1,377 research outputs found

    Power supply ramping for quasi-static testing of PLLs

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    An innovative approach for testing PLLs in open loop-mode is presented. The operational method consists of ramping the PLL's power supply by means of a periodic sawtooth signal. The reference and feedback inputs of the PLL in open-loop mode are connected to the clock reference signal or to ground. Then, the corresponding quiescent current, clock output, and oscillator control voltage signatures are monitored and sampled at specific times. When the power supply is swept, all transistors are forced into various regions of operation causing the sensitivity of the faults to the specific stimulus to be magnified. The developed method of structural testing for PLLs yields high fault coverage results making it a potential and attractive technique for production wafer testing

    A DLL Based Test Solution for 3D ICs

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    Integrated circuits (ICs) are rapidly changing and vertical integration and packaging strategies have already become an important research topic. 2.5D and 3D IC integrations have obvious advantages over the conventional two dimensional IC implementations in performance, capacity, and power consumption. A passive Si interposer utilizing Through-Silicon via (TSV) technology is used for 2.5D IC integration. TSV is also the enabling technology for 3D IC integration. TSV manufacturing defects can affect the performance of stacked devices and reduce the yield. Manufacturing test methodologies for TSVs have to be developed to ensure fault-free devices. This thesis presents two test methods for TSVs in 2.5D and 3D ICs utilizing Delay-Locked Loop (DLL) modules. In the test method developed for TSVs in 2.5D ICs, a DLL is used to determine the propagation delay for fault detection. TSV faults in 3D ICs are detected through observation of the control voltage of a DLL. The proposed test methods present a robust performance against Process, supply Voltage and Temperature (PVT) variations due to the inherent feedback of DLLs. 3D full-wave simulations are performed to extract circuit level models for TSVs and fragments of an interposer wires using HFSS simulation tools. The extracted TSV models are then used to perform circuit level simulations using ADS tools from Agilent. Simulation results indicate that the proposed test solution for TSVs can detect manufacturing defects affecting the TSV propagation delay

    A built-in self-test technique for high speed analog-to-digital converters

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    Fundação para a Ciência e a Tecnologia (FCT) - PhD grant (SFRH/BD/62568/2009

    Phase Locking Authentication for Scan Architecture

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    Scan design is a widely used Design for Testability (DfT) approach for digital circuits. It provides a high level of controllability and observability resulting in a high fault coverage. To achieve a high level of testability, scan architecture must provide access to the internal nodes of the circuit-under-test (CUT). This access however leads to vulnerability in the security of the CUT. If an unrestricted access is provided through a scan architecture, unlimited test vectors can be applied to the CUT and its responses can be captured. Such an unrestricted access to the CUT can potentially undermine the security of the critical information stored in the CUT. There is a need to secure scan architecture to prevent hardware attacks however a secure solution may limit the CUT testability. There is a trade-off between security and testability, therefore, a secure scan architecture without hindering its controllability and observability is required. Three solutions to secure scan architecture have been proposed in this thesis. In the first method, the tester is authenticated and the number of authentication attempts has been limited. In the second method, a Phase Locked Loop (PLL) is utilized to secure scan architecture. In the third method, the scan architecture is secured through a clock and data recovery (CDR) technique. This is a manuscript based thesis and the results of this study have been published in two conference proceedings. The latest results have also been prepared as an article for submission to a high rank conference

    An embedded tester core for mixed-signal System-on-Chip circuits

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    Circuit paradigm in the 21

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    Embedded Sensors and Controls to Improve Component Performance and Reliability Conceptual Design Report

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    Mixed signal design flow, a mixed signal PLL case study

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    Mixed-signal designs are becoming more and more complex every day. In order to adapt to the new market requirements, a formal process for design and verification of mixed signal systems i. e. top-down design and bottom-up verification methodology is required. This methodology has already been established for digital design. The goal of this research is to propose a new design methodology for mixed signal systems. In the first two chapters of this thesis, the need for a mixed signal design flow based on top-down design methodology will be discussed. The proposed design flow is based on behavioral modeling of the mixed signal system using one of the mixed signal behavioral modeling languages. These models can be used for design and verification through different steps of the design from system level modeling to final physical design. The other advantage of the proposed flow is analog and digital co-design. In the remaining chapters of this thesis, the proposed design flow was verified by designing an 800 MHz mixed signal PLL. The PLL uses a charge pump phase frequency detector, a single capacitor loop filter, and a feed forward error correction architecture using an active damping control circuit instead of passive resistor in loop filter. The design was done in 0. 18- µ m CMOS process technology

    Space Station Systems Technology Study. Volume 2: Trade study and technology selection technical report

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    High leverage technologies are examined for application to the space station. The areas under investigation include attitude control, data management, long life thermal management, and automated housekeeping integration
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