Printed dose-recording tag based on organic complementary circuits and ferroelectric nonvolatile memories.

We have demonstrated a printed electronic tag that monitors time-integrated sensor signals and writes to nonvolatile memories for later readout. The tag is additively fabricated on flexible plastic foil and comprises a thermistor divider, complementary organic circuits, and two nonvolatile memory cells. With a supply voltage below 30 V, the threshold temperatures can be tuned between 0 °C and 80 °C. The time-temperature dose measurement is calibrated for minute-scale integration. The two memory bits are sequentially written in a thermometer code to provide an accumulated dose record

System Integration of Flexible and Multifunctional Thin Film Sensors for Structural Health Monitoring

Greater information is needed on the state of civil infrastructure to ensure public safety and cost-efficient management. Lack of infrastructure investment and foreseeable funding challenges mandate a more intelligent approach to future maintenance of infrastructure systems. Much of the technology currently utilized to assess structural performance is based on discrete sensors. While such sensors can provide valuable data, they can lack sufficient resolution to accurately identify damage through inverse methods. Alternatively, technologies have shown promise for distributed, direct damage detection with flexible thin film and multifunctional polymer-nanocomposite materials. However, challenges remain as significant past work has focused on material optimization as opposed to sensing systems for damage detection. This dissertation offers novel methods for direct and distributed strain sensing by providing a fabrication methodology for broadly enabling thin film sensing technologies in structural health monitoring (SHM) applications. This fabrication methodology is presented initially as a set of materials and processes which are illustrated in analog circuit primitive forms including flexible, thin film capacitors, resistors, and inductors. Three sensing systems addressing specific SHM challenges are developed from this base of components and processes as specific illustrations of the broader fabrication approach. The first system developed is a fully integrated strain sensing system designed to enable the use of multifunctional materials in sensing applications. This is achieved through the development of an optimized fabrication approach applicable to many multifunctional materials. A layer-by-layer (LbL) deposited nanocomposite is incorporated with a lithography process to produce a sensing system. To illustrate the process, a strain sensing platform consisting of a nanocomposite film within an amplified Wheatstone bridge circuit is presented. The study reveals the material process is highly repeatable to produce fully integrated strain sensors with high linearity and sensitivity. The thin film strain sensors are robust and are capable of high strain measurements beyond 3,000 μϵ. The second system developed is an array of resistive distributed strain sensors and an associated algorithm to provide an alternative to electrical impedance tomography for spatial strain sensing. An LbL deposited polymer composite thin film is utilized as the piezoresistive sensing material. An inverse algorithm is presented and utilized for determining the resistance of array elements by electrically stimulating boundary nodes. Two polymer nanocomposite arrays are strain tested under cyclic loading. Both arrays functioned as networks of strain sensors confirming the viability of the approach and computational benefits for SHM. The third system developed is a thin film wireless threshold strain sensor for measuring strain in implanted and embedded applications. The wireless sensing system is comprised of two thin film, inductor-capacitor circuits, one of which included a fuse element. The sensor is fabricated on polyimide with metal layers used to pattern inductive antennas and a strain sensitive parallel plate capacitor. A titanium thin film fuse is designed to fail, or have a large resistance increase, when a strain threshold is exceeded. Three prototype systems are interrogated wirelessly while under increasing tensile strain. One of two sensor resonant peaks disappear at a strain threshold as designed, validating the sensing approach and thin film form for use in SHM systems. The fuse approach provides a platform for various systems and sensing elements. The reference peak remains intact and is used for continuous real-time strain sensing with a sensitivity of 0.5 and a noise floor below 50 microstrain.PHDCivil EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/144183/1/arburt_1.pd

Power distribution network inductance calculation, transient current measurement and conductor surface roughness extraction

The first part in the thesis discussed the modeling of the mid-frequency inductance for Zpp type plane pairs in power distribution networks (PDN). It is a key step for the placement of the decoupling capacitors. This paper gives an efficient approach for the calculation of the inductance for different capacitor placements. The PEEC based formulations takes advantage of the opposite currents in the planes. This leads to compute time reductions and memory savings for both the element calculation and the matrix solve step. A formulation is used where placement of capacitors leads to only small changes in the circuit matrix. Comparisons with other models are made to validate our results. In the second part, the application of GMI probe to measure IC switching current. IC switching current is the main noise source of many power integrity issues in printed circuit boards. Accurate measurement of the current waveforms is critical for an effective power distribution network design. In this paper, using a giant magneto-impedance (GMI) probe for this purpose is studied. A side-band detection and demodulation system is built up to measure various time-domain waveforms using an oscilloscope. It is found that the GMI probes are potentially suitable for this kind of time-domain measurements, but probe designs and measurement setups need further improvements for this application. In the third part, the new Sigma rule to evaluate parameters of copper surface roughness in PCB layers is presented. This approach is based on taking SEM images of PCB cross-sections. The approach is automat [sic] zed [sic] by applying image processing tools and Matlab code to evaluate average roughness amplitude and period of roughness function. This information could be used in numerical and analytical modeling, as well as in the DERM method to separate rough conductor loss from dielectric loss --Abstract, page iv

Particle detection experiment for Applications Technology Satellite 1 /ATS-1/ Final report

Applications technology satellite particle detection experiment for measuring energy spectra of earth magnetic fiel