Design And Simulation Of Cmos-Based Bandgap Reference Voltage With Compensation Circuit Using 0.18 Μm Process Technology

Voltage reference circuit is important in electronic world nowadays. A CMOS based bandgap reference (BGR) circuit is preferred due to its size is smaller and consume less power. However, the drawback is the reference voltage variation of CMOS based BGR circuit is big in wide range of temperature, thus the temperature coefficient of it is high. Hence, an improved version of piecewise curvature-corrected Bandgap voltage reference circuit which has low voltage variation in wide range of temperature is introduced in this project to overcome the problem mentioned above. The BGR circuit is designed using CMOS compatible process in 0.18μm CMOS process technology and simulated by using Cadence tool. The proposed piecewise curvature-corrected BGR operate properly with output voltage of 558.6 mV to 558.3 mV by varying the voltage supply 1.4 V to 3.3 V at 27°C and the line regulation is 0.016% . Besides that, the best temperature coefficient obtained is 9.2 ppm/°C in the temperature range of -25°C to 150°C at 1.8 V. The PSSR of the proposed circuit is -69.91 dB at frequency less 10 kHz. The layout design of the proposed circuit is done by using Silterra 0.18 μm standard CMOS process and total die area is 0.0175 mm2 and temperature coefficient obtained in post layout simulation is 11.66ppm/°C. In short, it is found that the proposed design of BGR circuit is able to achieve high temperature range and relatively low voltage variation

A low-power native NMOS-based bandgap reference operating from −55°C to 125°C with Li-Ion battery compatibility

Summary The paper describes the implementation of a bandgap reference based on native-MOSFET transistors for low-power sensor node applications. The circuit can operate from −55°C to 125°C and with a supply voltage ranging from 1.5 to 4.2 V. Therefore, it is compatible with the temperature range of automotive and military-aerospace applications, and for direct Li-Ion battery attach. Moreover, the circuit can operate without any dedicated start-up circuit, thanks to its inherent single operating point. A mathematical model of the reference circuit is presented, allowing simple portability across technology nodes, with current consumption and silicon area as design parameters. Implemented in a 55-nm CMOS technology, the voltage reference achieves a measured average (maximum) temperature coefficient of 28 ppm/°C (43 ppm/°C) and a measured sample-to-sample variation within 57 mV, with a current consumption of 420 nA at 27°C

A simple bandgap reference based on VGO extraction with single-temperature trimming

Bandgap references are widely used in analog and mixed-signal systems to provide temperature-independent voltage or current reference. In traditional bandgap structure, the base-emitter voltage VBE of a diode is used to generate a complementary to absolute temperature (CTAT) voltage, which reduces as temperature increases. The base-emitter voltage difference ∆VBE between two diodes with the same current but different emitter areas supplies a proportional to absolute temperature (PTAT) voltage. With the proper adjustment of the coefficients of VBE and ∆VBE in a voltage summer, the temperature dependency of the summed voltage can be mostly canceled out and the output voltage can achieve a relative temperature-constant property. However, even though the linear terms of temperature-dependent components in PTAT and CTAT expressions can be canceled out, there are still some high order terms left, which still affect temperature dependency. For this reason, a first-order bandgap reference with only PTAT and CTAT linear term compensation cannot achieve a sufficiently low temperature coefficient (TC), normally ranging from 10ppm/°C to over 100ppm/°C. To achieve higher precision and lower TC, the high order terms also need to be considered and compensated by some techniques. This thesis study describes the development of a high order bandgap structure, including the initial thinking, design flow, equation derivation, circuit implementation, and simulation result

128 mA CMOS LDO with 108 db PSRR at 2.4 MHz frequency

A low dropout (LDO) voltage regulator with high power supply rejection ratio (PSRR) and low temperature coefficient (TC) is presented in this paper. Large 1µF off-chip load capacitor is used to achieve the high PSRR. However, this decreases the gain and pushes the LDO’s output pole to lower frequency causing the circuit to become unstable. The proposed LDO uses rail-to-rail folded cascode amplifier to compensate the gain and stability problems. 2nd order curvature characteristic is used in bandgap voltage reference circuit that is applied at the input of the amplifier to minimize the TC. The characteristic is achieved by implementing MOSFET transistors operate in weak and strong inversions. The LDO is designed using 0.18µm CMOS technology and achieves a constant 1.8V output voltage for input voltages from 3.2V to 5V and load current up to a 128mA at temperature between -40°C to 125°C. The proposed LDO is targeted for RF application which has stringent requirement on noise rejection over a broad range of frequency

