Characterization of Non-linear Polymer Properties to Predict Process Induced Warpage and Residual Stress of Electronic Packages

Nonlinear thermo-mechanical properties of advanced polymers are crucial to accurate prediction of the process induced warpage and residual stress of electronics packages. The Fiber Bragg grating (FBG) sensor based method is advanced and implemented to determine temperature and time dependent nonlinear properties. The FBG sensor is embedded in the center of the cylindrical specimen, which deforms together with the specimen. The strains of the specimen at different loading conditions are monitored by the FBG sensor. Two main sources of the warpage are considered: curing induced warpage and coefficient of thermal expansion (CTE) mismatch induced warpage. The effective chemical shrinkage and the equilibrium modulus are needed for the curing induced warpage prediction. Considering various polymeric materials used in microelectronic packages, unique curing setups and procedures are developed for elastomers (extremely low modulus, medium viscosity, room temperature curing), underfill materials (medium modulus, low viscosity, high temperature curing), and epoxy molding compound (EMC: high modulus, high viscosity, high temperature pressure curing), most notably, (1) zero-constraint mold for elastomers; (2) a two-stage curing procedure for underfill materials and (3) an air-cylinder based novel setup for EMC. For the CTE mismatch induced warpage, the temperature dependent CTE and the comprehensive viscoelastic properties are measured. The cured cylindrical specimen with a FBG sensor embedded in the center is further used for viscoelastic property measurements. A uni-axial compressive loading is applied to the specimen to measure the time dependent Young’s modulus. The test is repeated from room temperature to the reflow temperature to capture the time-temperature dependent Young’s modulus. A separate high pressure system is developed for the bulk modulus measurement. The time temperature dependent bulk modulus is measured at the same temperatures as the Young’s modulus. The master curve of the Young’s modulus and bulk modulus of the EMC is created and a single set of the shift factors is determined from the time temperature superposition. The supplementary experiments are conducted to verify the validity of the assumptions associated with the linear viscoelasticity. The measured time-temperature dependent properties are further verified by a shadow moiré and Twyman/Green test

An optimization method for the design of beads in long fiber reinforced polymer structures including the manufacturing process as an approach to realize methodically identified lightweight potentials = Eine Optimierungsmethode zur Gestaltung von Sicken in langfaserverstärkten Kunststoffstrukturen unter Berücksichtigung des Herstellungsprozesses als Ansatz zur Realisierung methodisch identifizierter Leichtbaupotentiale

Mobilitätssysteme befinden sich in einer Zeit des Umbruchs, da sich die Randbedingungen aus Politik und Gesellschaft gerade stark verändern. Im Fokus steht dabei, den Energie- und Ressourcenverbrauch sowie die CO2-Emissionen zu senken. Eine Möglichkeit diesen Herausforderungen zu begegnen, stellt der Leichtbau dar. Um die größtmögliche Gewichtsreduzierung erreichen zu können, ist eine konsequente Integration der Leichtbauaktivitäten in den gesamten Produktentstehungsprozess notwendig. Die vorliegende Arbeit liefert einen Beitrag zur Unterstützung des Produktentwicklers in verschiedenen Aktivitäten des Produktentstehungsprozesses, indem sie sich mit den Fragen „wie können Bauteile aus langfaserverstärkten Kunststoffen fasergerecht gestaltet werden“ und „wo sind diese in einem intelligenten Multi-Material Design (MMD) zielführend einzusetzen“ beschäftigt. Zur Frage „wie“ wird für die initiale Designfindung von versickten, langfaserverstärkten Bauteilen eine rechnergestützte, automatisierte Optimierungsmethode entwickelt. Bei diesem anisotropen Werkstoff ist es entscheidend, dass die aus dem Herstellungsprozess resultierenden Faserorientierungen im Bauteildesign berücksichtigt werden. Deshalb liegt der Optimierungsmethode eine iterative Kopplung von validierten Prozess- und Struktursimulationen zugrunde. Die Ergebnisse zeigen, dass die Berücksichtigung der lokal anisotropen Materialeigenschaften im Vergleich zu einer isotropen Materialmodellierung zu deutlich unterschiedlichen Designs führt. Um diese last- und fasergerecht designten Bauteile in einem MMD zielführend einsetzen zu können, ist jedoch zusätzlich die Frage nach dem „wo“ zu beantworten. Deshalb beschäftigt sich die Arbeit weiterhin mit der Entwicklung des funktionsbasierten Erweiterten Target Weighing Ansatzes (ETWA) zur komponentenübergreifenden Identifikation und Evaluation von Leichtbaupotentialen. Der ETWA unterstützt den Produktentwickler bei der Konzeptgenerierung in frühen Phasen des Produktentstehungsprozesses, in denen bereits ein Großteil des späteren Produktgewichts festgelegt wird. Dabei werden sowohl in der Analyse als auch in der Synthese die mit dem Gewicht und dessen Reduktion einhergehenden Kosten und CO2-Emissionen gemeinschaftlich betrachtet. Die Ergebnisse der mithilfe des ETWA im Rahmen dieser Arbeit entwickelten MMD eines Automobil-Federbeindoms und -Längsträgers zeigen das Potential der Methode auf. Die Kombination des ETWA und der fasergerechten Gestaltung versickter langfaserverstärkter Bauteile bietet eine methodische Unterstützung bei der Entwicklung von MMD insbesondere in frühen Phasen der Produktentstehung

