Monitoring of the primary drying of a lyophilization process in vials

An innovative and modular system (LyoMonitor) for monitoring the primary drying of a lyophilization process in vials is illustrated: it integrates some commercial devices (pressure gauges, moisture sensor and mass spectrometer), an innovative balance and a manometric temperature measurement system based on an improved algorithm (DPE) to estimate sublimating interface temperature and position, product temperature profile, heat and mass transfer coefficients. A soft-sensor using a multipoint wireless thermometer can also estimate the previous parameters in a large number of vials. The performances of the previous devices for the determination of the end of the primary drying are compared. Finally, all these sensors can be used for control purposes and for the optimization of the process recipe; the use of DPE in a control loop will be shown as an exampl

Carbon-based materials for humidity sensing: a short review

Humidity sensors are widespread in many industrial applications, ranging from environmental and meteorological monitoring, soil water content determination in agriculture, air conditioning systems, food quality monitoring, and medical equipment to many other fields. Thus, an accurate and reliable measurement of water content in dierent environments and materials is of paramount importance. Due to their rich surface chemistry and structure designability, carbon materials have become interesting in humidity sensing. In addition, they can be easily miniaturized and applied in flexible electronics. Therefore, this short review aims at providing a survey of recent research dealing with carbonaceous materials used as capacitive and resistive humidity sensors. This work collects some successful examples of devices based on carbon nanotubes, graphene, carbon black, carbon fibers, carbon soot, and more recently, biochar produced from agricultural wastes. The pros and cons of the dierent sensors are also discussed in the present review

Marine icing sensor array for measuring ice thickness

Marine Icing is the process of ice accumulation on ships and other offshore structures in cold regions that can create serious working conditions besides the adverse effects to the offshore operations efficiency. Monitoring of icing conditions together with a number of de-icing strategies is therefore important in decreasing the safety hazards and increase the working effectiveness. Detection of the ice accretion rate on the offshore structures is a challenge due to the harsh environment and the multiphase property of the ice. This thesis is focused on developing a low cost array sensor for the ice accretion detection applicable to the harsh marine environments. We utilized a stray-capacitance technique that encodes a layered multiphase icing accretion uniquely. Capacitive sensors are popular in diverse industrial settings due to their relative simplicity, robustness and low cost. The sensor transducers are compatible with the printed circuit board technology which made this research time effective. The thesis is based on three distinct publications, two journal papers (IEEE, MDPI) and one peer-reviewed conference paper (IEEE), each in a separate chapter. All publications include a theoretical background, simulations, and experimental validation. The underlying novel approach that is more or less shared in all applications is the use of linearly independent sensor array for unique multiphase ice detection. The first two papers utilize a different inter-electrode spacing array but a different signal conditioning algorithm. The third paper then uses an array of constant spacing but different dielectric layer height. As stated above, the main objective of this work is to measure the multiphase icing accretion which consists of water above ice, the real situation which has not been addressed to date. A number of different techniques have been developed over the last two decades mainly as a response to the rapidly expanding offshore oil&gas in northern regions, offshore wind power generation, or shipping across or fishing in arctic waters. This thesis outlines three methods that can be directly applied to these industries

Icing Effects on Power Lines and Anti-icing and De-icing Methods

Icing on power lines may lead to compromise safety and reliability of electric supply network. Prolong icing can lead to power breakdown and collapse of towers. Since power transmission lines are mostly overhead and could face the direct impact of icing, and it is one of the main challenges faced by power distribution companies in cold regions. When the ice accretion crosses the safety limit then deicing action can be carried out. We can find number of deicing methods that are used in different parts of the world. However, all of these deicing techniques have their own advantages and disadvantages on implementation. It is one of the most difficult as well as dangerous process to perform deicing on power lines. If a fault is detected and that has been occurred due to icing or during routine maintenance, extra care must be taken in order to ensure safety of the personals when performing de-icing of lines. However, as technology evolved, new ways and techniques are adopted with the help of sensors that give quick feedback to control room in the national grid via wireless communication network for real time action. In the thesis we have discussed atmospheric icing impacts on power lines in the cold regions across the world. A literature review has been done for anti-icing and deicing methods that are currently adopted in the power distribution network. Methods that are used against ice buildups have also been analyzed. This work also shows the impacts of icing and deicing techniques presently adopted, and also throws light on their pros and cons during maintenance operations. It provides an overview of the evolving technology trends that are practiced to ensure the availability of existing power transmission system in cold climate regions

Smart polymeric temperature sensors – for biological systems

The damaged brain is vulnerable to increase in brain temperature after a severe head injury. Continuous monitoring of intracranial temperature depicts functionality essential to the treatment of brain injury Many innovations have been made in the biomedical industry relying on electronic implants in treating condition such as traumatic brain injury (TBI) or other cerebral diseases. Hence, a methodical and reliable way to measure the temperature is crucial to assess the patient’s situation. In this investigation, an analysis of various approaches to detect the change in the temperature due to resistance, current-voltage characteristics with respect to time has been evaluated. Also, studies describing various materials used in sensors, their working principles and the results anticipated in these discrete procedures are presented. These smart temperature sensors have provided the accuracy and the stability compared to earlier methods used to detect the change in brain temperature since temperature is one of the most important variables in brain monitoring

A thin monocrystalline diaphragm pressure sensor using silicon-on-insulator technology.