Integrated Circuits for Programming Flash Memories in Portable Applications

Smart devices such as smart grids, smart home devices, etc. are infrastructure systems that connect the world around us more than before. These devices can communicate with each other and help us manage our environment. This concept is called the Internet of Things (IoT). Not many smart nodes exist that are both low-power and programmable. Floating-gate (FG) transistors could be used to create adaptive sensor nodes by providing programmable bias currents. FG transistors are mostly used in digital applications like Flash memories. However, FG transistors can be used in analog applications, too. Unfortunately, due to the expensive infrastructure required for programming these transistors, they have not been economical to be used in portable applications. In this work, we present low-power approaches to programming FG transistors which make them a good candidate to be employed in future wireless sensor nodes and portable systems. First, we focus on the design of low-power circuits which can be used in programming the FG transistors such as high-voltage charge pumps, low-drop-out regulators, and voltage reference cells. Then, to achieve the goal of reducing the power consumption in programmable sensor nodes and reducing the programming infrastructure, we present a method to program FG transistors using negative voltages. We also present charge-pump structures to generate the necessary negative voltages for programming in this new configuration

A 1.2-V 10- µW NPN-Based Temperature Sensor in 65-nm CMOS With an Inaccuracy of 0.2 °C (3σ) From 70 °C to 125 °C

An NPN-based temperature sensor with digital output transistors has been realized in a 65-nm CMOS process. It achieves a batch-calibrated inaccuracy of ±0.5 ◦C (3¾) and a trimmed inaccuracy of ±0.2 ◦C (3¾) over the temperature range from −70 ◦C to 125 ◦C. This performance is obtained by the use of NPN transistors as sensing elements, the use of dynamic techniques, i.e. correlated double sampling and dynamic element matching, and a single room-temperature trim. The sensor draws 8.3 μA from a 1.2-V supply and occupies an area of 0.1 mm2

Low Power, High PSR CMOS Voltage References

With integration of various functional modules such as radio frequency (RF) circuits, power management, and high frequency digital and analog circuits into one system on chip (SoC) in recent applications, power supply noise can cause significant system performance deterioration. This makes supply noise rejection of the embedded voltage reference crucial in modern SoC applications. Also the use of resistors in bandgap voltage references makes them less suitable for modern low power and portable applications. This thesis introduces two resistorless sub-1 V, all MOSFET references. The goal is to achieve a high power supply rejection (PSR) over a wide bandwidth not achieved in previous works. This high PSR over wide bandwidth is achieved by using a combination of a feedback technique and an innovative compact MOSFET low pass filter. The two references were fabricated in a standard 0.18 µm CMOS process. The first reference uses a composite transistor in subthreshold to produce a proportional-to-absolute temperature (PTAT) voltage which is converted to a current used to thermally compensate the threshold voltage of a MOSFET in saturation. The second references uses dynamic-threshold voltage MOSFET (DTMOS) to produce a PTAT voltage which is converted to a current used to thermally compensate the threshold voltage of a MOSFET in saturation. The measurement shows that both references consumes a sub-1 µW power across their entire operating temperatures. The first reference achieves a PSR better than 50 dB for frequencies of up to 70 MHz and a 20 ppm/°C temperature coefficient (TC) for temperatures from -35 °C — 80 °C. It has a compact area of 0.0180 mm2 and operates on a supply of 1.2 V — 2.3 V. The second reference achieves a PSR better than 50 dB for frequencies of up to 60 MHz. This reference achieves a TC of 9.33 ppm/°C after trimming for temperatures from -30 °C — 110 °C and a line regulation of 0.076 %/V for a step from 0.8 V to 2 V supply voltage with 360 nW power consumption at room temperature. It has a compact area of 0.0143 mm^2

