A machine learning-based approach to optimize repair and increase yield of embedded flash memories in automotive systems-on-chip

Nowadays, Embedded Flash Memory cores occupy a significant portion of Automotive Systems-on-Chip area, therefore strongly contributing to the final yield of the devices. Redundancy strategies play a key role in this context; in case of memory failures, a set of spare word- and bit-lines are allocated by a replacement algorithm that complements the memory testing procedure. In this work, we show that replacement algorithms, which are heavily constrained in terms of execution time, may be slightly inaccurate and lead to classify a repairable memory core as unrepairable. We denote this situation as Flash memory false fail. The proposed approach aims at identifying false fails by using a Machine Learning approach that exploits a feature extraction strategy based on shape recognition. Experimental results carried out on the manufacturing data show a high capability of predicting false fails

Design for testability of a latch-based design

Abstract. The purpose of this thesis was to decrease the area of digital logic in a power management integrated circuit (PMIC), by replacing selected flip-flops with latches. The thesis consists of a theory part, that provides background theory for the thesis, and a practical part, that presents a latch register design and design for testability (DFT) method for achieving an acceptable level of manufacturing fault coverage for it. The total area was decreased by replacing flip-flops of read-write and one-time programmable registers with latches. One set of negative level active primary latches were shared with all the positive level active latch registers in the same register bank. Clock gating was used to select which latch register the write data was loaded to from the primary latches. The latches were made transparent during the shift operation of partial scan testing. The observability of the latch register clock gating logic was improved by leaving the first bit of each latch register as a flip-flop. The controllability was improved by inserting control points. The latch register design, developed in this thesis, resulted in a total area decrease of 5% and a register bank area decrease of 15% compared to a flip-flop-based reference design. The latch register design manages to maintain the same stuck-at fault coverage as the reference design.Salpaperäisen piirin testattavuuden suunnittelu. Tiivistelmä. Tämän opinnäytetyön tarkoituksena oli pienentää digitaalisen logiikan pinta-alaa integroidussa tehonhallintapiirissä, korvaamalla valitut kiikut salpapiireillä. Opinnäytetyö koostuu teoriaosasta, joka antaa taustatietoa opinnäytetyölle, ja käytännön osuudesta, jossa esitellään salparekisteripiiri ja testattavuussuunnittelun menetelmä, jolla saavutettiin riittävän hyvä virhekattavuus salparekisteripiirille. Kokonaispinta-alaa pienennettiin korvaamalla luku-kirjoitusrekistereiden ja kerran ohjelmoitavien rekistereiden kiikut salpapiireillä. Yhdet negatiivisella tasolla aktiiviset isäntä-salpapiirit jaettiin kaikkien samassa rekisteripankissa olevien positiivisella tasolla aktiivisten salparekistereiden kanssa. Kellon portittamisella valittiin mihin salparekisteriin kirjoitusdata ladattiin yhteisistä isäntä-salpapireistä. Osittaisessa testipolkuihin perustuvassa testauksessa salpapiirit tehtiin läpinäkyviksi siirtooperaation aikana. Salparekisterin kellon portituslogiikan havaittavuutta parannettiin jättämällä jokaisen salparekisterin ensimmäinen bitti kiikuksi. Ohjattavuutta parannettiin lisäämällä ohjauspisteitä. Salparekisteripiiri, joka suunniteltiin tässä diplomityössä, pienensi kokonaispinta-alaa 5 % ja rekisteripankin pinta-alaa 15 % verrattuna kiikkuperäiseen vertailupiiriin. Salparekisteripiiri onnistuu pitämään saman juuttumisvikamallin virhekattavuuden kuin vertailupiiri

Conception et test des circuits et systèmes numériques à haute fiabilité et sécurité

