Bistable Gestalts reduce activity in the whole of V1, not just the retinotopically predicted parts

Activity in the primary visual cortex reduces when certain stimuli can be perceptually organized as a unified Gestalt. This reduction could offer important insights into the nature of feedback computations within the human visual system; however, the properties of this response reduction have not yet been investigated in detail. Here we replicate this reduced V1 response, but find that the modulation in V1 (and V2) to the perceived organization of the input is not specific to the retinotopic location at which the sensory input from that stimulus is represented. Instead, we find a response modulation that is equally evident across the primary visual cortex. Thus in contradiction to some models of hierarchical predictive coding, the perception of an organized Gestalt causes a broad feedback effect that does not act specifically on the part of the retinotopic map representing the sensory input

Krüppel-like factors in cancer progression: three fingers on the steering wheel

Kruppel-like factors (KLFs) comprise a highly conserved family of zinc finger transcription factors, that are involved in a plethora of cellular processes, ranging from proliferation and apoptosis to differentiation, migration and pluripotency. During the last few years, evidence on their role and deregulation in different human cancers has been emerging. This review will discuss current knowledge on Kruppel-like transcription in the epithelial-mesenchymal transition (EMT), invasion and metastasis, with a focus on epithelial cancer biology and the extensive interface with pluripotency. Furthermore, as KLFs are able to mediate different outcomes, important influences of the cellular and microenvironmental context will be highlighted. Finally, we attempt to integrate diverse findings on KLF functions in EMT and stem cell biology to fit in the current model of cellular plasticity as a tool for successful metastatic dissemination

Introduction of a pseudo-6th order ISDN splitter with bandstop topology

A newly developed ‘integrated services digital network’ (ISDN) splitter with bandstop (BS) topology is presented and compared to an actual ISDN splitter with a traditional lowpass (LP) topology. The LP-to-BS topology change reduced the amount of filter stages: a LP ISDN splitter requires an 8th order elliptic-like filter in order to be compliant to the standard ‘TS 101 952-1-4 V1.1.1’ [1] of the European Telecommunications Standards Institute (ETSI), whereas the BS ISDN splitter only needs a pseudo-6th order elliptic-like filter. The design of the new BS ISDN filter is discussed in the light of the enforced ETSI specifications. Furthermore, both the ISDN splitters are compared in the field of their specific stopband performance and their physical implementation. The area reduction that comes together with the introduction of the new ISDN splitter with BS topology is more than 25%

Accelerated hermeticity testing of biocompatible moisture barriers used for the encapsulation of implantable medical devices

Barrier layers for the long-term encapsulation of implantable medical devices play a crucial role in the devices’ performance and reliability. Typically, to understand the stability and predict the lifetime of barriers (therefore, the implantable devices), the device is subjected to accelerated testing at higher temperatures compared to its service parameters. Nevertheless, at high temperatures, reaction and degradation mechanisms might be different, resulting in false accelerated test results. In this study, the maximum valid temperatures for the accelerated testing of two barrier layers were investigated: atomic layer deposited (ALD) Al2O3 and stacked ALD HfO2/Al2O3/HfO2, hereinafter referred to as ALD-3. The in-house developed standard barrier performance test is based on continuous electrical resistance monitoring and microscopic inspection of Cu patterns covered with the barrier and immersed in phosphate buffered saline (PBS) at temperatures up to 95 °C. The results demonstrate the valid temperature window to perform temperature acceleration tests. In addition, the optimized ALD layer in combination with polyimide (polyimide/ALD-3/polyimide) works as effective barrier at 60 °C for 1215 days, suggesting the potential applicability to the encapsulation of long-term implants

Ultra-long-term reliable encapsulation using an atomic layer deposited Hfo2/Al2o3/Hfo2 triple-interlayer for biomedical implants