The sensors market is huge and growing annually, of this a large sector is pressure sensors. With increasing demands on performance there remains a need for ultraminiature, high performance pressure sensors, particularly for medicai applications. To address this a novel capacitive pressure sensor consisting of an array of parallel connected diaphragms has been designed and fabricated from SIMOX substrates. The benefits of this include single crystal silicon diaphragms, small, well controlled dimensions, single sided processing and the opportunity for electronics integration. Theoretical modelling of this structure predicts a high sensitivity and low stress device with opportunities for scaling to suit alternative applications. A novel, process technology was developed to achieve the required structure with the inclusion of procedures to address the specific issues relating to the SIMOX material. The sensor was fully characterised and the results demonstrated high performance compared with similar reported devices. Alternative structures such as cantilevers, bridges and resonators were fabricated as a demonstrative tool to show the feasibility of this technology in a wider field of applications

Integrated Electronics for Wireless Imaging Microsystems with CMUT Arrays

Integration of transducer arrays with interface electronics in the form of single-chip CMUT-on-CMOS has emerged into the field of medical ultrasound imaging and is transforming this field. It has already been used in several commercial products such as handheld full-body imagers and it is being implemented by commercial and academic groups for Intravascular Ultrasound and Intracardiac Echocardiography. However, large attenuation of ultrasonic waves transmitted through the skull has prevented ultrasound imaging of the brain. This research is a prime step toward implantable wireless microsystems that use ultrasound to image the brain by bypassing the skull. These microsystems offer autonomous scanning (beam steering and focusing) of the brain and transferring data out of the brain for further processing and image reconstruction. The objective of the presented research is to develop building blocks of an integrated electronics architecture for CMUT based wireless ultrasound imaging systems while providing a fundamental study on interfacing CMUT arrays with their associated integrated electronics in terms of electrical power transfer and acoustic reflection which would potentially lead to more efficient and high-performance systems. A fully wireless architecture for ultrasound imaging is demonstrated for the first time. An on-chip programmable transmit (TX) beamformer enables phased array focusing and steering of ultrasound waves in the transmit mode while its on-chip bandpass noise shaping digitizer followed by an ultra-wideband (UWB) uplink transmitter minimizes the effect of path loss on the transmitted image data out of the brain. A single-chip application-specific integrated circuit (ASIC) is de- signed to realize the wireless architecture and interface with array elements, each of which includes a transceiver (TRX) front-end with a high-voltage (HV) pulser, a high-voltage T/R switch, and a low-noise amplifier (LNA). Novel design techniques are implemented in the system to enhance the performance of its building blocks. Apart from imaging capability, the implantable wireless microsystems can include a pressure sensing readout to measure intracranial pressure. To do so, a power-efficient readout for pressure sensing is presented. It uses pseudo-pseudo differential readout topology to cut down the static power consumption of the sensor for further power savings in wireless microsystems. In addition, the effect of matching and electrical termination on CMUT array elements is explored leading to new interface structures to improve bandwidth and sensitivity of CMUT arrays in different operation regions. Comprehensive analysis, modeling, and simulation methodologies are presented for further investigation.Ph.D

Theory and Practice of Shear/Stress Strain Gage Hygrometry

Mechanical hygrometry has progressed during the last several decades from crude hygroscopes to state-of-the art strain-gage sensors. The strain-gage devices vary from different metallic beams to strain-gage sensors using cellulose crystallite elements, held in full shear restraint. This old technique is still in use but several companies are now actively pursuing development of MEMS miniaturized humidity sensors. These new sensors use polyimide thin film for water vapor adsorption and desorption. This paper will provide overview about modern humidity sensors

Micromachined pressure sensors: Review and recent developments

Since the discovery of piezoresistivity in silicon in the mid 1950s, silicon-based pressure sensors have been widely produced. Micromachining technology has greatly benefited from the success of the integrated circuits industry, burrowing materials, processes, and toolsets. Because of this, microelectromechanical systems (MEMS) are now poised to capture large segments of existing sensor markets and to catalyze the development of new markets. Given the emerging importance of MEMS, it is instructive to review the history of micromachined pressure sensors, and to examine new developments in the field. Pressure sensors will be the focus of this paper, starting from metal diaphragm sensors with bonded silicon strain gauges, and moving to present developments of surface-micromachined, optical, resonant, and smart pressure sensors. Considerations for diaphragm design will be discussed in detail, as well as additional considerations for capacitive and piezoresistive devices