Research activities I carried on after my nomination as Chargé de Recherche deal with the definition of methodologies and tools for the design, the test and the reliability of secure digital circuits and trustworthy manufacturing. More recently, we have started a new research activity on the test of 3D stacked Integrated CIrcuits, based on the use of Through Silicon Vias. Moreover, thanks to the relationships I have maintained after my post-doc in Italy, I have kept on cooperating with Politecnico di Torino on the topics related to test and reliability of memories and microprocessors.Secure and Trusted DevicesSecurity is a critical part of information and communication technologies and it is the necessary basis for obtaining confidentiality, authentication, and integrity of data. The importance of security is confirmed by the extremely high growth of the smart-card market in the last 20 years. It is reported in "Le monde Informatique" in the article "Computer Crime and Security Survey" in 2007 that financial losses due to attacks on "secure objects" in the digital world are greater than $11 Billions. Since the race among developers of these secure devices and attackers accelerates, also due to the heterogeneity of new systems and their number, the improvement of the resistance of such components becomes today’s major challenge.Concerning all the possible security threats, the vulnerability of electronic devices that implement cryptography functions (including smart cards, electronic passports) has become the Achille’s heel in the last decade. Indeed, even though recent crypto-algorithms have been proven resistant to cryptanalysis, certain fraudulent manipulations on the hardware implementing such algorithms can allow extracting confidential information. So-called Side-Channel Attacks have been the first type of attacks that target the physical device. They are based on information gathered from the physical implementation of a cryptosystem. For instance, by correlating the power consumed and the data manipulated by the device, it is possible to discover the secret encryption key. Nevertheless, this point is widely addressed and integrated circuit (IC) manufacturers have already developed different kinds of countermeasures.More recently, new threats have menaced secure devices and the security of the manufacturing process. A first issue is the trustworthiness of the manufacturing process. From one side, secure devices must assure a very high production quality in order not to leak confidential information due to a malfunctioning of the device. Therefore, possible defects due to manufacturing imperfections must be detected. This requires high-quality test procedures that rely on the use of test features that increases the controllability and the observability of inner points of the circuit. Unfortunately, this is harmful from a security point of view, and therefore the access to these test features must be protected from unauthorized users. Another harm is related to the possibility for an untrusted manufacturer to do malicious alterations to the design (for instance to bypass or to disable the security fence of the system). Nowadays, many steps of the production cycle of a circuit are outsourced. For economic reasons, the manufacturing process is often carried out by foundries located in foreign countries. The threat brought by so-called Hardware Trojan Horses, which was long considered theoretical, begins to materialize.A second issue is the hazard of faults that can appear during the circuit’s lifetime and that may affect the circuit behavior by way of soft errors or deliberate manipulations, called Fault Attacks. They can be based on the intentional modification of the circuit’s environment (e.g., applying extreme temperature, exposing the IC to radiation, X-rays, ultra-violet or visible light, or tampering with clock frequency) in such a way that the function implemented by the device generates an erroneous result. The attacker can discover secret information by comparing the erroneous result with the correct one. In-the-field detection of any failing behavior is therefore of prime interest for taking further action, such as discontinuing operation or triggering an alarm. In addition, today’s smart cards use 90nm technology and according to the various suppliers of chip, 65nm technology will be effective on the horizon 2013-2014. Since the energy required to force a transistor to switch is reduced for these new technologies, next-generation secure systems will become even more sensitive to various classes of fault attacks.Based on these considerations, within the group I work with, we have proposed new methods, architectures and tools to solve the following problems:• Test of secure devices: unfortunately, classical techniques for digital circuit testing cannot be easily used in this context. Indeed, classical testing solutions are based on the use of Design-For-Testability techniques that add hardware components to the circuit, aiming to provide full controllability and observability of internal states. Because crypto‐ processors and others cores in a secure system must pass through high‐quality test procedures to ensure that data are correctly processed, testing of crypto chips faces a dilemma. In fact design‐for‐testability schemes want to provide high controllability and observability of the device while security wants minimal controllability and observability in order to hide the secret. We have therefore proposed, form one side, the use of enhanced scan-based test techniques that exploit compaction schemes to reduce the observability of internal information while preserving the high level of testability. From the other side, we have proposed the use of Built-In Self-Test for such devices in order to avoid scan chain based test.