Evaluation of solar cells and arrays for potential solar power satellite applications

Proposed solar array designs and manufacturing methods are evaluated to identify options which show the greatest promise of leading up to the develpment of a cost-effective SPS solar cell array design. The key program elements which have to be accomplished as part of an SPS solar cell array development program are defined. The issues focussed on are: (1) definition of one or more designs of a candidate SPS solar array module, using results from current system studies; (2) development of the necessary manufacturing requirements for the candidate SPS solar cell arrays and an assessment of the market size, timing, and industry infrastructure needed to produce the arrays for the SPS program; (3) evaluation of current DOE, NASA and DOD photovoltaic programs to determine the impacts of recent advances in solar cell materials, array designs and manufacturing technology on the candidate SPS solar cell arrays; and (4) definition of key program elements for the development of the most promising solar cell arrays for the SPS program

High-frequency characterization of embedded components in printed circuit boards

The embedding of electronic components is a three-dimensional packaging technology, where chips are placed inside of the printed circuit board instead of on top. The advantage of this technology is the reduced electronic interconnection length between components. The shorter this connection, the faster the signal transmission can occur. Different high-frequency aspects of chip embedding are investigated within this dissertation: interconnections to the embedded chip, crosstalk between signals on the chip and on the board, and interconnections running on top of or underneath embedded components. The high-frequency behavior of tracks running near embedded components is described using a broadband model for multilayer microstrip transmission lines. The proposed model can be used to predict the characteristic impedance and the loss of the lines. The model is based on two similar approximations that reduce the multilayer substrate to an equivalent single-layer structure. The per-unit-length shunt impedance parameters are derived from the complex effective dielectric constant, which is obtained using a variational method. A complex image approach results in the calculation of a frequency-dependent effective height that can be used to determine the per-unit-length resistance and inductance. A deliberate choice was made for a simple but accurate model that could easily be implemented in current high-frequency circuit simulators. Next to quasi-static electromagnetic simulations, a dedicated test vehicle that allows for the direct extraction of the propagation constant of these multilayer microstrips is manufactured and used to verify the model. The verification of the model using simulation and measurements shows that the proposed model slightly overestimates the loss of the measured multilayer microstrips, but is more accurate than the simulations in predicting the characteristic impedance

Advances on Mechanics, Design Engineering and Manufacturing III

This open access book gathers contributions presented at the International Joint Conference on Mechanics, Design Engineering and Advanced Manufacturing (JCM 2020), held as a web conference on June 2–4, 2020. It reports on cutting-edge topics in product design and manufacturing, such as industrial methods for integrated product and process design; innovative design; and computer-aided design. Further topics covered include virtual simulation and reverse engineering; additive manufacturing; product manufacturing; engineering methods in medicine and education; representation techniques; and nautical, aeronautics and aerospace design and modeling. The book is organized into four main parts, reflecting the focus and primary themes of the conference. The contributions presented here not only provide researchers, engineers and experts in a range of industrial engineering subfields with extensive information to support their daily work; they are also intended to stimulate new research directions, advanced applications of the methods discussed and future interdisciplinary collaborations

