2 MeV electron irradiation effects on the electrical characteristics of metal-oxide-silicon capacitors with atomic layer deposited Al<inf>2</inf>O <inf>3</inf>, HfO<inf>2</inf> and nanolaminated dielectrics

The effects of 2 MeV electron irradiation on the electrical characteristics of atomic layer deposited (ALD) high permittivity (high-k) layers of Al 2O3, HfO2 and a nanolaminate of them are evaluated. Metal-oxide-semiconductor capacitors with a nominal dielectric physical thickness of 10 nm were fabricated on different p-type and n-type silicon substrates. The capacitance-voltage (C-V) and current-voltage (I-V) characteristics of the different structures are analyzed as a function of electron irradiation. A progressive negative shift of the C-V characteristics is observed with increasing electron irradiation, indicating the generation of effective positive charges. Similar generation rates for effective trapped charges and interface states are obtained for all the different high-k dielectric layers studied. The hysteresis of the C-V curves after irradiation increases in the case of Al2O3 samples, for HfO 2 decreases while the irradiation has little impact on the hysteresis of the nanolaminate stack. A progressive increase of the leakage current with electron irradiation dose is observed for all the studied dielectrics. The analysis of the current-voltage characteristics measured at different temperatures point to Poole-Frenkel as the dominant conduction mechanism. Under the studied conditions, no impact of electron irradiation fluence on dielectric breakdown voltage has been appreciated. © 2012 Elsevier Ltd. All rights reserved.Peer reviewe

Gamma and proton irradiation effects and thermal stability of electrical characteristics of metal-oxide-silicon capacitors with atomic layer deposited Al<inf>2</inf>O<inf>3</inf> dielectric

The radiation hardness and thermal stability of the electrical characteristics of atomic layer deposited Al2O3 layers to be used as passivation films for silicon radiation detectors with slim edges are investigated. To directly measure the interface charge and to evaluate its change with the ionizing dose, metal-oxide-silicon (MOS) capacitors implementing differently processed Al2O3 layers were fabricated on p-type silicon substrates. Qualitatively similar results are obtained for degradation of capacitance-voltage and current-voltage characteristics under gamma and proton irradiations up to equivalent doses of 30 Mrad and 21.07 Mrad, respectively. While similar negative charge densities are initially extracted for all non-irradiated capacitors, superior radiation hardness is obtained for MOS structures with alumina layers grown with H2O instead of O3 as oxidant precursor. Competing effects between radiation-induced positive charge trapping and hydrogen release from the H2O-grown Al2O3 layers may explain their higher radiation resistance. Finally, irradiated and non-irradiated MOS capacitors with differently processed Al2O3 layers have been subjected to thermal treatments in air at temperatures ranging between 100 °C and 200 °C and the thermal stability of their electrical characteristics has been evaluated. Partial recovery of the gamma-induced degradation has been noticed for O3-grown MOS structures. This can be explained by a trapped holes emission process, for which an activation energy of 1.38 ± 0.15 eV has been extracted.Peer reviewe

Characterization of Heavily Irradiated Dielectrics for Pixel Sensors Coupling Insulator Applications

An increase in the radiation levels during the high-luminosity operation of the Large Hadron Collider calls for the development of silicon-based pixel detectors that are used for particle tracking and vertex reconstruction. Unlike the conventionally used conductively coupled (DC-coupled) detectors that are prone to an increment in leakage currents due to radiation, capacitively coupled (AC-coupled) detectors are anticipated to be in operation in future collider experiments suitable for tracking purposes. The implementation of AC-coupling to micro-scale pixel sensor areas enables one to provide an enhanced isolation of radiation-induced leakage currents. The motivation of this study is the development of new generation capacitively coupled (AC-coupled) pixel sensors with coupling insulators having good dielectric strength and radiation hardness simultaneously. The AC-coupling insulator thin films were aluminum oxide (Al2O3) and hafnium oxide (HfO2) grown by the atomic layer deposition (ALD) method. A comparison study was performed based on the dielectric material used in MOS, MOSFET, and AC-coupled pixel prototypes processed on high resistivity p-type Magnetic Czochralski silicon (MCz-Si) substrates. Post-irradiation studies with 10 MeV protons up to a fluence of 10(15) protons/cm(2) suggest HfO2 to be a better candidate as it provides higher sensitivity with negative charge accumulation on irradiation. Furthermore, even though the nature of the dielectric does not affect the electric field within the AC-coupled pixel sensor, samples with HfO2 are comparatively less susceptible to undergo an early breakdown due to irradiation. Edge-transient current technique (e-TCT) measurements show a prominent double-junction effect as expected in heavily irradiated p-type detectors, in accordance with the simulation studies.Peer reviewe

