Magnetic superlens-enhanced inductive coupling for wireless power transfer

We investigate numerically the use of a negative-permeability "perfect lens" for enhancing wireless power transfer between two current carrying coils. The negative permeability slab serves to focus the flux generated in the source coil to the receiver coil, thereby increasing the mutual inductive coupling between the coils. The numerical model is compared with an analytical theory that treats the coils as point dipoles separated by an infinite planar layer of magnetic material [Urzhumov et al., Phys. Rev. B, 19, 8312 (2011)]. In the limit of vanishingly small radius of the coils, and large width of the metamaterial slab, the numerical simulations are in excellent agreement with the analytical model. Both the idealized analytical and realistic numerical models predict similar trends with respect to metamaterial loss and anisotropy. Applying the numerical models, we further analyze the impact of finite coil size and finite width of the slab. We find that, even for these less idealized geometries, the presence of the magnetic slab greatly enhances the coupling between the two coils, including cases where significant loss is present in the slab. We therefore conclude that the integration of a metamaterial slab into a wireless power transfer system holds promise for increasing the overall system performance

Pregled stanja u području bezkontaktnog prijenosa električne energije: primjene, izazovi i trendovi

Methods of contactless electrical power transfer technologies have been surveyed and results are presented here. In this among, the inductive based contactless electrical power transfer systems are investigated in more detail. The principles, structures and operations of the systems as well as their methods presented in the literature are reviewed and their applications are explored. Also, current challenges and opportunities and future trends are noted. An effective index is proposed to compare different contactless power transfer systems describing their present statuses and the future trends. Finally, some remarks and recommendations regarding future studies are proposed.U radu je dan prikaz različitih tehnologija u području bezkontaktnog prijenosa električne energije. U radu je naglasak na indukcijom baziranim sustavima bezkontaktnog prijenosa električne energije. Pregledom literature utvrðeni su koncepti, strukture i način rada pojedinih sustava bezkonaktnog prijenosa kao i njihove primjene. Također, zabilježeni su trenutni izazovi, prilike i trendovi. Predložen je efektivni indeks za vrednovanje sustava bezkontaktnog prijenosa električne energije s ciljem komparativne analize različitih sustava opisanih trenutnim statusom i trendovima. Konačno, dan je kritički osvrt i predložene su preporuke za buduće studije

A review on wireless power transfer: Concepts, implementations, challenges, and mitigation scheme

This paper reviews the current strides in the wireless power transfer (WPT) system. The paper discusses the classification of wireless power transfer, its application, trend and impact on society, advantages as well as disadvantages. It also presents a comparative analysis of existing work done by researchers in the field of wireless power transfer showing the shortcomings in various topologies, communication, and optimization methods used to increase the overall performance efficiency and proffer direction for further studies. Keywords: wireless power transfer, application, advantages, disadvantages topologies, communication, optimization, efficienc

Contactless Test Access Mechanism for 3D IC

3D IC integration presents many advantages over the current 2D IC integration. It has the potential to reduce the power consumption and the physical size while supporting higher bandwidth and processing speed. Through Silicon Via’s (TSVs) are vertical interconnects between different layers of 3D ICs with a typical 5μm diameter and 50μm length. To test a 3D IC, an access mechanism is needed to apply test vectors to TSVs and observe their responses. However, TSVs are too small for access by current wafer probes and direct TSV probing may affect their physical integrity. In addition, the probe needles for direct TSV probing must be cleaned or replaced frequently. Contactless probing method resolves most of the TSV probing problems and can be employed for small-pitch TSVs. In this dissertation, contactless test access mechanisms for 3D IC have been explored using capacitive and inductive coupling techniques. Circuit models for capacitive and inductive communication links are extracted using 3D full-wave simulations and then circuit level simulations are carried out using Advanced Design System (ADS) design environment to verify the results. The effects of cross-talk and misalignment on the communication link have been investigated. A contactless TSV probing method using capacitive coupling is proposed and simulated. A prototype was fabricated using TSMC 65nm CMOS technology to verify the proposed method. The measurement results on the fabricated prototype show that this TSV probing scheme presents -55dB insertion loss at 1GHz frequency and maintains higher than 35dB signal-to-noise ratio within 5µm distance. A microscale contactless probe based on the principle of resonant inductive coupling has also been designed and simulated. Experimental measurements on a prototype fabricated in TSMC 65nm CMOS technology indicate that the data signal on the TSV can be reconstructed when the distance between the TSV and the probe remains less than 15µm

A Novel Power-Efficient Wireless Multi-channel Recording System for the Telemonitoring of Electroencephalography (EEG)

