2,711 research outputs found

    Cost modelling and concurrent engineering for testable design

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    This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.As integrated circuits and printed circuit boards increase in complexity, testing becomes a major cost factor of the design and production of the complex devices. Testability has to be considered during the design of complex electronic systems, and automatic test systems have to be used in order to facilitate the test. This fact is now widely accepted in industry. Both design for testability and the usage of automatic test systems aim at reducing the cost of production testing or, sometimes, making it possible at all. Many design for testability methods and test systems are available which can be configured into a production test strategy, in order to achieve high quality of the final product. The designer has to select from the various options for creating a test strategy, by maximising the quality and minimising the total cost for the electronic system. This thesis presents a methodology for test strategy generation which is based on consideration of the economics during the life cycle of the electronic system. This methodology is a concurrent engineering approach which takes into account all effects of a test strategy on the electronic system during its life cycle by evaluating its related cost. This objective methodology is used in an original test strategy planning advisory system, which allows for test strategy planning for VLSI circuits as well as for digital electronic systems. The cost models which are used for evaluating the economics of test strategies are described in detail and the test strategy planning system is presented. A methodology for making decisions which are based on estimated costing data is presented. Results of using the cost models and the test strategy planning system for evaluating the economics of test strategies for selected industrial designs are presented

    RT-level fast fault simulator

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    In this paper a new fast fault simulation technique is presented for calculation of fault propagation through HLPs (High Level Primitives). ROTDDs (Reduced Ordered Ternary Decision Diagrams) are used to describe HLP modules. The technique is implemented in the HTDD RT-level fault simulator. The simulator is evaluated with some ITC99 benchmarks. A hypothesis is proved that a test set coverage of physical failures can be anticipated with high accuracy when RTL fault model takes into account optimization strategies that are used in CAE system applied

    A study of pseudorandom test for VLSI

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    Testing Missing At Random Using Instrumental Variables

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    This paper proposes a test for missing at random (MAR). The MAR assumption is shown to be testable given instrumental variables which are independent of response given potential outcomes. A nonparametric testing procedure based on integrated squared distance is proposed. The statistic's asymptotic distribution under the MAR hypothesis is derived. In particular, our results can be applied to testing missing completely at random (MCAR). A Monte Carlo study examines finite sample performance of our test statistic. An empirical illustration analyzes the nonresponse mechanism in labor income questions

    Smart cmos image sensor for 3d measurement

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    3D measurements are concerned with extracting visual information from the geometry of visible surfaces and interpreting the 3D coordinate data thus obtained, to detect or track the position or reconstruct the profile of an object, often in real time. These systems necessitate image sensors with high accuracy of position estimation and high frame rate of data processing for handling large volumes of data. A standard imager cannot address the requirements of fast image acquisition and processing, which are the two figures of merit for 3D measurements. Hence, dedicated VLSI imager architectures are indispensable for designing these high performance sensors. CMOS imaging technology provides potential to integrate image processing algorithms on the focal plane of the device, resulting in smart image sensors, capable of achieving better processing features in handling massive image data. The objective of this thesis is to present a new architecture of smart CMOS image sensor for real time 3D measurement using the sheet-beam projection methods based on active triangulation. Proposing the vision sensor as an ensemble of linear sensor arrays, all working in parallel and processing the entire image in slices, the complexity of the image-processing task shifts from O (N 2 ) to O (N). Inherent also in the design is the high level of parallelism to achieve massive parallel processing at high frame rate, required in 3D computation problems. This work demonstrates a prototype of the smart linear sensor incorporating full testability features to test and debug both at device and system levels. The salient features of this work are the asynchronous position to pulse stream conversion, multiple images binarization, high parallelism and modular architecture resulting in frame rate and sub-pixel resolution suitable for real time 3D measurements

    Power-constrained block-test list scheduling

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    A list scheduling approach is proposed in this paper to overcome the problem of unequal-length block-test scheduling under power dissipation constraints. An extended tree growing technique is also used in combination with the list scheduling algorithm in order to improve the test concurrency, having assigned power dissipation limits. Moreover, the algorithm features a power dissipation balancing provision. Test scheduling examples are discussed, highlighting further research steps towards an efficient system-level test scheduling algorith

    Testability and redundancy techniques for improved yield and reliability of CMOS VLSI circuits

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    The research presented in this thesis is concerned with the design of fault-tolerant integrated circuits as a contribution to the design of fault-tolerant systems. The economical manufacture of very large area ICs will necessitate the incorporation of fault-tolerance features which are routinely employed in current high density dynamic random access memories. Furthermore, the growing use of ICs in safety-critical applications and/or hostile environments in addition to the prospect of single-chip systems will mandate the use of fault-tolerance for improved reliability. A fault-tolerant IC must be able to detect and correct all possible faults that may affect its operation. The ability of a chip to detect its own faults is not only necessary for fault-tolerance, but it is also regarded as the ultimate solution to the problem of testing. Off-line periodic testing is selected for this research because it achieves better coverage of physical faults and it requires less extra hardware than on-line error detection techniques. Tests for CMOS stuck-open faults are shown to detect all other faults. Simple test sequence generation procedures for the detection of all faults are derived. The test sequences generated by these procedures produce a trivial output, thereby, greatly simplifying the task of test response analysis. A further advantage of the proposed test generation procedures is that they do not require the enumeration of faults. The implementation of built-in self-test is considered and it is shown that the hardware overhead is comparable to that associated with pseudo-random and pseudo-exhaustive techniques while achieving a much higher fault coverage through-the use of the proposed test generation procedures. The consideration of the problem of testing the test circuitry led to the conclusion that complete test coverage may be achieved if separate chips cooperate in testing each other's untested parts. An alternative approach towards complete test coverage would be to design the test circuitry so that it is as distributed as possible and so that it is tested as it performs its function. Fault correction relies on the provision of spare units and a means of reconfiguring the circuit so that the faulty units are discarded. This raises the question of what is the optimum size of a unit? A mathematical model, linking yield and reliability is therefore developed to answer such a question and also to study the effects of such parameters as the amount of redundancy, the size of the additional circuitry required for testing and reconfiguration, and the effect of periodic testing on reliability. The stringent requirement on the size of the reconfiguration logic is illustrated by the application of the model to a typical example. Another important result concerns the effect of periodic testing on reliability. It is shown that periodic off-line testing can achieve approximately the same level of reliability as on-line testing, even when the time between tests is many hundreds of hours
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