Defect Induced Aging and Breakdown in High-k Dielectrics

abstract: High-k dielectrics have been employed in the metal-oxide semiconductor field effect transistors (MOSFETs) since 45 nm technology node. In this MOSFET industry, Moore’s law projects the feature size of MOSFET scales half within every 18 months. Such scaling down theory has not only led to the physical limit of manufacturing but also raised the reliability issues in MOSFETs. After the incorporation of HfO2 based high-k dielectrics, the stacked oxides based gate insulator is facing rather challenging reliability issues due to the vulnerable HfO2 layer, ultra-thin interfacial SiO2 layer, and even messy interface between SiO2 and HfO2. Bias temperature instabilities (BTI), hot channel electrons injections (HCI), stress-induced leakage current (SILC), and time dependent dielectric breakdown (TDDB) are the four most prominent reliability challenges impacting the lifetime of the chips under use. In order to fully understand the origins that could potentially challenge the reliability of the MOSFETs the defects induced aging and breakdown of the high-k dielectrics have been profoundly investigated here. BTI aging has been investigated to be related to charging effects from the bulk oxide traps and generations of Si-H bonds related interface traps. CVS and RVS induced dielectric breakdown studies have been performed and investigated. The breakdown process is regarded to be related to oxygen vacancies generations triggered by hot hole injections from anode. Post breakdown conduction study in the RRAM devices have shown irreversible characteristics of the dielectrics, although the resistance could be switched into high resistance state.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Radiation Tolerance and Charge Trapping Enhancement of ALD HfO2/Al2O3 Nanolaminated Dielectrics

High-k dielectric stacks are regarded as a promising information storage media in the Charge Trapping Non-Volatile Memories, which are the most viable alternative to the standard floating gate memory technology. The implementation of high-k materials in real devices requires (among the other investigations) estimation of their radiation hardness. Here we report the effect of gamma radiation (60Co source, doses of 10 and 10 kGy) on dielectric properties, memory windows, leakage currents and retention characteristics of nanolaminated HfO2/Al2O3 stacks obtained by atomic layer deposition and its relationship with post-deposition annealing in oxygen and nitrogen ambient. The results reveal that depending on the dose, either increase or reduction of all kinds of electrically active defects (i.e., initial oxide charge, fast and slow interface states) can be observed. Radiation generates oxide charges with a different sign in O2 and N2 annealed stacks. The results clearly demonstrate a substantial increase in memory windows of the as-grown and oxygen treated stacks resulting from enhancement of the electron trapping. The leakage currents and the retention times of O2 annealed stacks are not deteriorated by irradiation, hence these stacks have high radiation tolerance

Total Ionizing Dose Response of High-k Dielectrics on MOS Devices

As advanced Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) technology continues to minimize the gate oxide thickness, the exponential increase in gate leakage current poses a major challenge for silicon dioxide (SiO2) based devices. In order to reduce the gate leakage current while maintaining the same gate capacitance, alternative gate insulator materials with higher dielectric constant (high-k) became the preferred replacement of SiO2 gate dielectrics. Germanium (Ge) MOSFETs have been regarded as promising candidates for future high-speed applications because they possess higher carrier mobility when compared to silicon based devices. At present, advanced microelectronics devices and circuits are used in aerospace engineering, nuclear industry, and radiotherapy equipment. These applications are unavoidably exposed to space-like radiation, which has a relative low radiation dose rate at 10-2-10-6 rad(Si)/s. For these reasons, it is necessary to understand the low-dose-rate radiation response of high-k materials based on Si and Ge MOS devices. The radiation response of high-k materials such as radiation-induced oxide and interface trap density have been typically examined by carrying out off-site capacitance-voltage (CV) measurements. However, the conventional and off-site radiation response measurements may underestimate the degradation of MOS devices. In this study, a semi-automated laboratory-scale real-time and on-site radiation response testing system was developed to evaluate the radiationresponse. The system is capable of estimating the radiation response of MOS devices whilst the devices are continuously irradiated by -rays raysrays. Moreover, the complete CV characteristics of MOS capacitors were measured in a relatively short time. The pulse CV measurement reduces the impact of charge trapping behavior on the measurement results, when compared to conventional techniques. The total ionizing dose radiation effect on HfO2 dielectric thin films prepared by atomic layer deposition (ALD) has been investigated by the proposed measurement system. The large bidirectional ΔVFB of the irradiated HfO2 capacitor was mainly attributed to the radiation-induced oxide trapped charges, which were not readily compensated by bias-induced charges produced over the measurement timescales of less than 5 ms. Radiation response of Ge MOS capacitors with HfO2 and HfxZr1-xOy gate dielectrics was also investigated. It was found that radiation-induced interface traps were the dominant factor for Flat-band Voltage shift (ΔVFB) in HfO2 thin films, whereas the radiation response for Zr-containing dielectrics under positive bias was mainly affected by oxide traps. Under positive biased irradiation, the Zr-doped HfxZr1-xOy exhibited smaller ΔVFB than that of HfO2. This is attributed to the de-passivation of Ge-S bonds in capacitors incorporating HfO2 thin films, resulting in the build-up of interface traps. Under negative biased irradiation, ΔVFB was attributed to the combined effect of the net oxide trapped charges and the passivation of Ge dangling bonds at the Ge/high-k interface