Long-term packaging of miniaturized, flexible implantable medical devices is essential for the next generation of medical devices. Polymer materials that are biocompatible and flexible have attracted extensive interest for the packaging of implantable medical devices, however realizing these devices with long-term hermeticity up to several years remains a great challenge. Here, polyimide (PI) based hermetic encapsulation was greatly improved by atomic layer deposition (ALD) of a nanoscale-thin, biocompatible sandwich stack of HfO2/Al2O3/HfO2 (ALD-3) between two polyimide layers. A thin copper film covered with a PI/ALD-3/PI barrier maintained excellent electrochemical performance over 1028 days (2.8 years) during acceleration tests at 60 °C in phosphate buffered saline solution (PBS). This stability is equivalent to approximately 14 years at 37 °C. The coatings were monitored in situ through electrochemical impedance spectroscopy (EIS), were inspected by microscope, and were further analyzed using equivalent circuit modeling. The failure mode of ALD Al2O3, ALD-3, and PI soaking in PBS is discussed. Encapsulation using ultrathin ALD-3 combined with PI for the packaging of implantable medical devices is robust at the acceleration temperature condition for more than 2.8 years, showing that it has great potential as reliable packaging for long-term implantable devices

Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system

A comfortable, wearable wireless ECG monitoring system is proposed. The device is realized using the combination of two proprietary advanced technologies for electronic packaging and interconnection : the UTCP (Ultra-Thin Chip Package) technology and the SMI (Stretchable Mould Interconnect) technology for elastic and stretchable circuits. Introduction of these technologies results in small fully functional devices, exhibiting a significant increase in user comfort compared to devices fabricated with more conventional packaging and interconnection technologies

Unprecedented C-selective interstrand cross-linking through in situ oxidation of Furan-Modified Oligodeoxynucleotides

Chemical reagents that form interstrand cross-links have been used for a long time in cancer therapy. They covalently link two strands of DNA, thereby blocking transcription. Cross-link repair enzymes, however, can restore the transcription processes, causing resistance to certain anti-cancer drugs. The mechanism of these cross-link repair processes has not yet been fully revealed. One of the obstacles in this study is the lack of sufficient amounts of well-defined, stable, cross-linked duplexes to study the pathways of cross-link repair enzymes. Our group has developed a cross-link strategy where a furan moiety is incorporated into oligodeoxynucleotides (ODNs). These furan-modified nucleic acids can form interstrand cross-links upon selective furan oxidation with N-bromosuccinimide. We here report on the incorporation of the furan moiety at the 2'-position of a uridine through an amido or ureido linker. The resulting modified ODNs display an unprecedented selectivity for cross-linking toward a cytidine opposite the modified residue, forming one specific cross-linked duplex, which could be isolated in good yield. Furthermore, the structure of the formed cross-linked duplexes could be unambiguously characterized

Parylene C for hermetic and flexible encapsulation of interconnects and electronic components

Flexible electronics are of a great interest for wearable and implantable medical devices due to their conformality with the body, compared to electronics made on rigid carriers. Packaging of such electronics needs to offer sufficient flexibility and in addition, has to provide good protection for the electronics inside, also in humid and harsh environments, to prevent device failure due to corrosion. Parylene C is a popular polymer due to its interesting diffusion barrier properties. Parylene C coatings are also extremely conformal, hence it offers the possibility to be used as flexibleprotecting encapsulation for electronic components and interconnects. In order to provide sufficient mechanical support for the electronic circuit, a second encapsulation in PDMS will be performed. In our work, we study the barrier properties of Parylene for long time exposure to moisture and biofluids. Since adhesion is a very important parameter to prevent corrosion, this property is studied in detail. Various substrates and various adhesion promotion treatments are evaluated. Furthermore, copper interconnects coated with parylene C are immersed in biofluids at 37 C to study corrosion. Accelerated testing is also performed at 70 C to mimic long time exposure in a harsh, humid environment. Since the Parylene barrier layers are typically 5-15 micron thick, they are highly flexible, and hence they are interesting barriers to be used in flexible/stretchable electronics. Therefore, special attention is given to the evaluation of barrier properties when Parylene is bended and stretched

Direct Methods in High Resolution Electron Microscopy

New approaches are proposed to retrieve the wavefunction at the object and from this, to retrieve the projected structure of the object. The wavefunction is retrieved by capturing images at a series of closely spaced focus values and to process the whole 3D data. The structure of the object is retrieved using a formalism based on electron channelling