Hardware/Software Co-design for Multicore Architectures

Siirretty Doriast

Three Highly Parallel Computer Architectures and Their Suitability for Three Representative Artificial Intelligence Problems

Virtually all current Artificial Intelligence (AI) applications are designed to run on sequential (von Neumann) computer architectures. As a result, current systems do not scale up. As knowledge is added to these systems, a point is reached where their performance quickly degrades. The performance of a von Neumann machine is limited by the bandwidth between memory and processor (the von Neumann bottleneck). The bottleneck is avoided by distributing the processing power across the memory of the computer. In this scheme the memory becomes the processor (a smart memory ). This paper highlights the relationship between three representative AI application domains, namely knowledge representation, rule-based expert systems, and vision, and their parallel hardware realizations. Three machines, covering a wide range of fundamental properties of parallel processors, namely module granularity, concurrency control, and communication geometry, are reviewed: the Connection Machine (a fine-grained SIMD hypercube), DADO (a medium-grained MIMD/SIMD/MSIMD tree-machine), and the Butterfly (a coarse-grained MIMD Butterflyswitch machine)

Integrating dataflow and non-dataflow real-time application models on multi-core platforms

Ferry Jules. Facultés des sciences. Rapports sur les travaux personnels des professeurs. In: Bulletin administratif de l'instruction publique. Tome 24 n°465, 1881. pp. 529-531

Proceedings of AUTOMATA 2011 : 17th International Workshop on Cellular Automata and Discrete Complex Systems

International audienceThe proceedings contain full (reviewed) papers and short (non reviewed) papers that were presented at the workshop

Real-Time Wireless Sensor-Actuator Networks for Cyber-Physical Systems

A cyber-physical system (CPS) employs tight integration of, and coordination between computational, networking, and physical elements. Wireless sensor-actuator networks provide a new communication technology for a broad range of CPS applications such as process control, smart manufacturing, and data center management. Sensing and control in these systems need to meet stringent real-time performance requirements on communication latency in challenging environments. There have been limited results on real-time scheduling theory for wireless sensor-actuator networks. Real-time transmission scheduling and analysis for wireless sensor-actuator networks requires new methodologies to deal with unique characteristics of wireless communication. Furthermore, the performance of a wireless control involves intricate interactions between real-time communication and control. This thesis research tackles these challenges and make a series of contributions to the theory and system for wireless CPS. (1) We establish a new real-time scheduling theory for wireless sensor-actuator networks. (2) We develop a scheduling-control co-design approach for holistic optimization of control performance in a wireless control system. (3) We design and implement a wireless sensor-actuator network for CPS in data center power management. (4) We expand our research to develop scheduling algorithms and analyses for real-time parallel computing to support computation-intensive CPS

Design Space Exploration for MPSoC Architectures

Multiprocessor system-on-chip (MPSoC) designs utilize the available technology and communication architectures to meet the requirements of the upcoming applications. In MPSoC, the communication platform is both the key enabler, as well as the key differentiator for realizing efficient MPSoCs. It provides product differentiation to meet a diverse, multi-dimensional set of design constraints, including performance, power, energy, reconfigurability, scalability, cost, reliability and time-to-market. The communication resources of a single interconnection platform cannot be fully utilized by all kind of applications, such as the availability of higher communication bandwidth for computation but not data intensive applications is often unfeasible in the practical implementation. This thesis aims to perform the architecture-level design space exploration towards efficient and scalable resource utilization for MPSoC communication architecture. In order to meet the performance requirements within the design constraints, careful selection of MPSoC communication platform, resource aware partitioning and mapping of the application play important role. To enhance the utilization of communication resources, variety of techniques such as resource sharing, multicast to avoid re-transmission of identical data, and adaptive routing can be used. For implementation, these techniques should be customized according to the platform architecture. To address the resource utilization of MPSoC communication platforms, variety of architectures with different design parameters and performance levels, namely Segmented bus (SegBus), Network-on-Chip (NoC) and Three-Dimensional NoC (3D-NoC), are selected. Average packet latency and power consumption are the evaluation parameters for the proposed techniques. In conventional computing architectures, fault on a component makes the connected fault-free components inoperative. Resource sharing approach can utilize the fault-free components to retain the system performance by reducing the impact of faults. Design space exploration also guides to narrow down the selection of MPSoC architecture, which can meet the performance requirements with design constraints.Siirretty Doriast

Hardware-software codesign in a high-level synthesis environment

Interfacing hardware-oriented high-level synthesis to software development is a computationally hard problem for which no general solution exists. Under special conditions, the hardware-software codesign (system-level synthesis) problem may be analyzed with traditional tools and efficient heuristics. This dissertation introduces a new alternative to the currently used heuristic methods. The new approach combines the results of top-down hardware development with existing basic hardware units (bottom-up libraries) and compiler generation tools. The optimization goal is to maximize operating frequency or minimize cost with reasonable tradeoffs in other properties. The dissertation research provides a unified approach to hardware-software codesign. The improvements over previously existing design methodologies are presented in the frame-work of an academic CAD environment (PIPE). This CAD environment implements a sufficient subset of functions of commercial microelectronics CAD packages. The results may be generalized for other general-purpose algorithms or environments. Reference benchmarks are used to validate the new approach. Most of the well-known benchmarks are based on discrete-time numerical simulations, digital filtering applications, and cryptography (an emerging field in benchmarking). As there is a need for high-performance applications, an additional requirement for this dissertation is to investigate pipelined hardware-software systems\u27 performance and design methods. The results demonstrate that the quality of existing heuristics does not change in the enhanced, hardware-software environment

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

Proceedings of the Second International Workshop on Sustainable Ultrascale Computing Systems (NESUS 2015) Krakow, Poland

Proceedings of: Second International Workshop on Sustainable Ultrascale Computing Systems (NESUS 2015). Krakow (Poland), September 10-11, 2015