• Reliability of secure devices: we proposed an on-line self-test architecture for hardware implementation of the Advanced Encryption Standard (AES). The solution exploits the inherent spatial replications of a parallel architecture for implementing functional redundancy at low cost.• Fault Attacks: one of the most powerful types of attack for secure devices is based on the intentional injection of faults (for instance by using a laser beam) into the system while an encryption occurs. By comparing the outputs of the circuits with and without the injection of the fault, it is possible to identify the secret key. To face this problem we have analyzed how to use error detection and correction codes as counter measure against this type of attack, and we have proposed a new code-based architecture. Moreover, we have proposed a bulk built-in current-sensor that allows detecting the presence of undesired current in the substrate of the CMOS device.• Fault simulation: to evaluate the effectiveness of countermeasures against fault attacks, we developed an open source fault simulator able to perform fault simulation for the most classical fault models as well as user-defined electrical level fault models, to accurately model the effect of laser injections on CMOS circuits.• Side-Channel attacks: they exploit physical data-related information leaking from the device (e.g. current consumption or electro-magnetic emission). One of the most intensively studied attacks is the Differential Power Analysis (DPA) that relies on the observation of the chip power fluctuations during data processing. I studied this type of attack in order to evaluate the influence of the countermeasures against fault attack on the power consumption of the device. Indeed, the introduction of countermeasures for one type of attack could lead to the insertion of some circuitry whose power consumption is related to the secret key, thus allowing another type of attack more easily. We have developed a flexible integrated simulation-based environment that allows validating a digital circuit when the device is attacked by means of this attack. All architectures we designed have been validated through this tool. Moreover, we developed a methodology that allows to drastically reduce the time required to validate countermeasures against this type of attack.TSV- based 3D Stacked Integrated Circuits TestThe stacking process of integrated circuits using TSVs (Through Silicon Via) is a promising technology that keeps the development of the integration more than Moore’s law, where TSVs enable to tightly integrate various dies in a 3D fashion. Nevertheless, 3D integrated circuits present many test challenges including the test at different levels of the 3D fabrication process: pre-, mid-, and post- bond tests. Pre-bond test targets the individual dies at wafer level, by testing not only classical logic (digital logic, IOs, RAM, etc) but also unbounded TSVs. Mid-bond test targets the test of partially assembled 3D stacks, whereas finally post-bond test targets the final circuit.The activities carried out within this topic cover 2 main issues:• Pre-bond test of TSVs: the electrical model of a TSV buried within the substrate of a CMOS circuit is a capacitance connected to ground (when the substrate is connected to ground). The main assumption is that a defect may affect the value of that capacitance. By measuring the variation of the capacitance’s value it is possible to check whether the TSV is correctly fabricated or not. We have proposed a method to measure the value of the capacitance based on the charge/ discharge delay of the RC network containing the TSV.• Test infrastructures for 3D stacked Integrated Circuits: testing a die before stacking to another die introduces the problem of a dynamic test infrastructure, where test data must be routed to a specific die based on the reached fabrication step. New solutions are proposed in literature that allow reconfiguring the test paths within the circuit, based on on-the-fly requirements. We have started working on an extension of the IEEE P1687 test standard that makes use of an automatic die-detection based on pull-up resistors.Memory and Microprocessor Test and ReliabilityThanks to device shrinking and miniaturization of fabrication technology, performances of microprocessors and of memories have grown of more than 5 magnitude order in the last 30 years. With this technology trend, it is necessary to face new problems and challenges, such as reliability, transient errors, variability and aging.In the last five years I’ve worked in cooperation with the Testgroup of Politecnico di Torino (Italy) to propose a new method to on-line validate the correctness of the program execution of a microprocessor. The main idea is to monitor a small set of control signals of the processors in order to identify incorrect activation sequences. This approach can detect both permanent and transient errors of the internal logic of the processor.Concerning the test of memories, we have proposed a new approach to automatically generate test programs starting from a functional description of the possible faults in the memory.Moreover, we proposed a new methodology, based on microprocessor error probability profiling, that aims at estimating fault injection results without the need of a typical fault injection setup. The proposed methodology is based on two main ideas: a one-time fault-injection analysis of the microprocessor architecture to characterize the probability of successful execution of each of its instructions in presence of a soft-error, and a static and very fast analysis of the control and data flow of the target software application to compute its probability of success