Atomic layer deposition of high-k dielectric layers on Ge and III-V MOS channels

Ge and III-V semiconductors are potential high performance channel materials for future CMOS devices. In this work, we have studied At. Layer Deposition (ALD) of high-k dielec. layers on Ge and GaAs substrates. We focus at the effect of the oxidant (H2O, O3, O2, O2 plasma) during gate stack formation. GeO2, obtained by Ge oxidn. in O2 or O3, is a promising passivation layer. The germanium oxide thickness can be scaled down below 1 nm, but such thin layers contain Ge in oxidn. states lower than 4+. Still, elec. results indicate that small amts. of Ge in oxidn. states lower than 4+ are not detrimental for device performance. Partial intermixing was obsd. for high-k dielec. and GeO2 or GaAsOx, suggesting possible correlations in the ALD growth mechanisms on Ge and GaAs substrates. [on SciFinder (R)

Study of High-k Dielectrics and their Interfaces on Semiconductors for Device Applications

This thesis has focused on two emerging applications of high-k dielectrics in Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs) and in Metal-InsulatorSemiconductor High Electron Mobility Transistors (MIS-HEMTs). The key aim has been to propose the best routes for passivation of semiconductor/high-k oxide interfaces by investigating the band alignments and interface properties of several oxides, such as Tm2O3, Ta2O5, ZrO2, Al2O3 and MgO, deposited on different semiconductors: Si, Ge, GaN, InGaAs and InGaSb. The electrical characterisation of fabricated MIS capacitor and (MIS)-HEMT devices have also been performed. Thulium silicate (TmSiO) has been identified as a promising candidate for integration as interfacial layer (IL) in HfO2/TiN MOSFETs. The physical properties of Tm2O3/IL/Si interface have been elucidated, where IL (TmSiO) has been formed using different post-deposition annealing (PDA) temperatures, from 550 to 750 °C. It has been found that the best-scaled stack (sub-nm IL) is formed at 550 °C PDA with a graded interface layer and a strong SiOx (Si 3+) component. A large valence band offset (VBO) of 2.8 eV and a large conduction band offset (CBO) of 1.9 eV have been derived for Tm2O3/Si by X-ray photoelectron spectroscopy (XPS) and variable angle spectroscopic ellipsometry. Further increase of device performance can be achieved by replacing Si with GaN for high frequency, high power and high-temperature operation. In this thesis, several GaN cleaning procedures have been considered: 30% NH4OH, 20% (NH4)2S, and 37% HCl. It has been found that the HCl treatment shows the lowest oxygen contamination and Garich surface, and hence has been used prior sputtering of Ta2O5, Al2O3, ZrO2 and MgO on GaN. The large VBOs of 1.1 eV and 1.2 eV have been derived for Al2O3 and MgO on GaN respectively, using XPS and Kraut’s method; the corresponding CBOs are 2.0 eV and 2.8 eV respectively, taking into account the band gaps of Al2O3 (6.5 eV) and MgO (7.4 eV) determined from XPS O 1s electron energy spectra. The lowest leakage currents were obtained for devices with Al2O3 and MgO, i.e. 5.3 ×10-6 A/cm2 and 3.2 ×10-6 A/cm2 at 1 V, respectively in agreement with high band offsets (> 1 eV). Furthermore, the effect of different surface treatments (HCl, O2 plasma and 1-Octadecanethiol (ODT)) prior to atomic layer deposition of Al2O3 on the GaN/AlGaN/GaN heterostructure has been investigated. The MIS-HEMTs fabricated using the low-cost ODT GaN surface treatment have been found to exhibit superior performance for power switching applications such as a low threshold voltage, VT of -12.3 V, hysteresis of 0.12 V, a small subthreshold voltage slope (SS) of 73 mV/dec, and a low density of interface states, Dit of 3.0 x10^12 cm-2eV-1. A comprehensive novel study of HfO2/InGaAs and Al2O3/InGaSb interfaces have also been conducted for use in III-V based MOSFETs. The addition of the plasma H2/TMA/H2 pre-cleaning has been found to be very effective in recovering etch damage on InGaAs, especially for (110) orientation, and led to the improvement of electrical characteristics. Furthermore, the combination of H2 plasma exposure and forming gas anneal yielded significantly improved metrics for Al2O3/InGaSb over the control HCltreated sample, with the 150 W plasma treatment giving both the highest capacitance and the lowest stretch out