A Digital Manufacturing Process For Three-Dimensional Electronics

Additive manufacturing (AM) offers the ability to produce devices with a degree of three-dimensional complexity and mass customisation previously unachievable with subtractive and formative approaches. These benefits have not transitioned into the production of commercial electronics that still rely on planar, template-driven manufacturing, which prevents them from being tailored to the end user or exploiting conformal circuitry for miniaturisation. Research into the AM fabrication of 3D electronics has been demonstrated; however, because of material restrictions, the durability and electrical conductivity of such devices was often limited. This thesis presents a novel manufacturing approach that hybridises the AM of polyetherimide (PEI) with chemical modification and selective light-based synthesis of silver nanoparticles to produce 3D electronic systems. The resulting nanoparticles act as a seed site for the electroless deposition of copper. The use of high-performance materials for both the conductive and dielectric elements created devices with the performance required for real-world applications. For printing PEI, a low-cost fused filament fabrication (FFF); also known as fused deposition modelling (FDM), printer with a unique inverted design was developed. The orientation of the printer traps hot air within a heated build environment that is open on its underside allowing the print head to deposit the polymer while keeping the sensitive components outside. The maximum achievable temperature was 120 °C and was found to reduce the degree of warping and the ultimate tensile strength of printed parts. The dimensional accuracy was, on average, within 0.05 mm of a benchmark printer and fine control over the layer thickness led to the discovery of flexible substrates that can be directly integrated into rigid parts. Chemical modification of the printed PEI was used to embed ionic silver into the polymer chain, sensitising it to patterning with a 405 nm laser. The rig used for patterning was a re-purposed vat-photopolymerisation printer that uses a galvanometer to guide the beam that is focused to a spot size of 155 µm at the focal plane. The positioning of the laser spot was controlled with an open-sourced version of the printers slicing software. The optimal laser patterning parameters were experimentally validated and a link between area-related energy density and the quality of the copper deposition was found. In tests where samples were exposed to more than 2.55 J/cm^2, degradation of the polymer was experienced which produced blistering and delamination of the copper. Less than 2.34 J/cm^2 also had negative effect and resulted in incomplete coverage of the patterned area. The minimum feature resolution produced by the patterning setup was 301 µm; however, tests with a photomask demonstrated features an order of magnitude smaller. The non-contact approach was also used to produce conformal patterns over sloped and curved surfaces. Characterisation of the copper deposits found an average thickness of 559 nm and a conductivity of 3.81 × 107 S/m. Tape peel and bend fatigue testing showed that the copper was ductile and adhered well to the PEI, with flexible electronic samples demonstrating over 50,000 cycles at a minimum bend radius of 6.59 mm without failure. Additionally, the PEI and copper combination was shown to survive a solder reflow with peak temperatures of 249°C. Using a robotic pick and place system a test board was automatically populated with surface mount components as small as 0201 resistors which were affixed using high-temperature, Type-V Tin-Silver-Copper solder paste. Finally, to prove the process a range of functional demonstrators were built and evaluated. These included a functional timer circuit, inductive wireless power coils compatible with two existing standards, a cylindrical RF antenna capable of operating at several frequencies below 10 GHz, flexible positional sensors, and multi-mode shape memory alloy actuators

An integrated quantitative framework for supporting product design : the case of metallic moulds for injection

Tese de Doutoramento. Programa Doutoral em Engenharia Industrial e Gestão. Faculdade de Engenharia. Universidade do Porto. 201

Low cost, SPF aluminum cryogenic tank structure for ALS

Past production work has shown that cryogenic tank structure for the Shuttle Booster Rockets and the Titan system have very high life cycle costs for the fuel tank structure. The tanks are machined stiffener-skin combination that are subsequently formed into the required contour after machining. The material scrap rate for these configurations are usually high, and the loss of a tank panel due to forming or heat treatment problems is very costly. The idea of reducing the amount of scrap material and scrapped structural members has prompted the introduction of built-up structure for cryogenic tanks to be explored on the ALS program. A build-up structure approach that has shown improvements in life cycle cost over the conventional built-up approach is the use of superplastically formed (SPF) stiffened panels (reducing the overall part count and weight for the tank) resistance spot welded (RSW) to outer tank skin material. The stiffeners provide for general stability of the tank, while the skin material provides hoop direction continuity for the loads

