A classification of finite rank dimension groups by their representations in ordered real vector spaces

Peer reviewedPostprin

Spinal epidural abscess from group A Streptococcus after varicella infection: a case report and review of the literature

Introduction: Spinal epidural abscess (SEA) is a very rare condition in pediatric patients. Varicella zoster infection could be a predisposing factor, and SEA should be suspected in patients with signs of secondary bacterial infection and even mild neurological signs. Clinical case: We describe here a case of a 30-month-old girl with a history of remitting varicella infection, diagnosed for a lumbar epidural abscess and sacro-ileitis, secondary to group A Streptococcus (GAS). Discussion: This is the third case of SEA from GAS reported in the literature in a pediatric population with varicella infection. We discuss here the clinical presentation and the diagnostic challenges for SEA in childhood through a review of the literature

Enhanced piezoelectric properties of PVdF-HFP/PZT nanocomposite for energy harvesting application

The use of piezoelectric nanocomposite in detection and actuation applications for the development of electromechanical microsystems (MEMS) has become quite common over the last decade. In this paper, we present a flexible piezoelectric nanocomposite films, composed of lead zirconate titanate (PZT) nanoparticles, embedded in poly(vinylidene-difluoride hexafluoro propylene) (PVdF-HFP) matrix. Piezoelectric and ferroelectric properties evolution is proportional to the evolution of the crystalline β-phase. The evaluation of the interactions between PZT and PVdF- HFP, performed by Fourier transform infrared spectroscopy (FTIR), revealed a dramatic improvement in these characteristics over pure PVdF-HFP, and attributed to a better crystallinity of the PVdF-HFP matrix and uniform distribution of nanoparticles. These films nanocomposites were done by solvent casting method, with various concentrations of PZT. Results of these experiments indicate that the investigated thin films nanocomposites are appropriate for various applications in energy storage and energy harvesting application

Reliability approach of high density Through Silicon Via (TSV)

ISBN 978-1-4244-8561-1International audienceThis paper focuses on the link between initial electrical resistance of Through Silicon Via (TSV), and possible failure occurring during Thermal Cycling Test (TCT) and electromigration (EM) tests. Physical analyses reveal the presence of a carbon impurity layer at bottom of the higher resistance TSVs. This impurity induces failure during TCT, but has no impact on EM time to failure distribution. We also discuss the relevance of different electrical resistance failure criterions after TCT for a single TSV

Kyste Hydatique Du Rein: A Propos De 49 Cas.

No Abstract. African Journal of Urology Vol. 13 (2) 2007: pp. 157-16

Resistance Increase Due to Electromigration Induced Depletion Under TSV

ISBN 978-1-4244-9111-7International audience3D-IC integration using Through Silicon Via (TSV) is becoming an alternative to overcome obstacles of CMOS scaling. As TSV processes reach maturity, reliability investigation becomes critical. To the best of our knowledge, we propose for the first time an analytical model of resistance increase due to electromigration induced voiding in a line ended by a TSV

Better than RECIST and faster than iRECIST: Defining the immunotherapy progression decision score to better manage progressive tumors on immunotherapy

International audienc

Solid phase epitaxy process integration on 50-nm PMOS devices: Effects of defects on chemical and electrical characteristics of ultra shallow junctions

International audienceWe demonstrate in this paper the viability of an ultra-low thermal budget CMOS process enabling the formation of ultra shallow junctions with competitive transistor characteristics. In particular, we demonstrate in this work the influence of defects on chemical and electrical results. It is shown that the use of self-amorphizing implantation with BF2 for Source/Drain, reduces the junction leakage by two decades

Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs

International audienc

« Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs”

International audienc