SiC Band Gap Voltage Reference for Space Applications

Electronics for space applications can experience wide temperature swings depending on orientation towards stars and duty cycle of propulsion systems. Energy on satellites primarily comes from radiological thermal generators and / or solar panels. This requires space electronic applications to be energy efficient and have high temperature tolerance. As a result, space electronic systems use high efficiency SMPS [switching mode power supplies]. Currently, there exists SiC [silicon carbide] based electronics that is state of the art for high temperature applications. Commercial manufacturers at this time produce SiC Power MOSFETs [Metal Oxide Semiconductor Field Effect Transistors], which are the switching element of the SMPS. Although many commercial silicon SMPS controller IC’s [Integrated Circuits] are available on the market at this time, there are no SiC SMPS controller IC’s. The scope of this research project was sponsored by NASA which required the design, fabrication, and testing of a single module SiC SMPS controller. A subcomponent of the SMPS design was a BGR [bandgap voltage reference] for the controller. This thesis will cover the theoretical basis of the BGR, the development methods and challenges in the design of a SiC BGR; utilizing a commercial SiC process as a major constraint in the designs. These constraints were partially tackled by using topologies and techniques from the early days of n channel MOSFET based electronics established in the1970’s. The basis of design was models provided by the owner of the process. The BGR was designed with Kuijk BGR topology. These devices are currently being produced in the microelectronics foundry facility since the simulation analysis results have provided promising theoretical data depicting a simulated temperature stability of 16.5 ppm /℃ from 25-160 ℃

Investigation, Analysis and Design of a Sub-Bandgap Voltage Reference for Ultra-Low Voltage Applications

The purpose of this thesis is to study and fully comprehend how to realize a very high performance sub-bandgap (low-voltage) structure. Physics of semiconductor devices has been analyzed before beginning the design of the voltage reference itself. New formulas, as practical as accurate, will be derived. Parallel to this design activity, it was possible to study an already developed sub-bandgap structure, comparing measurements to simulation results. Layout and extracted simulations have also been taken into accoun

