SOLUBILITY LIMIT OF DOPANTS IN SILICON IRRADIATED BY RUBY LASER

The solubility of several dopants (Sb, Ga, Bi, In) in laser treated silicon has been investigated. The dopants were introduced by vacuum deposition followed by a ruby laser irradiation. Their solubility was determined by Rutherford backscattering spectrometry measurements in channeling and random conditions. In all cases a solubility limit Cmℓ higher than the equilibrium solubility was found and a simple correlation with the equilibrium distribution coefficient kO could be established : Cmℓ = 8.6 × 1021 k0.51O cm-3

cCAL:Cooperative Computer Assisted Learning

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Roughness and multiscaling of planar crack fronts

We consider numerically the roughness of a planar crack front within the long-range elastic string model, with a tunable disorder correlation length $\xi$. The problem is shown to have two important length scales, $\xi$ and the Larkin length $L_c$. Multiscaling of the crack front is observed for scales below $\xi$, provided that the disorder is strong enough. The asymptotic scaling with a roughness exponent $\zeta \approx 0.39$ is recovered for scales larger than both $\xi$ and $L_c$. If $L_c > \xi$, these regimes are separated by a third regime characterized by the Larkin exponent $\zeta_L \approx 0.5$. We discuss the experimental implications of our results.Comment: 8 pages, two figure

Management of mydriasis and pain in cataract and intraocular lens surgery: review of current medications and future directions

The maintenance of mydriasis and the control of postoperative pain and inflammation are critical to the safety and success of cataract and intraocular lens replacement surgery. Appropriate mydriasis is usually achieved by topical and/or intracameral administration of anticholinergic agents, sympathomimetic agents, or both, with the most commonly used being cyclopentolate, tropicamide, and phenylephrine. Ocular inflammation is common after cataract surgery. Topical steroids and nonsteroidal anti-inflammatory drugs are widely used because they have been proved effective to control postsurgical inflammation and decrease pain. Topical nonsteroidal anti-inflammatory drugs have also been shown to help maintain dilation. However, use of multiple preoperative drops for pupil dilation, inflammation, and pain control have been shown to be time consuming, resulting in delays to the operating room, and they cause dissatisfaction among perioperative personnel; their use can also be associated with systemic side effects. Therefore, ophthalmologists have been in search of new options to streamline this process. This article will review the current medications commonly used for intraoperative mydriasis, as well as pain and inflammation control. In addition, a new combination of ketorolac, an anti-inflammatory agent, and phenylephrine, a mydriatic agent has recently been designed to maintain intraoperative mydriasis and to reduce postoperative pain and irritation from intraocular lens replacement surgery. Two Phase III clinical trials evaluating this combination have demonstrated statistically significant differences when compared to placebo in maintaining intraoperative mydriasis (P<0.00001) and in reducing pain in the early postoperative period (P=0.0002). This medication may be of benefit for use in cataract and lens replacement surgery in the near future

Fracture Roughness Scaling: a case study on planar cracks

Using a multi-resolution technique, we analyze large in-plane fracture fronts moving slowly between two sintered Plexiglas plates. We find that the roughness of the front exhibits two distinct regimes separated by a crossover length scale $\delta^*$. Below $\delta^*$, we observe a multi-affine regime and the measured roughness exponent $\zeta_{\parallel}^{-} = 0.60\pm 0.05$ is in agreement with the coalescence model. Above $\delta^*$, the fronts are mono-affine, characterized by a roughness exponent $\zeta_{\parallel}^{+} = 0.35\pm0.05$, consistent with the fluctuating line model. We relate the crossover length scale to fluctuations in fracture toughness and the stress intensity factor

PULSED ELECTRON BEAM ANNEALING OF As AND B IMPLANTED SILICON

p-type (100) silicon wafers have been implanted either by As or B ions at 20 and 200 keV energies and doses of 1016cm-2. Pulsed electron beam annealing has been performed with fluences of 1.1 and 1.4 J/cm2 using a mean electron energy of 15 keV. The pulse duration was 50 ns. The annealed layers have been investigated by Rutherford backscattering under random and channeling conditions and by S.I.M.S. profiling. Good crystal regrowth and high dopant activation occur in all cases except for the 200 keV Boron implant. Impurities redistribution is observed but no significant segregation effects appear. The experimental profiles are in good agreement with a diffusion model using a modified green function solution and taking into account dopant diffusion in liquid phase and the computed melt front location. The deduced diffusion coefficient are in the 5.10-5cm2/s range for boron and 2.10-4cm2/s range for arsenic