Fault Detection Methodology for Caches in Reliable Modern VLSI Microprocessors based on Instruction Set Architectures

Η παρούσα διδακτορική διατριβή εισάγει μία χαμηλού κόστους μεθοδολογία για την ανίχνευση ελαττωμάτων σε μικρές ενσωματωμένες κρυφές μνήμες που βασίζεται σε σύγχρονες Αρχιτεκτονικές Συνόλου Εντολών και εφαρμόζεται με λογισμικό αυτοδοκιμής. Η προτεινόμενη μεθοδολογία εφαρμόζει αλγορίθμους March μέσω λογισμικού για την ανίχνευση τόσο ελαττωμάτων αποθήκευσης όταν εφαρμόζεται σε κρυφές μνήμες που περιέχουν μόνο στατικές μνήμες τυχαίας προσπέλασης όπως για παράδειγμα κρυφές μνήμες επιπέδου 1, όσο και ελαττωμάτων σύγκρισης όταν εφαρμόζεται σε κρυφές μνήμες που περιέχουν εκτός από SRAM μνήμες και μνήμες διευθυνσιοδοτούμενες μέσω περιεχομένου, όπως για παράδειγμα πλήρως συσχετιστικές κρυφές μνήμες αναζήτησης μετάφρασης. Η προτεινόμενη μεθοδολογία εφαρμόζεται και στις τρεις οργανώσεις συσχετιστικότητας κρυφής μνήμης και είναι ανεξάρτητη της πολιτικής εγγραφής στο επόμενο επίπεδο της ιεραρχίας. Η μεθοδολογία αξιοποιεί υπάρχοντες ισχυρούς μηχανισμούς των μοντέρνων ISAs χρησιμοποιώντας ειδικές εντολές, που ονομάζονται στην παρούσα διατριβή Εντολές Άμεσης Προσπέλασης Κρυφής Μνήμης (Direct Cache Access Instructions - DCAs). Επιπλέον, η προτεινόμενη μεθοδολογία εκμεταλλεύεται τους έμφυτους μηχανισμούς καταγραφής απόδοσης και τους μηχανισμούς χειρισμού παγίδων που είναι διαθέσιμοι στους σύγχρονους επεξεργαστές. Επιπρόσθετα, η προτεινόμενη μεθοδολογία εφαρμόζει την λειτουργία σύγκρισης των αλγορίθμων March όταν αυτή απαιτείται (για μνήμες CAM) και επαληθεύει το αποτέλεσμα του ελέγχου μέσω σύντομης απόκρισης, ώστε να είναι συμβατή με τις απαιτήσεις του ελέγχου εντός λειτουργίας. Τέλος, στη διατριβή προτείνεται μία βελτιστοποίηση της μεθοδολογίας για πολυνηματικές, πολυπύρηνες αρχιτεκτονικές.The present PhD thesis introduces a low cost fault detection methodology for small embedded cache memories that is based on modern Instruction Set Architectures and is applied with Software-Based Self-Test (SBST) routines. The proposed methodology applies March tests through software to detect both storage faults when applied to caches that comprise Static Random Access Memories (SRAM) only, e.g. L1 caches, and comparison faults when applied to caches that apart from SRAM memories comprise Content Addressable Memories (CAM) too, e.g. Translation Lookaside Buffers (TLBs). The proposed methodology can be applied to all three cache associativity organizations: direct mapped, set-associative and full-associative and it does not depend on the cache write policy. The methodology leverages existing powerful mechanisms of modern ISAs by utilizing instructions that we call in this PhD thesis Direct Cache Access (DCA) instructions. Moreover, our methodology exploits the native performance monitoring hardware and the trap handling mechanisms which are available in modern microprocessors. Moreover, the proposed Methodology applies March compare operations when needed (for CAM arrays) and verifies the test result with a compact response to comply with periodic on-line testing needs. Finally, a multithreaded optimization of the proposed methodology that targets multithreaded, multicore architectures is also presented in this thesi

Test Quality Analysis and Improvement for an Embedded Asynchronous FIFO

Embedded First-InFirst-Out (FIFO) memories are increasingly used in many IC designs.We have created a new full-custom embedded FIFO module withasynchronous read and write clocks, which is at least a factor twosmaller and also faster than SRAM-based and standard-cell-basedcounterparts. The detection qualities of the FIFO test for bothhard and weak resistive shorts and opens have been analyzed by anIFA-like method based on analog simulation. The defect coverage ofthe initial FIFO test for shorts in the bit-cell matrix has beenimproved by inclusion of an additional data background andlow-voltage testing; for low-resistant shorts, 100% defect coverageis obtained. The defect coverage for opens has been improved by anew test procedure which includes waitingperiods

VLSI Design

This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc

Commissioning Perspectives for the ATLAS Pixel Detector

The ATLAS Pixel Detector, the innermost sub-detector of the ATLAS experiment at the Large Hadron Collider, CERN, is an 80 million channel silicon pixel tracking detector designed for high-precision charged particle tracking and secondary vertex reconstruction. It was installed in the ATLAS experiment and commissioning for the first proton-proton collision data taking in 2008 has begun. Due to the complex layout and limited accessibility, quality assurance measurements were continuously performed during production and assembly to ensure that no problematic components are integrated. The assembly of the detector at CERN and related quality assurance measurement results, including comparison to previous production measurements, will be presented. In order to verify that the integrated detector, its data acquisition readout chain, the ancillary services and cooling system as well as the detector control and data acquisition software perform together as expected approximately 8% of the detector system was progressively assembled as close to the final layout as possible. The so-called System Test laboratory setup was operated for several months under experiment-like environment conditions. The interplay between different detector components was studied with a focus on the performance and tunability of the optical data transmission system. Operation and optical tuning procedures were developed and qualified for the upcoming commission ing. The front-end electronics preamplifier threshold tuning and noise performance were studied and noise occupancy of the detector with low sensor bias voltages was investigated. Data taking with cosmic muons was performed to test the data acquisition and trigger system as well as the offline reconstruction and analysis software. The data quality was verified with an extended version of the pixel online monitoring package which was implemented for the ATLAS Combined Testbeam. The detector raw data of the Combined Testbeam and of the System Test cosmic run was converted for offline data analysis with the Pixel bytestream converter which was continuously extended and adapted according to the offline analysis software needs

