A Multiproject Chip Approach to the Teaching of Analog MOS LSI and VLSI

Multiproject chip implementation has been used in teaching analog MOS circuit design. After having worked with computer simulation and layout aids in homework problems, students designed novel circuits including several high performance op amps, an A/D converter, a switched capacitor filter, a 1 K dynamic RAM, and a variety of less conventional MOS circuits such as a VII converter, an AC/DC converter, an AM radio receiver, a digitally-controlled analog signal processor, and on-chip circuitry for measuring transistor capacitances. These circuits were laid out as part of an NMOS multiproject chip. Several of the designs exhibit a considerable degree of innovation; fabrication pending, computer simulation shows that some may be pushing the state of the art. Several designs are of interest to digital designers; in fact, the course has provided knowledge and technique needed for detailed digital circuit design at the gate level

Dynamic Voltage Scaling Aware Delay Fault Testing

The application of Dynamic Voltage Scaling (DVS) to reduce energy consumption may have a detrimental impact on the quality of manufacturing tests employed to detect permanent faults. This paper analyses the influence of different voltage/frequency settings on fault detection within a DVS application. In particular, the effect of supply voltage on different types of delay faults is considered. This paper presents a study of these problems with simulation results. We have demonstrated that the test application time increases as we reduce the test voltage. We have also shown that for newer technologies we do not have to go to very low voltage levels for delay fault testing. We conclude that it is necessary to test at more than one operating voltage and that the lowest operating voltage does not necessarily give the best fault cover

Memristor MOS Content Addressable Memory (MCAM): Hybrid Architecture for Future High Performance Search Engines

Large-capacity Content Addressable Memory (CAM) is a key element in a wide variety of applications. The inevitable complexities of scaling MOS transistors introduce a major challenge in the realization of such systems. Convergence of disparate technologies, which are compatible with CMOS processing, may allow extension of Moore's Law for a few more years. This paper provides a new approach towards the design and modeling of Memristor (Memory resistor) based Content Addressable Memory (MCAM) using a combination of memristor MOS devices to form the core of a memory/compare logic cell that forms the building block of the CAM architecture. The non-volatile characteristic and the nanoscale geometry together with compatibility of the memristor with CMOS processing technology increases the packing density, provides for new approaches towards power management through disabling CAM blocks without loss of stored data, reduces power dissipation, and has scope for speed improvement as the technology matures.Comment: 10 pages, 11 figure

X-SRAM: Enabling In-Memory Boolean Computations in CMOS Static Random Access Memories

Silicon-based Static Random Access Memories (SRAM) and digital Boolean logic have been the workhorse of the state-of-art computing platforms. Despite tremendous strides in scaling the ubiquitous metal-oxide-semiconductor transistor, the underlying \textit{von-Neumann} computing architecture has remained unchanged. The limited throughput and energy-efficiency of the state-of-art computing systems, to a large extent, results from the well-known \textit{von-Neumann bottleneck}. The energy and throughput inefficiency of the von-Neumann machines have been accentuated in recent times due to the present emphasis on data-intensive applications like artificial intelligence, machine learning \textit{etc}. A possible approach towards mitigating the overhead associated with the von-Neumann bottleneck is to enable \textit{in-memory} Boolean computations. In this manuscript, we present an augmented version of the conventional SRAM bit-cells, called \textit{the X-SRAM}, with the ability to perform in-memory, vector Boolean computations, in addition to the usual memory storage operations. We propose at least six different schemes for enabling in-memory vector computations including NAND, NOR, IMP (implication), XOR logic gates with respect to different bit-cell topologies $-$ the 8T cell and the 8$^+$T Differential cell. In addition, we also present a novel \textit{`read-compute-store'} scheme, wherein the computed Boolean function can be directly stored in the memory without the need of latching the data and carrying out a subsequent write operation. The feasibility of the proposed schemes has been verified using predictive transistor models and Monte-Carlo variation analysis.Comment: This article has been accepted in a future issue of IEEE Transactions on Circuits and Systems-I: Regular Paper

A VLSI single chip (255,223) Reed-Solomon encoder with interleaver

A single-chip implementation of a Reed-Solomon encoder with interleaving capability is described. The code used was adapted by the CCSDS (Consulative Committee on Space Data Systems). It forms the outer code of the NASA standard concatenated coding system which includes a convolutional inner code of rate 1/2 and constraint length 7. The architecture, leading to this single VLSI chip design, makes use of a bit-serial finite field multiplication algorithm due to E.R. Berlekamp

Characterization and Scaling of MOS Flip Flop Performance in Synchronizer Applications

The measured and calculated values of t he Flip Flop parameters needed to specify synchronizer reliability are presented for 3 different depletion-load, silicon gate, NMOS, R-S Flip Flop circuits with gate lengths ranging from 6μm to 4.2μm. Estimates of the probability of synchronizer failure to resolve within allowed or desired times can be determined from these parameters

Noise shaping Asynchronous SAR ADC based time to digital converter

Time-to-digital converters (TDCs) are key elements for the digitization of timing information in modern mixed-signal circuits such as digital PLLs, DLLs, ADCs, and on-chip jitter-monitoring circuits. Especially, high-resolution TDCs are increasingly employed in on-chip timing tests, such as jitter and clock skew measurements, as advanced fabrication technologies allow fine on-chip time resolutions. Its main purpose is to quantize the time interval of a pulse signal or the time interval between the rising edges of two clock signals. Similarly to ADCs, the performance of TDCs are also primarily characterized by Resolution, Sampling Rate, FOM, SNDR, Dynamic Range and DNL/INL. This work proposes and demonstrates 2nd order noise shaping Asynchronous SAR ADC based TDC architecture with highest resolution of 0.25 ps among current state of art designs with respect to post-layout simulation results. This circuit is a combination of low power/High Resolution 2nd Order Noise Shaped Asynchronous SAR ADC backend with simple Time to Amplitude converter (TAC) front-end and is implemented in 40nm CMOS technology. Additionally, special emphasis is given on the discussion on various current state of art TDC architectures.Electrical and Computer Engineerin