to process the data and generate the results, and it requires minimal resources hence it is area efficient. This architecture also enables algorithms to scale with increasingly large and complex data sets. We developed the DTC algorithm in detail and explored techniques for adapting it to a hardware implementation successfully. This system is 3.5 times faster than the existing hardware implementation of classification.\u2

Continuous-Time and Companding Digital Signal Processors Using Adaptivity and Asynchronous Techniques

The fully synchronous approach has been the norm for digital signal processors (DSPs) for many decades. Due to its simplicity, the classical DSP structure has been used in many applications. However, due to its rigid discrete-time operation, a classical DSP has limited efficiency or inadequate resolution for some emerging applications, such as processing of multimedia and biological signals. This thesis proposes fundamentally new approaches to designing DSPs, which are different from the classical scheme. The defining characteristic of all new DSPs examined in this thesis is the notion of "adaptivity" or "adaptability." Adaptive DSPs dynamically change their behavior to adjust to some property of their input stream, for example the rate of change of the input. This thesis presents both enhancements to existing adaptive DSPs, as well as new adaptive DSPs. The main class of DSPs that are examined throughout the thesis are continuous-time (CT) DSPs. CT DSPs are clock-less and event-driven; they naturally adapt their activity and power consumption to the rate of their inputs. The absence of a clock also provides a complete avoidance of aliasing in the frequency domain, hence improved signal fidelity. The core of this thesis deals with the complete and systematic design of a truly general-purpose CT DSP. A scalable design methodology for CT DSPs is presented. This leads to the main contribution of this thesis, namely a new CT DSP chip. This chip is the first general-purpose CT DSP chip, able to process many different classes of CT and synchronous signals. The chip has the property of handling various types of signals, i.e. various different digital modulations, both synchronous and asynchronous, without requiring any reconfiguration; such property is presented for the first time CT DSPs and is impossible for classical DSPs. As opposed to previous CT DSPs, which were limited to using only one type of digital format, and whose design was hard to scale for different bandwidths and bit-widths, this chip has a formal, robust and scalable design, due to the systematic usage of asynchronous design techniques. The second contribution of this thesis is a complete methodology to design adaptive delay lines. In particular, it is shown how to make the granularity, i.e. the number of stages, adaptive in a real-time delay line. Adaptive granularity brings about a significant improvement in the line's power consumption, up to 70% as reported by simulations on two design examples. This enhancement can have a direct large power impact on any CT DSP, since a delay line consumes the majority of a CT DSP's power. The robust methodology presented in this thesis allows safe dynamic reconfiguration of the line's granularity, on-the-fly and according to the input traffic. As a final contribution, the thesis also examines two additional DSPs: one operating the CT domain and one using the companding technique. The former operates only on level-crossing samples; the proposed methodology shows a potential for high-quality outputs by using a complex interpolation function. Finally, a companding DSP is presented for MPEG audio. Companding DSPs adapt their dynamic range to the amplitude of their input; the resulting can offer high-quality outputs even for small inputs. By applying companding to MPEG DSPs, it is shown how the DSP distortion can be made almost inaudible, without requiring complex arithmetic hardware

Injection locked ring oscillator design for application in Direct Time of Flight LIDAR

Diplomová práce přibližuje systémy LIDAR přímo měřící čas průletu a časově digitální převodníky určené k použití v těchto systémech. Představuje problematiku distribuce hodinových signálů napříč soubory časově digitálních převodníků v LIDAR systémech a věnuje se jednomu z nových řešení této problematiky, které je založené na injekcí zavěšených oscilátorech. Technika injekčního zavěšení oscilátorů je důkladně matematicky popsána. V programu Matlab byl vytvořen simulační model injekcí zavěšeného kruhového oscilátoru, který potvrzuje správnost uvedených analytických predikcí. Ve výrobní technologii ONK65 byl navržen injekcí zavěšený kruhový oscilátor stabilizovaný pomocí smyčky závěsu zpoždění, určený pro implementaci časově digitálního převodníku pro systém LIDAR. Navržený injekcí zavěšený kruhový oscilátor byl verifikován počítačovými simulacemi zohledňujícími vliv procesních, napěťových i teplotních variací. Oscilátor poskytuje specifikované časové rozlišení 50 pikosekund a dosahuje dvakrát nižší hodnoty fázového neklidu než ekvivalentní volnoběžný oscilátor v dané technologii.The diploma thesis provides an introduction to Direct Time of Flight LIDAR systems and Time to Digital Converters used in these systems. It discusses the problem of clock distribution in LIDAR Time to Digital Converter arrays, and examines one of the possible solutions to this problem based on injection locked oscillators. The injection locking phenomenon is thoroughly mathematically described and a Matlab model of an injection locked ring oscillator is presented, confirming the analytic predictions. In ONK65 processing technology, an injection locked ring oscillator biased by a delay locked loop meant specifically for application in Time to Digital Converters for LIDAR systems has been designed. The designed oscillator has been verified by computer simulations taking process, voltage and temperature variations into account and offers specified time resolution of 50 picosecond as well as two times less clock jitter than an equivalent free-running oscillator in the given processing technology.

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Wireless Testing of Integrated Circuits.

Integrated circuits (ICs) are usually tested during manufacture by means of automatic testing equipment (ATE) employing probe cards and needles that make repeated physical contact with the ICs under test. Such direct-contact probing is very costly and imposes limitations on the use of ATE. For example, the probe needles must be frequently cleaned or replaced, and some emerging technologies such as three-dimensional ICs cannot be probed at all. As an alternative to conventional probe-card testing, wireless testing has been proposed. It mitigates many of the foregoing problems by replacing probe needles and contact points with wireless communication circuits. However, wireless testing also raises new problems which are poorly understood such as: What is the most suitable wireless communication technique to employ, and how well does it work in practice? This dissertation addresses the design and implementation of circuits to support wireless testing of ICs. Various wireless testing methods are investigated and evaluated with respect to their practicality. The research focuses on near-field capacitive communication because of its efficiency over the very short ranges needed during IC manufacture. A new capacitive channel model including chip separation, cross-talk, and misalignment effects is proposed and validated using electro-magnetic simulation studies to provide the intuitions for efficient antenna and circuit design. We propose a compact clock and data recovery architecture to avoid a dedicated clock channel. An analytical model which predicts the DC-level fluctuation due to the capacitive channel is presented. Based on this model, feed-forward clock selection is designed to enhance performance. A method to select proper channel termination is discussed to maximize the channel efficiency for return-to-zero signaling. Two prototype ICs incorporating wireless testing systems were fabricated and tested with the proposed methods of testing digital circuits. Both successfully demonstrated gigahertz communication speeds with a bit-error rate less than 10^−11. A third prototype IC containing analog voltage measurement circuits was implemented to determine the feasibility of wirelessly testing analog circuits. The fabricated prototype achieved satisfactory voltage measurement with 1 mV resolution. Our work demonstrates the validity of the proposed models and the feasibility of near-field capacitive communication for wireless testing of ICs.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/93993/1/duelee_1.pd