Segurança de computadores por meio de autenticação intrínseca de hardware

Orientadores: Guido Costa Souza de Araújo, Mario Lúcio Côrtes e Diego de Freitas AranhaTese (doutorado) - Universidade Estadual de Campinas, Instituto de ComputaçãoResumo: Neste trabalho apresentamos Computer Security by Hardware-Intrinsic Authentication (CSHIA), uma arquitetura de computadores segura para sistemas embarcados que tem como objetivo prover autenticidade e integridade para código e dados. Este trabalho está divido em três fases: Projeto da Arquitetura, sua Implementação, e sua Avaliação de Segurança. Durante a fase de projeto, determinamos como integridade e autenticidade seriam garantidas através do uso de Funções Fisicamente Não Clonáveis (PUFs) e propusemos um algoritmo de extração de chaves criptográficas de memórias cache de processadores. Durante a implementação, flexibilizamos o projeto da arquitetura para fornecer diferentes possibilidades de configurações sem comprometimento da segurança. Então, avaliamos seu desempenho levando em consideração o incremento em área de chip, aumento de consumo de energia e memória adicional para diferentes configurações. Por fim, analisamos a segurança de PUFs e desenvolvemos um novo ataque de canal lateral que circunvê a propriedade de unicidade de PUFs por meio de seus elementos de construçãoAbstract: This work presents Computer Security by Hardware-Intrinsic Authentication (CSHIA), a secure computer architecture for embedded systems that aims at providing authenticity and integrity for code and data. The work encompassed three phases: Design, Implementation, and Security Evaluation. In design, we laid out the basic ideas behind CSHIA, namely, how integrity and authenticity are employed through the use of Physical Unclonable Functions (PUFs), and we proposed an algorithm to extract cryptographic keys from the intrinsic memories of processors. In implementation, we made CSHIA¿s design more flexible, allowing different configurations without compromising security. Then, we evaluated CSHIA¿s performance and overheads, such as area, energy, and memory, for multiple configurations. Finally, we evaluated security of PUFs, which led us to develop a new side-channel-based attack that enabled us to circumvent PUFs¿ uniqueness property through their architectural elementsDoutoradoCiência da ComputaçãoDoutor em Ciência da Computação2015/06829-2; 2016/25532-3147614/2014-7FAPESPCNP

Techniques for Improving Security and Trustworthiness of Integrated Circuits

The integrated circuit (IC) development process is becoming increasingly vulnerable to malicious activities because untrusted parties could be involved in this IC development flow. There are four typical problems that impact the security and trustworthiness of ICs used in military, financial, transportation, or other critical systems: (i) Malicious inclusions and alterations, known as hardware Trojans, can be inserted into a design by modifying the design during GDSII development and fabrication. Hardware Trojans in ICs may cause malfunctions, lower the reliability of ICs, leak confidential information to adversaries or even destroy the system under specifically designed conditions. (ii) The number of circuit-related counterfeiting incidents reported by component manufacturers has increased significantly over the past few years with recycled ICs contributing the largest percentage of the total reported counterfeiting incidents. Since these recycled ICs have been used in the field before, the performance and reliability of such ICs has been degraded by aging effects and harsh recycling process. (iii) Reverse engineering (RE) is process of extracting a circuit’s gate-level netlist, and/or inferring its functionality. The RE causes threats to the design because attackers can steal and pirate a design (IP piracy), identify the device technology, or facilitate other hardware attacks. (iv) Traditional tools for uniquely identifying devices are vulnerable to non-invasive or invasive physical attacks. Securing the ID/key is of utmost importance since leakage of even a single device ID/key could be exploited by an adversary to hack other devices or produce pirated devices. In this work, we have developed a series of design and test methodologies to deal with these four challenging issues and thus enhance the security, trustworthiness and reliability of ICs. The techniques proposed in this thesis include: a path delay fingerprinting technique for detection of hardware Trojans, recycled ICs, and other types counterfeit ICs including remarked, overproduced, and cloned ICs with their unique identifiers; a Built-In Self-Authentication (BISA) technique to prevent hardware Trojan insertions by untrusted fabrication facilities; an efficient and secure split manufacturing via Obfuscated Built-In Self-Authentication (OBISA) technique to prevent reverse engineering by untrusted fabrication facilities; and a novel bit selection approach for obtaining the most reliable bits for SRAM-based physical unclonable function (PUF) across environmental conditions and silicon aging effects