Development of effective thermal management strategies for LED luminaires

The efficacy, reliability and versatility of the light emitting diode (LED) can outcompete most established light source technologies. However, they are particularly sensitive to high temperatures, which compromises their efficacy and reliability, undermining some of the technology s key benefits. Consequently, effective thermal management is essential to exploit the technology to its full potential. Thermal management is a well-established subject but its application in the relatively new LED lighting industry, with its specific constraints, is currently poorly defined. The question this thesis aims to answer is how can LED thermal management be achieved most effectively? This thesis starts with a review of the current state of the art, relevant thermal management technologies and market trends. This establishes current and future thermal management constraints in a commercial context. Methods to test and evaluate the thermal management performance of a luminaire system follow. The defined test methods, simulation benchmarks and operational constraints provide the foundation to develop effective thermal management strategies. Finally this work explores how the findings can be implemented in the development and comparison of multiple thermal management designs. These are optimised to assess the potential performance enhancement available when applied to a typical commercial system. The outcomes of this research showed that thermal management of LEDs can be expected to remain a key requirement but there are hints it is becoming less critical. The impacts of some common operating environments were studied, but appeared to have no significant effect on the thermal behaviour of a typical system. There are some active thermal management devices that warrant further attention, but passive systems are inherently well suited to LED luminaires and are readily adopted so were selected as the focus of this research. Using the techniques discussed in this thesis the performance of a commercially available component was evaluated. By optimising its geometry, a 5 % decrease in absolute thermal resistance or a 20 % increase in average heat transfer coefficient and 10 % reduction in heatsink mass can potentially be achieved . While greater lifecycle energy consumption savings were offered by minimising heatsink thermal resistance the most effective design was considered to be one optimised for maximum average heat transfer coefficient. Some more radical concepts were also considered. While these demonstrate the feasibility of passively manipulating fluid flow they had a detrimental impact on performance. Further analysis would be needed to conclusively dismiss these concepts but this work indicates there is very little potential in pursuing them further

The Development of Novel Interconnection Technologies for 3D Packaging of Wire Bondless Silicon Carbide Power Modules

This dissertation advances the cause for the 3D packaging and integration of silicon carbide power modules. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power packaging. Current efforts pursuing 3D wire bondless SiC power modules were investigated, and the concept for a novel SiC power module was discussed. This highly-integrated SiC power module was assessed for feasibility, with a focus on achieving ultralow parasitic inductances in the critical switching loops. This will enable higher switching frequencies, leading to a reduction in the size of the passive devices in the system and resulting in systems with lower weight and volume. The proposed concept yielded an order-of-magnitude reduction in system parasitics, alongside the possibility of a compact system integration. The technological barriers to realizing these concepts were identified, and solutions for novel interconnection schemes were proposed and evaluated. A novel sintered silver preform was developed to facilitate flip-chip interconnections for a bare-die power device while operating in a high ambient temperature. The preform was demonstrated to have 3.75× more bonding strength than a conventional sintered silver bond and passed rigorous thermal shock tests. A chip-scale and flip-chip capable power device was also developed. The novel package combined the ease of assembly of a discrete device with a performance exceeding a wire bonded module. It occupied a 14× smaller footprint than a discrete device, and offered power loop inductances which were less than a third of a conventional wire bonded module. A detailed manufacturing process flow and qualification is included in this dissertation. These novel devices were implemented in various electrical systems—a discrete Schottky barrier diode package, a half-bridge module with external gate drive, and finally a half-bridge with integrated gate driver in-module. The results of these investigations have been reported and their benefits assessed. The wire bondless modules showed \u3c 5% overshoot under all test conditions. No observable detrimental effects due to dv/dt were observed for any of the modules even under aggressive voltage slew rates of 20-25 V/ns