Bioengineered Textiles and Nonwovens – the convergence of bio-miniaturisation and electroactive conductive polymers for assistive healthcare, portable power and design-led wearable technology

Today, there is an opportunity to bring together creative design activities to exploit the responsive and adaptive ‘smart’ materials that are a result of rapid development in electro, photo active polymers or OFEDs (organic thin film electronic devices), bio-responsive hydrogels, integrated into MEMS/NEMS devices and systems respectively. Some of these integrated systems are summarised in this paper, highlighting their use to create enhanced functionality in textiles, fabrics and non-woven large area thin films. By understanding the characteristics and properties of OFEDs and bio polymers and how they can be transformed into implementable physical forms, innovative products and services can be developed, with wide implications. The paper outlines some of these opportunities and applications, in particular, an ambient living platform, dealing with human centred needs, of people at work, people at home and people at play. The innovative design affords the accelerated development of intelligent materials (interactive, responsive and adaptive) for a new product & service design landscape, encompassing assistive healthcare (smart bandages and digital theranostics), ambient living, renewable energy (organic PV and solar textiles), interactive consumer products, interactive personal & beauty care (e-Scent) and a more intelligent built environment

Internet of robotic things : converging sensing/actuating, hypoconnectivity, artificial intelligence and IoT Platforms

The Internet of Things (IoT) concept is evolving rapidly and influencing newdevelopments in various application domains, such as the Internet of MobileThings (IoMT), Autonomous Internet of Things (A-IoT), Autonomous Systemof Things (ASoT), Internet of Autonomous Things (IoAT), Internetof Things Clouds (IoT-C) and the Internet of Robotic Things (IoRT) etc.that are progressing/advancing by using IoT technology. The IoT influencerepresents new development and deployment challenges in different areassuch as seamless platform integration, context based cognitive network integration,new mobile sensor/actuator network paradigms, things identification(addressing, naming in IoT) and dynamic things discoverability and manyothers. The IoRT represents new convergence challenges and their need to be addressed, in one side the programmability and the communication ofmultiple heterogeneous mobile/autonomous/robotic things for cooperating,their coordination, configuration, exchange of information, security, safetyand protection. Developments in IoT heterogeneous parallel processing/communication and dynamic systems based on parallelism and concurrencyrequire new ideas for integrating the intelligent “devices”, collaborativerobots (COBOTS), into IoT applications. Dynamic maintainability, selfhealing,self-repair of resources, changing resource state, (re-) configurationand context based IoT systems for service implementation and integrationwith IoT network service composition are of paramount importance whennew “cognitive devices” are becoming active participants in IoT applications.This chapter aims to be an overview of the IoRT concept, technologies,architectures and applications and to provide a comprehensive coverage offuture challenges, developments and applications

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Marshall Space Flight Center Research and Technology Report 2019

Today, our calling to explore is greater than ever before, and here at Marshall Space Flight Centerwe make human deep space exploration possible. A key goal for Artemis is demonstrating and perfecting capabilities on the Moon for technologies needed for humans to get to Mars. This years report features 10 of the Agencys 16 Technology Areas, and I am proud of Marshalls role in creating solutions for so many of these daunting technical challenges. Many of these projects will lead to sustainable in-space architecture for human space exploration that will allow us to travel to the Moon, on to Mars, and beyond. Others are developing new scientific instruments capable of providing an unprecedented glimpse into our universe. NASA has led the charge in space exploration for more than six decades, and through the Artemis program we will help build on our work in low Earth orbit and pave the way to the Moon and Mars. At Marshall, we leverage the skills and interest of the international community to conduct scientific research, develop and demonstrate technology, and train international crews to operate further from Earth for longer periods of time than ever before first at the lunar surface, then on to our next giant leap, human exploration of Mars. While each project in this report seeks to advance new technology and challenge conventions, it is important to recognize the diversity of activities and people supporting our mission. This report not only showcases the Centers capabilities and our partnerships, it also highlights the progress our people have achieved in the past year. These scientists, researchers and innovators are why Marshall and NASA will continue to be a leader in innovation, exploration, and discovery for years to come

Survey of Inter-satellite Communication for Small Satellite Systems: Physical Layer to Network Layer View

Small satellite systems enable whole new class of missions for navigation, communications, remote sensing and scientific research for both civilian and military purposes. As individual spacecraft are limited by the size, mass and power constraints, mass-produced small satellites in large constellations or clusters could be useful in many science missions such as gravity mapping, tracking of forest fires, finding water resources, etc. Constellation of satellites provide improved spatial and temporal resolution of the target. Small satellite constellations contribute innovative applications by replacing a single asset with several very capable spacecraft which opens the door to new applications. With increasing levels of autonomy, there will be a need for remote communication networks to enable communication between spacecraft. These space based networks will need to configure and maintain dynamic routes, manage intermediate nodes, and reconfigure themselves to achieve mission objectives. Hence, inter-satellite communication is a key aspect when satellites fly in formation. In this paper, we present the various researches being conducted in the small satellite community for implementing inter-satellite communications based on the Open System Interconnection (OSI) model. This paper also reviews the various design parameters applicable to the first three layers of the OSI model, i.e., physical, data link and network layer. Based on the survey, we also present a comprehensive list of design parameters useful for achieving inter-satellite communications for multiple small satellite missions. Specific topics include proposed solutions for some of the challenges faced by small satellite systems, enabling operations using a network of small satellites, and some examples of small satellite missions involving formation flying aspects.Comment: 51 pages, 21 Figures, 11 Tables, accepted in IEEE Communications Surveys and Tutorial

Designing a novel virtual collaborative environment to support collaboration in design review meetings

Project review meetings are part of the project management process and are organised to assess progress and resolve any design conflicts to avoid delays in construction. One of the key challenges during a project review meeting is to bring the stakeholders together and use this time effectively to address design issues as quickly as possible. At present, current technology solutions based on BIM or CAD are information-centric and do not allow project teams to collectively explore the design from a range of perspectives and brainstorm ideas when design conflicts are encountered. This paper presents a system architecture that can be used to support multi-functional team collaboration more effectively during such design review meetings. The proposed architecture illustrates how information-centric BIM or CAD systems can be made human- and team-centric to enhance team communication and problem solving. An implementation of the proposed system architecture has been tested for its utility, likability and usefulness during design review meetings. The evaluation results suggest that the collaboration platform has the potential to enhance collaboration among multi-functional teams