Fully Integrated Voltage Reference Circuits

(Doktora) -- İstanbul Teknik Üniversitesi, Fen Bilimleri Enstitüsü, 2014(PhD) -- İstanbul Technical University, Institute of Science and Technology, 2014Gerilim referans devreleri, elektriksel sistemlerde diğer alt blokların çalışmaları için kararlı bir çalışma noktası üretmeleri sebebiyle veri dönüştürücüler (ADC - DAC), frekans sentezleyiciler, DC-DC ve AC-DC dönüştürücüler ve lineer regülatörler gibi pek çok elektriksel sistemin en temel yapı bloklarındandır. İdeal olarak, üretilen bu referans noktası, sıcaklık, üretim süreçleri, besleme gerilim degişimleri ve yükleme etkileri gibi çalışma koşullarından etkilenmemelidir. Bir referans devresinin doğruluğu bahsedilen çalışma koşullarının etkisiyle mutlak değerinden ne kadar saptığı olarak tanımlanır. Modern haberleşme sistemleri ve tüketici ürünlerindeki gelişmeler ile birlikte yüksek entegrasyon ve doğruluklu sistemlere olan talep artmıştır. Tümdevre sistemlerinde, alt blokların çalışma noktalarını belirlemesi nedeniyle özellikle referans devrelerinin performansları bütün sistemin performansının belirlenmesinde önemli rol oynamaktadır. Dolayısıyla yüksek performanslı sistemlere olan talep, bu performansların elde edilmesi için kullanılan düşük geometrili üretim teknolojilerine uygun, yani giderek azalan besleme gerilimleri ile çalışabilecek yüksek doğruluklu referans devrelerine olan talebi de arttırmıştır. Bu nedenle bu çalışmada gerilim referans devre topolojilerine odaklanılmıştır. Bu doğrultuda, öncelikle yüksek doğruluklu, düşük gürültülü gerilim refereans devre topolojileri üzerinde çalışılarak 0.35 um CMOS teknoljisinde farklı tasarımlar yapılmıştır. Bu aşamada temel hedef, yüksek dogrulukluk olarak belirenmiş ve yapılan tasarımlarda, üretim sonrası ayarlamalardan sonra sıcaklık katsayısı 3 ppm/C olabilecek devreler tasarlanmıştır. Ancak, 0.35 um CMOS üretim teknolojisi kullanılması ve kullanılan topolojiler dolayısıyla, devrelerin çalışabileceği minimum besleme gerilim seviyesi 1.8 V ile sınırlı kalmıştır. Devrelerin çektikleri akımlar ise 20-30 uA seviyesindedir. Bu tasarımlar sırasında (triple-well üretim teknlojileri için), önerilen blok gövde izolasyon stratejisi, tasarımı yapılan devrenin gövdesinin tümdevrenin geri kalan kısmından ters kutuplanmış bir jonksiyon diyodu sayesinde izole edilmesine dayanmaktadır ve devrenin gövde gürültüsünden etkilenmesini önemli ölçüde azaltmaktadır. Son olarak, çoğunlukla osilatör devrelerinde uygulanan anahtarlamalı kutuplama tekniği uygulanarak devrelerin düşük frekans gürültü performansının iyileştirilmesi amaçlanmıştır. Çalışmanın geri kalan kısmında, düşük besleme gerilimleriyle çalışabilecek mikron-altı üretim teknolojilerine uygun gerilim referans devre topolojileri üzerine odaklanılmıştır. Bu doğrultuda, iki yeni düşük besleme gerilimli ve düşük güç tüketimli gerilim referans devre topolojisi önerilmiştir. Önerilen topolojiler, 0.18 um CMOS üretim teknolojisinde gerçeklenmiştir. Ölçüm sonuçları, tasarlanan gerilim refarans devrelerinin 0.65 V besleme gerilimi ile çalışabildiğini göstermiştir. Önerilen devre topolojileri ile 0-120 C sıcaklık aralığında, sıcaklık katsayısı 50 ppm/C olan 193 mV seviyesinde referans gerilimleri elde edilmiştir. Devrelerin güç tüketimleri sırasıyla 0.3 uW ve 0.4 uW iken kapladıkları alan 0.2 mm^2 ve 0.08 mm^2 dir. Sonuç olarak, önerilen devre topolojileri ile literatürde yer alan diğer 1V-altı referans devreleri ile karşılatrılabilir seviyede sıcaklık katsayısı olan referans gerilimleri çok daha düşük güç harcamasıyla elde edilmiştir.Voltage references are one of the basic building blocks of many SoCs and mixed-signal ICs such as data converters, voltage regulators and operational amplifiers as they constitute a stable reference voltage for other sub-circuits to generate predictable and repeatable results. Ideally, this reference point should not change with external influences or operating conditions such as temperature, fabrication process variations, power supply variations and transient loading effects. Along with the rapid development of modern communication systems and consumer products, which constitutes the main market for semiconductor industry, the market demand for these System on Chip (SoC) or Mixed Signal ICs to have lower power consumption, higher accuracy and lower cost, and thus, higher integration. Since the performance of the whole system depends strongly to the performance of the reference circuit, this work is focused on fully integrated voltage reference architectures. With this motivation, firstly, different kinds of high precision low noise voltage reference circuits are designed in standard 0.35 um CMOS technology that we have more experience and knowledge of. The essential goal of these studies was high precision and temperature coefficient of the designed voltage reference circuits are on the order of 3 ppm/C with trimming after production. However, since 0.35 um CMOS technology is used in these designs and also due to the chosen topologies their minimum supply voltage can be down to 1.8 V and while current consumption is on the order of 20-30 uA. In the design of the this voltage reference block bulk isolation technique is proposed (for triple-well CMOS processes), in which system blocks are bulk isolated by a reverse biased junction diode from the rest of the die to drastically reduce substrate noise coupling. This is especially important if a very low power voltage reference is designed in a very noisy SoC. Moreover, the switched biasing technique, which is mostly applied to the oscillators, is also implemented to the designed BGR in order to improve the low noise performance of the circuit. The rest of the thesis is focused on new voltage reference topologies that are appropriate for sub-micron technologies operating with low supply voltages. With this motivation two new low voltage and low power voltage reference topologies are proposed. The proposed voltage reference topologies are implemented and fabricated in 0.18 um CMOS technology. Measurement results show that the proposed voltage reference circuits are working properly down to 0.65 V and achieve an output voltage of 193 mV with a temperature coefficient on the order of 50 ppm/C in the temperature range of 0-120C. The total power consumption of the two designed voltage references are 0.3 uW and 0.4 uW at 27 C, while occupying the area of 0.2 mm^2 and 0.08 mm^2, respectively. As a result, the proposed voltage reference topologies generate a reference voltage with comparable level of temperature coefficient and quite low power consumption with respect to the other sub-1V voltage reference circuits reported in the literature.DoktoraPh