Multiproduct Uniform Polar Quantizer

The aim of this paper is to reduce the complexity of the unrestricted uniform polar quantizer (UUPQ), keeping its high performances. To achieve this, in this paper we propose the multiproduct uniform polar quantizer (MUPQ), where several consecutive magnitude levels are joined in segments and within each segment the uniform product quantization is performed (i.e. all levels within one segments have the same number of phase levels). MUPQ is much simpler for realization than UUPQ, but it achieves similar performances as UUPQ. Since MUPQ has low complexity and achieves much better performances than the scalar uniform quantizer, it can be widely used instead of scalar uniform quantizers to improve performances, for any signal with the Gaussian distribution

Log-Polar Quantizer with the Embedded G.711 Codec

In this paper a new two-dimensional vector quantizer for memoryless Gaussian source, realized in polar coordinates, is proposed. The G.711 codec is embedded in our vector quantizer, and therefore our vector quantizer is compatible with the G.711 codec. It is simple for realization and it has much better performances, compared to the G.711 codec, such as much higher SQNR (signal-to-quantization noise ratio) for the same bit-rate, or bit-rate decrease for the same SQNR. The G.711 codec is widely used in many systems, especially in PSTN (public switched telephone network). Due to compatibility with the G.711 standard, our vector quantizer can be realized with simple software modification of the existing the G.711 codec, and therefore it can be very easily implemented in PSTN and other systems. So, small investments are needed for wide implementation of our model, but significant improvement of performances can be obtained

Design and standalone characterisation of a capacitively coupled HV-CMOS sensor chip for the CLIC vertex detector

The concept of capacitive coupling between sensors and readout chips is under study for the vertex detector at the proposed high-energy CLIC electron positron collider. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is an active High-Voltage CMOS sensor, designed to be capacitively coupled to the CLICpix2 readout chip. The chip is implemented in a commercial $180$ nm HV-CMOS process and contains a matrix of $128\times128$ square pixels with $25$ $\mu$m pitch. First prototypes have been produced with a standard resistivity of $\sim20$ $\Omega$cm for the substrate and tested in standalone mode. The results show a rise time of $\sim20$ ns, charge gain of $190$ mV/ke$^{-}$ and $\sim40$ e$^{-}$ RMS noise for a power consumption of $4.8$ $\mu$W/pixel. The main design aspects, as well as standalone measurement results, are presented.Comment: 13 pages, 13 figures, 2 tables. Work carried out in the framework of the CLICdp collaboratio

Ganglión migratorio tibio-peroneo proximal como causa de parálisis del ciático poplíteo externo

Se present a el caso de un ganglion de la articulación tibio-peronea proximal que se extendió a la musculatura peronea, el nervio peroneo profundo, ligamento lateral externo y menisco externo y ocasionó paresia del ciático poplíteo externo. Tuvo evolución recidivante por lo cual fue intervenido en 4 oportunidades; en la última se realizó una transposición tendinos a por parálisis del nervio peroneo profundo. El paciente evolucionó satisfactoriamente con recuperación de la función y desaparición del dolor. El caso presenta interés ya que ofrece una problemática en cuanto a su origen, presentación clínica, evolución con compromiso neurológico y dificultad en el tratamiento quirúrgico resolutivo.A synovia l cyst attache d t o th e proxima l tibiofibula r join t is described . Th e cyst spreade d int o th e peronea l muscl e group , th e dee p peronea l nerve , th e fibula r collatera l ligamen t an d latera l meniscu s producin g a peronea l nerv e paresis. T h e cyst recurre d an d th e patien t underwen t surger y i n 4 times; i n th e last on e a tendinou s transpositio n wa s performe d t o resolv e a dee p peronea l nerv e paralysis. T h e patien t ha d a goo d evolutio n eit h functio n recover y an d absces e o f pain . Th e cas e illustrate s th e origin , clinica l aspects, evolutio n wit h neuropath y an d difficult sur - gica l resectio n o f this entity

Novel Silicon n-in-p Pixel Sensors for the future ATLAS Upgrades

In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the Inner Detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness, that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 10^16 1-MeV n_eq/cm^2, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4.Comment: Preprint submitted to NIM-A Proceedings (Elba 2012

Union after multiple anterior cervical fusion 21 cases followed for 1-6 years

With a mean follow-up of 3 (1-6) years, we report on 21 patients who underwent multiple level cervical fusion, using autologous iliac crest grafts. Dissectomies were performed in 14 patients and corpectomies in another 7. Instrumentation was used in all patients with corpectomies and in 2 patients who underwent 2-level and 3-level dissectomies. Non-union occurred in 1 patient at 1 level. Graft displacement requiring reoperation was observed in 2 patients with massive corpectomies, in 1 of them as a consequence of trauma. In both patients complete bony fusion was obtained after reoperation and no other complications were observed. We conclude that the success rate with multiple-level fusion is comparable to that of single-level fusion when adequate fixation is achieve

Angioleiomioma de nervio periférico

Se realiza una revisión bibliográfica y se presenta un caso de angioleiomioma localizado en borde cubital de muñeca izquierda, en el ramo dorsal sensitivo del nervio cubital. Este tumor debe ser considerado en el diagnóstico diferencial de los nodulos subcutáneos dolorosos localizados en extremidades. No hemos encontrado descrito este tipo de tumor en un nervio periférico.A cas e of angioleiomyoma on the medial aspec t of the left wrist in the dorsal sensitive branch of the ulnar nerve, and a review of the literatur e are presented. This tumor should be considered in the differential diagnosis of patients who have a painful subcutaneous nodul e at the extremities. Ther e is no report in the literatur e on this type of tumor affecting a peripheral nerve

Prototyping of an HV-CMOS demonstrator for the High Luminosity-LHC upgrade

HV-CMOS sensors can offer important advantages in terms of material budget, granularity and cost for large area tracking systems in high energy physics experiments. This article presents the design and simulated results of an HV-CMOS pixel demonstrator for the High Luminosity-LHC. The pixel demonstrator has been designed in the 0.35 μm HV-CMOS process from ams AG and submitted for fabrication through an engineering run. To improve the response of the sensor, different wafers with moderate to high substrate resistivities are used to fabricate the design. The prototype consists of four large analog and standalone matrices with several pixel flavours, which are all compatible for readout with the FE-I4 ASIC. Details about the matrices and the pixel flavours are provided in this article

Status of a DEPFET pixel system for the ILC vertex detector

We have developed a prototype system for the ILC vertex detector based on DEPFET pixels. The system operates a 128x64 matrix (with ~35x25 square micron large pixels) and uses two dedicated microchips, the SWITCHER II chip for matrix steering and the CURO II chip for readout. The system development has been driven by the final ILC requirements which above all demand a detector thinned to 50 micron and a row wise read out with line rates of 20MHz and more. The targeted noise performance for the DEPFET technology is in the range of ENC=100 e-. The functionality of the system has been demonstrated using different radioactive sources in an energy range from 6 to 40keV. In recent test beam experiments using 6GeV electrons, a signal-to-noise ratio of S/N~120 has been achieved with present sensors being 450 micron thick. For improved DEPFET systems using 50 micron thin sensors in future, a signal-to-noise of 40 is expected.Comment: Invited poster at the International Symposium on the Development of Detectors for Particle, AstroParticle and Synchrotron Radiation Experiments, Stanford CA (SNIC06) 6 pages, 12 eps figure