This research introduces the development of a novel EEG recording system that is modular, batteryless, and wireless (untethered) with the supporting theoretical foundation in wireless communications and related design elements and circuitry. Its modular construct overcomes the EEG scaling problem and makes it easier for reconfiguring the hardware design in terms of the number and placement of electrodes and type of standard EEG system contemplated for use. In this development, portability, lightweight, and applicability to other clinical applications that rely on EEG data are sought. Due to printer tolerance, the 3D printed cap consists of 61 electrode placements. This recording capacity can however extend from 21 (as in the international 10-20 systems) up to 61 EEG channels at sample rates ranging from 250 to 1000 Hz and the transfer of the raw EEG signal using a standard allocated frequency as a data carrier. The main objectives of this dissertation are to (1) eliminate the need for heavy mounted batteries, (2) overcome the requirement for bulky power systems, and (3) avoid the use of data cables to untether the EEG system from the subject for a more practical and less restrictive setting. Unpredictability and temporal variations of the EEG input make developing a battery-free and cable-free EEG reading device challenging. Professional high-quality and high-resolution analog front ends are required to capture non-stationary EEG signals at microvolt levels. The primary components of the proposed setup are the wireless power transmission unit, which consists of a power amplifier, highly efficient resonant-inductive link, rectification, regulation, and power management units, as well as the analog front end, which consists of an analog to digital converter, pre-amplification unit, filtering unit, host microprocessor, and the wireless communication unit. These must all be compatible with the rest of the system and must use the least amount of power possible while minimizing the presence of noise and the attenuation of the recorded signal A highly efficient resonant-inductive coupling link is developed to decrease power transmission dissipation. Magnetized materials were utilized to steer electromagnetic flux and decrease route and medium loss while transmitting the required energy with low dissipation. Signal pre-amplification is handled by the front-end active electrodes. Standard bio-amplifier design approaches are combined to accomplish this purpose, and a thorough investigation of the optimum ADC, microcontroller, and transceiver units has been carried out. We can minimize overall system weight and power consumption by employing battery-less and cable-free EEG readout system designs, consequently giving patients more comfort and freedom of movement. Similarly, the solutions are designed to match the performance of medical-grade equipment. The captured electrical impulses using the proposed setup can be stored for various uses, including classification, prediction, 3D source localization, and for monitoring and diagnosing different brain disorders. All the proposed designs and supporting mathematical derivations were validated through empirical and software-simulated experiments. Many of the proposed designs, including the 3D head cap, the wireless power transmission unit, and the pre-amplification unit, are already fabricated, and the schematic circuits and simulation results were based on Spice, Altium, and high-frequency structure simulator (HFSS) software. The fully integrated head cap to be fabricated would require embedding the active electrodes into the 3D headset and applying current technological advances to miniaturize some of the design elements developed in this dissertation

Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed

Expand Energy Over Distance Via Sensor-based Radio Frequency Identification(RFID) Technology

Although coexistent, we have persistent in progressing the technology (constructing a wireless- communication technology ) for better enrichments in time ahead, We want draw to your attention to wireless biosensors because the development of Wireless Biosensor is essential for our studies and practical knowledge (or application) in different area like medical diagnostic, research, defence and ecological monitoring etc, it’s enormously complex and careful detection for application (like food detection, humidity, bacteria growth etc). Our motive is to focus on Expand Communication Performance or Range. Apparently, measure Resonance frequency and Quality factor(Q- factor) rather than sensing system. Display the specific resonance frequency in which the extensible system will execute this is significant throughout the manufacturing development to the function of communication and gauging the High-Quality factor(Q-factor) for robust system procedure. Further how to expand RFID Distance Read Range and a major task to integrate RFID into biosensors for construction of wireless biosensors. In the market different types of battery-free wireless biosensors (like magnetoelastic biosensors, acoustic wave-based biosensors, self-powered biosensors, and potentiostat biosensors) are available but our emphasis is on RFID-based biosensors because it is cost- effective and companionable with mass production and probable with variant configuration in the upcoming time

A development of class e converter circuit for loosely coupled inductive power transfer system

This paper presents an Inductive Power Transfer (IPT) system design using a Class E converter circuit. The Class E converter is used to drive a nonlinear load and theoretically it offers 100% efficiency. To be specifically, the performance of IPT system at 1MHz operating frequency and 9V DC supply voltage is analyzed. Voltage doubler rectifier and Darlington circuit are proposed in this paper to maximize output power. Moreover, to ensure the resonant inductive coupling in IPT system,capacitor compensation is also proposed in this work. Based on the experimental results, the output power with the capacitor compensation circuit is 1.6W at 15 mm air gap distance is better than the circuit without a capacitor compensation

Multiple Output Power Supply using Toroidal Transformers for Medium Voltage Active Gate Drivers

When operating in high power applications, power devices dissipate tens or hundreds of watts of power in the form of heat. The ability of the power devices to withstand power and dissipation of heat across the power devices becomes a prominent requirement in designing the power converter. This challenge demands a power converter design to be more effective and consistent which factors in size, cost, weight, power density and reliability. This study aims to propose a gate driver isolated power supply design that can be used in medium voltage applications (e.g., up to 10 kV) while respecting the principle of scalability. A versatile design that facilitates addition of another power switch to the converter if needed, without having to alter too many power supply components while retaining the main structure, thus reducing system complexity and size. The proposed topology is a full-bridge converter with a single-turn primary side transformer, realized using a high voltage insulated hook-up wire as primary winding, while the secondary winding is wound around a toroidal core. This structure can supply several gate drivers simultaneously without replicating the primary side converter, but by simply adding a toroidal core with the secondary side converter which effectively reduces the size of the power supply. To satisfy magnetic and electric constraints, the proposed toroidal transformer needs to exhibit a very low primary to secondary coupling capacitance to avoid high common mode current, which leads to control signal distortion. For this, a multi-objective optimization design has been performed for the magnetic components of the topology. In this paper, a single input and three output power supply design is proposed for a 10 kV active gate driver